NT5AD512M16 vs K4A8G165WB-BCTD 比較
詳細並排比較 NT5AD512M16 由 Nanya Technology 與 K4A8G165WB-BCTD 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Samsung Electronics
K4A8G165WB-BCTD - 8Gb DDR4 SDRAM 512Mx16 2666Mbps | Samsung
K4A8G165WB-BCTD ✓ 啟用中規格比較
| 參數 | NT5AD512M16 | K4A8G165WB-BCTD |
|---|---|---|
| 品牌 | Nanya Technology | Samsung Electronics |
| 類別 | Memory ICs | DRAM |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM |
| 組織 | 512M x 16 | 512M x 16 |
| Total Density | 8 Gbit | — |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| 資料速率 | 3200 Mbps (DDR4-3200) | 2666 Mbps |
| 封裝 | 96-ball FBGA | 96FBGA |
| Operating Temperature (Commercial) | 0°C to +95°C | — |
| Operating Temperature (Industrial) | -40°C to +95°C | — |
| Auto Self-Refresh | Yes | — |
| Built-in Temperature Sensor | Yes | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| Data Mask | Yes | Supported (DM per x16 lane) |
| Write Leveling | Yes | — |
| Dynamic On-Chip Termination | Yes | — |
| ZQ Calibration | Yes | Supported |
| CRC Function | Yes | — |
| RoHS | Compliant | — |
| Density | — | 8 Gb |
| 工作溫度 | — | 0C to +85C |
| Die Generation | — | B-die |
| 安裝類型 | — | Surface Mount (BGA) |
| 介面 | — | DDR4 (parallel, double data rate) |
| Dynamic On-Die Termination | — | Supported |
| CAS 延遲 | — | [DATA_NEEDED: CAS Latency] |
| Refresh Rate | — | [DATA_NEEDED: Refresh Rate] |
| RoHS 狀態 | — | Compliant (per JLCPCB listing: ROHS) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL Level] |