10AX115N4F40E3LG - Arria 10 GX 1.15M LE FPGA, FCBGA-1517 | Intel
MPN: 10AX115N4F40E3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8500 | $8,500.00 |
| 10 | $7800 | $78,000.00 |
| 100 | $7150 | $715,000.00 |
| 500 | $6650 | $3,325,000.00 |
| 1,000 | $6200 | $6,200,000.00 |
Drop-in alternatives for 10AX115N4F40E3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10AX115N4F40E3LG Maximum Ratings & Electrical Characteristics
| Product Type | FPGA - Field Programmable Gate Array |
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 |
| Embedded Memory Bits | 68,857,856 (approx. 53 Mb) |
| M20K Memory Blocks | 2,738 |
| MLAB Memory (Kb) | 12,962 |
| DSP Blocks | 600 (variable-precision) |
| 18x19 Multipliers | 1,536 |
| Maximum User I/O | 624 |
| Transceivers | 24 (up to 14.1 Gbps) |
| Transceiver Data Rate | 1.0 to 14.1 Gbps |
| PCIe Hard IP | Up to Gen3 x8 |
| Process Technology | TSMC 20 nm |
| Core Voltage | 0.85 V / 0.9 V typical |
| Package | 1517-BBGA, FCBGA (40 x 40 mm) |
| Operating Temperature | -40C to +100C (extended) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Configuration Method | Serial / JTAG / Active Serial (AS) |
| Lead-Free | Yes |
10AX115N4F40E3LG 1517-bbga, fcbga (40 x 40 mm) Pin Configuration Guide
Complete pinout information for 10AX115N4F40E3LG (1517-bbga, fcbga (40 x 40 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115N4F40E3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115N4F40E3LG is suitable for 6 applications: 100G/400G Ethernet Networking Line Cards, 4K/8K Broadcast Video Processing, Military Radar and Electronic Warfare Baseband, Medical Imaging Acceleration (CT/MRI/Ultrasound), High-Performance Compute (HPC) Accelerator Cards, 5G Remote Radio Unit (RRU) Baseband.
100G/400G Ethernet Networking Line Cards
The 10AX115N4F40E3LG's 24 transceivers at 14.1 Gbps and 1,150,000 logic elements make it ideal for 100G and 400G Ethernet line-card MAC and forward-error-correction (FEC) implementations. The device handles RS-FEC and KR4/KP4 FEC directly in hardened IP, offloading the soft logic and enabling wire-speed 100G throughput on a single FPGA. Its 600 DSP blocks accelerate Reed-Solomon encoding/decoding and packet processing pipelines, while the PCIe Gen3 hard IP interfaces to host CPUs without external PHY silicon.
Recommended
4K/8K Broadcast Video Processing
The 10AX115N4F40E3LG integrates 600 variable-precision DSP blocks supporting fixed and floating-point arithmetic, ideal for 4K/8K HEVC and AVC video encode/decode pipelines, frame-rate conversion, and color-space transformation. Its 1,150,000 logic elements provide ample LUTs for multi-stream IP routing matrices in broadcast routers, while the 24 transceivers at 14.1 Gbps deliver uncompressed SDI video (12G-SDI quad-link) at 60 fps. M20K memory blocks enable 8K frame buffering without external DDR.
Recommended
Military Radar and Electronic Warfare Baseband
The 10AX115N4F40E3LG's 1.15M logic elements, 600 DSP blocks, and 24 high-speed transceivers suit military radar baseband processing, electronic countermeasures, and digital-RF beamforming. Its variable-precision DSP implements FFT/iFFT, channelization, and pulse-Doppler processing in hardware, achieving GFLOPs-scale throughput per device. The 20 nm process and -40C to +100C industrial-grade temperature range, combined with the FCBGA package's mechanical robustness, meet ruggedized defense-program thermal envelopes and shock/vibration requirements.
Recommended
Medical Imaging Acceleration (CT/MRI/Ultrasound)
The 10AX115N4F40E3LG is well-suited to medical imaging backplanes including CT, MRI, and ultrasound beamforming, where 1.15M logic elements implement parallel image reconstruction (e.g., filtered back-projection) and 600 DSP blocks accelerate real-time beam steering. Its 24 transceivers at 14.1 Gbps deliver high-bandwidth sensor data from detector arrays, while M20K memory blocks buffer intermediate voxel data. The 0.85 V/0.9 V core operation minimizes thermal output critical for compact medical device enclosures.
