10AX115N4F40E3LG - Arria 10 GX 1.15M LE FPGA, FCBGA-1517 | Intel
MPN: 10AX115N4F40E3LG ✓ 啟用中10AX115N4F40E3LG 概覽
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnects, embedded memory (BRAM/M20K), DSP slices, and hardened I/O and transceiver peripherals on a single die. Within the broader IC hierarchy, an FPGA sits at: FPGA -> programmable logic -> digital logic IC -> integrated circuit -> semiconductor. FPGAs are widely used as application-specific alternatives to ASICs where volume does not justify custom silicon, providing full hardware parallelism and reprogrammability that microcontrollers cannot match.
The 10AX115N4F40E3LG delivers key features including 24 transceivers at up to 14.1 Gbps, 384 18x19 multipliers in variable-precision DSP blocks, M20K (20 Kbit) embedded memory blocks for efficient on-chip buffering, and 12-core Hard Processor System (HPS) integration depending on the device variant family. The 1517-ball FCBGA package exposes 624 general-purpose I/O pins and 24 dedicated high-speed transceiver channels, while supporting 0.85 V core operation with 1.1 V auxiliary rails.
The architectural backbone combines Adaptive Logic Modules (ALMs) with a fine-grained routing fabric and hardened memory controller IP. The 20 nm process technology achieves the right balance of static and dynamic power for sustained compute workloads, while the variable-precision DSP supports both fixed and floating-point arithmetic natively, simplifying radio, video, and machine-learning inference pipelines.
Typical applications include 100G/400G networking line cards with integrated MAC and forward-error-correction acceleration, 4K/8K broadcast video processing pipelines using the on-chip DSP and transceivers, military radar and electronic-warfare baseband preprocessing, medical imaging backplanes (CT, MRI, ultrasound), and high-performance compute accelerator cards. The transceivers' 14.1 Gbps capability also enables PCIe Gen3 and 10G/40G Ethernet bridging.
When designing with the 10AX115N4F40E3LG, ensure a 12-layer PCB stack-up with continuous ground planes under the BGA to meet signal-integrity and JEDEC JESD51 thermal envelope. JTAG configuration via the Quartus Prime programmer is recommended for production programming. Long lead times (often 30-90 days) should be factored into inventory planning due to the specialized FCBGA package.
直接替換替代品,適用於 10AX115N4F40E3LG — 相同封裝,腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號: 10AX115N4F40E3LG (相同外形與佔位) — 差異在於 Package, DSP Blocks, Operating Temperature, Process Technology, Embedded Memory.
10AX115N3F40I2SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115N3F40E2LG
✅ 直接替換聯絡詢價
查看資料表 →10AX115N3F40E2SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115N2F40I2SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115N2F40E2LG
✅ 直接替換聯絡詢價
查看資料表 →10AX115N2F40E1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115N1F40E1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115N4F40E3LG 最大額定值與電氣特性
| Product Type | FPGA - Field Programmable Gate Array |
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 |
| Embedded Memory Bits | 68,857,856 (approx. 53 Mb) |
| M20K Memory Blocks | 2,738 |
| MLAB Memory (Kb) | 12,962 |
| DSP Blocks | 600 (variable-precision) |
| 18x19 Multipliers | 1,536 |
| Maximum User I/O | 624 |
| Transceivers | 24 (up to 14.1 Gbps) |
| Transceiver Data Rate | 1.0 to 14.1 Gbps |
| PCIe Hard IP | Up to Gen3 x8 |
| Process Technology | TSMC 20 nm |
| Core Voltage | 0.85 V / 0.9 V typical |
| 封裝 | 1517-BBGA, FCBGA (40 x 40 mm) |
| 工作溫度 | -40C to +100C (extended) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| Configuration Method | Serial / JTAG / Active Serial (AS) |
| Lead-Free | Yes |
10AX115N4F40E3LG 1517-bbga, fcbga (40 x 40 mm) 腳位配置指南
10AX115N4F40E3LG(1517-bbga, fcbga (40 x 40 mm) 封裝)的腳位配置。 此數位 IC 包含 GPIO、通訊介面(UART、SPI、I2C)與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料: 10AX115N4F40E3LG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AX115N4F40E3LG 適用於 6 應用s: 100G/400G Ethernet Networking Line Cards, 4K/8K Broadcast Video Processing, Military Radar and Electronic Warfare Baseband, Medical Imaging Acceleration (CT/MRI/Ultrasound), High-Performance Compute (HPC) Accelerator Cards, 5G Remote Radio Unit (RRU) Baseband.
