S9S12GN16F1VLC557 vs MC9S08QG84CFFE 比較

詳細並排比較 S9S12GN16F1VLC557 由 NXP Semiconductors 與 MC9S08QG84CFFE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
S9S12GN16F1VLC557 S9S12GN16F1VLC557 - 16KB Flash 16-bit HCS12 MCU | NXP

S9S12GN16F1VLC557 - 16KB Flash 16-bit HCS12 MCU | NXP

S9S12GN16F1VLC557 ✓ 啟用中
NXP Semiconductors
MC9S08QG84CFFE MC9S08QG84CFFE - 8KB Flash 8-bit MCU 20MHz QFN-16 | NXP

MC9S08QG84CFFE - 8KB Flash 8-bit MCU 20MHz QFN-16 | NXP

MC9S08QG84CFFE ✓ 啟用中

規格比較

參數 S9S12GN16F1VLC557 MC9S08QG84CFFE
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Core Architecture HCS12 (S12G family) —
資料匯流排寬度 16-bit —
Program Memory (Flash) 16 KB —
RAM 1 KB —
Maximum CPU Frequency 25 MHz —
Supply Voltage (VDD) 3.15 V to 5.5 V —
Communication Peripherals CAN 2.0 A/B (msCAN), SCI, SPI —
ADC 10-bit —
PWM Channels 8-bit —
Timers 16-bit —
工作溫度範圍 -40C to +125C (automotive) —
封裝 32-pin LQFP (7 mm x 7 mm) 16-QFN-EP (5x5 mm), Exposed Pad
安裝類型 Surface Mount Surface Mount
MSL 等級 [DATA_NEEDED: MSL moisture sensitivity level] —
RoHS 狀態 Compliant RoHS3 (per Mouser ROO listing)
Debug Interface BDM (Background Debug Mode) —
Core Processor — S08 (HCS08) 8-bit CISC
Core Size — 8-bit
Speed — 20 MHz
Flash Memory — 8 KB (8K x 8)
供應電壓 — 2.5 V / 3.3 V
Architecture — S08
Instruction Set — CISC
Peripherals — ADC, POR, PWM, WDT
RAM Size — [DATA_NEEDED: RAM size]
EEPROM Size — [DATA_NEEDED: EEPROM size]
Number of I/O — [DATA_NEEDED: number of I/O]
Data Converters — A/D 8x10-bit
工作溫度 — [DATA_NEEDED: operating temperature range]
Moisture Sensitivity — [DATA_NEEDED: MSL level]
Pin Pitch — 0.5 mm (QFN-16 class)

資料表與資源

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