MPXS3010VMM150 vs SPC5645SF1VVU 比較
詳細並排比較 MPXS3010VMM150 由 NXP Semiconductors 與 SPC5645SF1VVU 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPXS3010VMM150 - PXS30 Dual-Core 150MHz MCU, 1MB Flash, 257-LFBGA | NXP
MPXS3010VMM150 ✓ 啟用中NXP Semiconductors
SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP
SPC5645SF1VVU ✓ 啟用中規格比較
| 參數 | MPXS3010VMM150 | SPC5645SF1VVU |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Core Architecture | Power Architecture e200z7d (dual-core) | Power Architecture e200z4d (dual-core lockstep option) |
| Number of Cores | 2 | — |
| Core Bit Width | 32-bit | — |
| Maximum CPU Clock | 150 MHz | — |
| Program Memory (Flash) | 1 MB (1M x 8) | — |
| RAM Size | 256 KB (256K x 8) | — |
| Oscillator Type | External (per datasheet) | — |
| 封裝 / 外殼 | 257-LFBGA (14x14 mm) | 416-PBGA (27x27 mm, 1.0 mm pitch) |
| 安裝類型 | Surface Mount | Surface Mount |
| Terminal Form | BALL (BGA) | — |
| Number of Terminals | 257 | — |
| Package Code | LFBGA | — |
| Temperature Grade | INDUSTRIAL | — |
| Series | PXS30 | — |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| RoHS 狀態 | [DATA_NEEDED: rohs status] | Compliant |
| 資料匯流排寬度 | — | 32-bit |
| 最大時脈頻率 | — | 125 MHz |
| Program Memory Size | — | 2 MB Flash |
| Program Memory Type | — | Flash with ECC |
| SRAM Size | — | [DATA_NEEDED: SRAM size in KB] |
| 供應電壓 | — | 3.3 V / 5 V tolerant I/O |
| 工作溫度範圍 | — | -40 C to +105 C |
| AEC-Q100 Qualification | — | Yes (Automotive Grade) |
| Functional Safety | — | Targeting ASIL-D (dual-core lockstep) |
| CAN Controllers | — | Dual CAN 2.0B (FlexCAN) |
| FlexRay | — | Yes, dual-channel FlexRay module |
| Ethernet | — | [DATA_NEEDED: Ethernet MAC availability] |
| Graphics Accelerator | — | Yes, integrated GFXPU for TFT cluster |
| ADC | — | 12-bit ADC, multi-channel |
| Timers | — | eMIOS unified channels |
| Debug Interface | — | JTAG / Nexus 5001 (Level 3 trace) |
| Process Technology | — | 90 nm CMOS |
| JEDEC MSL | — | MSL3 (per PBGA JEDEC J-STD-020) |