100G/400G Ethernet Networking Line Cards
The 10AX115N4F40E3LG's 24 transceivers at 14.1 Gbps and 1,150,000 logic elements make it ideal for 100G and 400G Ethernet line-card MAC and forward-error-correction (FEC) implementations. The device handles RS-FEC and KR4/KP4 FEC directly in hardened IP, offloading the soft logic and enabling wire-speed 100G throughput on a single FPGA. Its 600 DSP blocks accelerate Reed-Solomon encoding/decoding and packet processing pipelines, while the PCIe Gen3 hard IP interfaces to host CPUs without external PHY silicon.
推薦
4K/8K Broadcast Video Processing
The 10AX115N4F40E3LG integrates 600 variable-precision DSP blocks supporting fixed and floating-point arithmetic, ideal for 4K/8K HEVC and AVC video encode/decode pipelines, frame-rate conversion, and color-space transformation. Its 1,150,000 logic elements provide ample LUTs for multi-stream IP routing matrices in broadcast routers, while the 24 transceivers at 14.1 Gbps deliver uncompressed SDI video (12G-SDI quad-link) at 60 fps. M20K memory blocks enable 8K frame buffering without external DDR.
推薦
Military Radar and Electronic Warfare Baseband
The 10AX115N4F40E3LG's 1.15M logic elements, 600 DSP blocks, and 24 high-speed transceivers suit military radar baseband processing, electronic countermeasures, and digital-RF beamforming. Its variable-precision DSP implements FFT/iFFT, channelization, and pulse-Doppler processing in hardware, achieving GFLOPs-scale throughput per device. The 20 nm process and -40C to +100C industrial-grade temperature range, combined with the FCBGA package's mechanical robustness, meet ruggedized defense-program thermal envelopes and shock/vibration requirements.
推薦
Medical Imaging Acceleration (CT/MRI/Ultrasound)
The 10AX115N4F40E3LG is well-suited to medical imaging backplanes including CT, MRI, and ultrasound beamforming, where 1.15M logic elements implement parallel image reconstruction (e.g., filtered back-projection) and 600 DSP blocks accelerate real-time beam steering. Its 24 transceivers at 14.1 Gbps deliver high-bandwidth sensor data from detector arrays, while M20K memory blocks buffer intermediate voxel data. The 0.85 V/0.9 V core operation minimizes thermal output critical for compact medical device enclosures.
推薦
High-Performance Compute (HPC) Accelerator Cards
The 10AX115N4F40E3LG's variable-precision DSP supports both fixed and floating-point arithmetic, making it suitable for HPC accelerator cards in financial monte-carlo, genomic sequencing, and machine-learning inference workloads. The 1,150,000 logic elements implement custom SIMD pipelines and tensor cores in FPGA fabric, while the 24 transceivers at 14.1 Gbps deliver multi-host PCIe Gen3 connectivity. Combined with OpenCL and oneAPI high-level synthesis tooling, the device delivers competitive performance-per-watt versus discrete GPU accelerators.
推薦
5G Remote Radio Unit (RRU) Baseband
The 10AX115N4F40E3LG's 24 transceivers at 14.1 Gbps support 5G NR CPRI/eCPRI fronthal interfaces between baseband units and remote radio heads, while its 1.15M logic elements implement Layer-1 baseband processing including LDPC/Polar encoding/decoding, FFT/iFFT, and digital predistortion (DPD). The 600 DSP blocks accelerate DPD feedback loops critical for PA linearization in 4G/5G mMIMO and massive-MIMO antenna systems, reducing PA power consumption by 20-40% in field deployments.
