XC6SLX25-2FG484I vs XC6SLX25-3FG484I 比較

詳細並排比較 XC6SLX25-2FG484I 由 AMD 與 XC6SLX25-3FG484I 由 AMD. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

AMD
XC6SLX25-3FG484I XC6SLX25-3FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD

XC6SLX25-3FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD

XC6SLX25-3FG484I ✓ 啟用中

規格比較

參數 XC6SLX25-2FG484I XC6SLX25-3FG484I
品牌 AMD AMD
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Unknown 啟用中
Device Type Spartan-6 LX FPGA Field Programmable Gate Array (FPGA)
Logic Cells 24,051 cells 24,051 cells
Number of I/O 266 I/O —
Technology 45 nm CMOS —
供應電壓 1.2 V —
封裝 484-pin FBGA —
Package Type 484-BBGA 484-BBGA
Package Dimensions 15 x 15 mm —
Package Pitch 0.80 mm —
Speed Grade -2 -3
工作溫度 0 C to 85 C 0°C to 85°C
Internal Frequency 500 MHz 500 MHz
Terminals 484 balls —
安裝類型 Surface Mount —
Lead-Free Status Contains Lead Lead-free package
RoHS 狀態 RoHS Non-Compliant [DATA_NEEDED: RoHS status]
輸出配置 Field Programmable Gate Array —
FPGA Family Spartan-6 LX Spartan-6 LX
Device Revision [DATA_NEEDED: device revision] —
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Slices [DATA_NEEDED: DSP slice count] —
I/O Count — 266 I/O
Process Technology — 45 nm CMOS
Package Pin Count — 484 pins
Package Body Size — 15 mm x 15 mm
Ball Pitch — 0.80 mm
Terminal Form — BGA balls
Core Supply Voltage — [DATA_NEEDED: core supply voltage]
Power Consumption — [DATA_NEEDED: typical and maximum power consumption]
REACH Status — [DATA_NEEDED: REACH status]

資料表與資源

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