XC6SLX25-2FG484I vs XC6SLX25-3FG484I 对比

详细并排对比 XC6SLX25-2FG484I 出自 AMD 和 XC6SLX25-3FG484I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

AMD
XC6SLX25-3FG484I XC6SLX25-3FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD

XC6SLX25-3FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD

XC6SLX25-3FG484I ✓ 量产中

规格对比

参数 XC6SLX25-2FG484I XC6SLX25-3FG484I
品牌 AMD AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Unknown 有效
Device Type Spartan-6 LX FPGA Field Programmable Gate Array (FPGA)
Logic Cells 24,051 cells 24,051 cells
Number of I/O 266 I/O —
Technology 45 nm CMOS —
电源电压 1.2 V —
封装 484-pin FBGA —
Package Type 484-BBGA 484-BBGA
Package Dimensions 15 x 15 mm —
Package Pitch 0.80 mm —
Speed Grade -2 -3
工作温度 0 C to 85 C 0°C to 85°C
Internal Frequency 500 MHz 500 MHz
Terminals 484 balls —
安装类型 Surface Mount —
Lead-Free Status Contains Lead Lead-free package
RoHS 状态 RoHS Non-Compliant [DATA_NEEDED: RoHS status]
输出配置 Field Programmable Gate Array —
FPGA Family Spartan-6 LX Spartan-6 LX
Device Revision [DATA_NEEDED: device revision] —
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Slices [DATA_NEEDED: DSP slice count] —
I/O Count — 266 I/O
Process Technology — 45 nm CMOS
Package Pin Count — 484 pins
Package Body Size — 15 mm x 15 mm
Ball Pitch — 0.80 mm
Terminal Form — BGA balls
Core Supply Voltage — [DATA_NEEDED: core supply voltage]
Power Consumption — [DATA_NEEDED: typical and maximum power consumption]
REACH Status — [DATA_NEEDED: REACH status]

数据手册与资源

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