推薦
推薦產品摘要
工程參考資料,適用於 10AX115N4F40E3LG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AX115N3F40I2SG | 10AX115N3F40E2LG | 10AX115N2F40E2LG | 10AX115N1F40E1SG |
|---|---|---|---|---|---|
| Package | FCBGA-1517 (40 x 40 mm) | FCBGA-1517 (40 x 40 mm) - same | FCBGA-1517 (40 x 40 mm) - same | FCBGA-1517 (40 x 40 mm) - same | FCBGA-1517 (40 x 40 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | -3 (fastest) | -2 | -2 | -2 | -1 (slowest, lowest power) |
| Temperature Grade | Extended (-40C to +100C) | Industrial (-40C to +100C) | Extended (-40C to +100C) | Extended (-40C to +100C) | Extended (-40C to +100C) |
| DSP Blocks | 600 | 600 | 600 | 600 | 600 |
| Transceivers | 24 (up to 14.1 Gbps) | 24 (up to 14.1 Gbps) | 24 (up to 14.1 Gbps) | 24 (up to 14.1 Gbps) | 24 (up to 14.1 Gbps) |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| Process Technology | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm |
| Approx Unit Price (USD) | 8500 | 7800 | 7800 | 7200 | 6500 |
主要差異化特點
- Highest-density Arria 10 GX variant at F40 footprint (對比10AX090N4F45I3LG)
- Speed grade -3 offers fastest Fmax timing closure (對比10AX115N1F40E1SG)
- Hardened PCIe Gen3 IP eliminates external PHY (對比Generic FPGA requiring soft PCIe)
設計說明
The 1517-ball FCBGA package requires a 12-layer or thicker PCB stack-up with continuous ground planes directly under the BGA to meet signal-integrity and JEDEC JESD51 thermal envelope. Use 1 mm ball pitch escape routing with via-in-pad or microvia HDI construction; standard 0.8 mm vias on 1.27 mm pitch will not escape. Reference Intel's Arria 10 board design guidelines for breakout, decoupling, and power-plane recommendations.
Estimated: at full utilization (1.15M LEs + 24 transceivers + 600 DSP blocks) the device can dissipate 25-35 W. The FCBGA package requires a high-performance thermal interface material (TIM) and a heat-sink with at least 1500 cm^3/min airflow to maintain Tj under 100C. Estimated theta_JA with heat sink and 200 LFM airflow is approximately 0.5 C/W - verify with vendor thermal models before final mechanical design.
The 10AX115N4F40E3LG requires at least 6 separate power rails: 0.85 V core, 0.9 V core (auxiliary), 1.1 V auxiliary, 1.5 V transceiver, 1.8 V I/O, and 3.3 V HPS. Use a dedicated PMIC such as the EM21XX or LTM4677 with bulk capacitors rated at 220 uF minimum per rail, plus 0.1 uF and 0.01 uF decoupling within 5 mm of each pin group. Power-on reset sequencing per Intel's power management guide is mandatory to prevent latch-up.
Do not assume the -3 speed grade is always the best choice - while fastest, it also has the highest dynamic power. Choose -2 or -1 speed grade if timing closure allows. Also note: bitstream compatibility across speed grades is NOT guaranteed; you may need to re-compile the Quartus Prime design when changing -3 to -2/-1. Always run the TimeQuest timing report before committing to a production speed grade.
The 24 transceivers at 14.1 Gbps require controlled-impedance routing (100 ohm differential, 85 ohm common-mode) with skew less than 1 ps/mm between P/N pairs. Reference Intel's Arria 10 transceiver signal integrity guidelines for via stub length, AC-coupling capacitor selection, and S-parameter models. Pre-emphasis and equalization settings must be tuned per board via the Quartus Prime Transceiver Toolkit.
合規資訊
RoHS and REACH compliant per Intel Arria 10 product page. AEC-Q100 not applicable - this is a programmable logic IC, not an automotive-qualified ASIC. Halogen-free and conflict-minerals-compliant per Intel's product content disclosure.