Recommended
High-Performance Compute (HPC) Accelerator Cards
The 10AX115N4F40E3LG's variable-precision DSP supports both fixed and floating-point arithmetic, making it suitable for HPC accelerator cards in financial monte-carlo, genomic sequencing, and machine-learning inference workloads. The 1,150,000 logic elements implement custom SIMD pipelines and tensor cores in FPGA fabric, while the 24 transceivers at 14.1 Gbps deliver multi-host PCIe Gen3 connectivity. Combined with OpenCL and oneAPI high-level synthesis tooling, the device delivers competitive performance-per-watt versus discrete GPU accelerators.
Recommended
5G Remote Radio Unit (RRU) Baseband
The 10AX115N4F40E3LG's 24 transceivers at 14.1 Gbps support 5G NR CPRI/eCPRI fronthal interfaces between baseband units and remote radio heads, while its 1.15M logic elements implement Layer-1 baseband processing including LDPC/Polar encoding/decoding, FFT/iFFT, and digital predistortion (DPD). The 600 DSP blocks accelerate DPD feedback loops critical for PA linearization in 4G/5G mMIMO and massive-MIMO antenna systems, reducing PA power consumption by 20-40% in field deployments.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115N4F40E3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115N3F40I2SG | 10AX115N3F40E2LG | 10AX115N2F40E2LG | 10AX115N1F40E1SG |
|---|---|---|---|---|---|
| Package | FCBGA-1517 (40 x 40 mm) | FCBGA-1517 (40 x 40 mm) - same | FCBGA-1517 (40 x 40 mm) - same | FCBGA-1517 (40 x 40 mm) - same | FCBGA-1517 (40 x 40 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | -3 (fastest) | -2 | -2 | -2 | -1 (slowest, lowest power) |
| Temperature Grade | Extended (-40C to +100C) | Industrial (-40C to +100C) | Extended (-40C to +100C) | Extended (-40C to +100C) | Extended (-40C to +100C) |
| DSP Blocks | 600 | 600 | 600 | 600 | 600 |
| Transceivers | 24 (up to 14.1 Gbps) | 24 (up to 14.1 Gbps) | 24 (up to 14.1 Gbps) | 24 (up to 14.1 Gbps) | 24 (up to 14.1 Gbps) |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| Process Technology | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm |
| Approx Unit Price (USD) | 8500 | 7800 | 7800 | 7200 | 6500 |
Key Differentiators
- Highest-density Arria 10 GX variant at F40 footprint (vs 10AX090N4F45I3LG)
- Speed grade -3 offers fastest Fmax timing closure (vs 10AX115N1F40E1SG)
- Hardened PCIe Gen3 IP eliminates external PHY (vs Generic FPGA requiring soft PCIe)
Design Notes
The 1517-ball FCBGA package requires a 12-layer or thicker PCB stack-up with continuous ground planes directly under the BGA to meet signal-integrity and JEDEC JESD51 thermal envelope. Use 1 mm ball pitch escape routing with via-in-pad or microvia HDI construction; standard 0.8 mm vias on 1.27 mm pitch will not escape. Reference Intel's Arria 10 board design guidelines for breakout, decoupling, and power-plane recommendations.
Estimated: at full utilization (1.15M LEs + 24 transceivers + 600 DSP blocks) the device can dissipate 25-35 W. The FCBGA package requires a high-performance thermal interface material (TIM) and a heat-sink with at least 1500 cm^3/min airflow to maintain Tj under 100C. Estimated theta_JA with heat sink and 200 LFM airflow is approximately 0.5 C/W - verify with vendor thermal models before final mechanical design.
The 10AX115N4F40E3LG requires at least 6 separate power rails: 0.85 V core, 0.9 V core (auxiliary), 1.1 V auxiliary, 1.5 V transceiver, 1.8 V I/O, and 3.3 V HPS. Use a dedicated PMIC such as the EM21XX or LTM4677 with bulk capacitors rated at 220 uF minimum per rail, plus 0.1 uF and 0.01 uF decoupling within 5 mm of each pin group. Power-on reset sequencing per Intel's power management guide is mandatory to prevent latch-up.
Do not assume the -3 speed grade is always the best choice - while fastest, it also has the highest dynamic power. Choose -2 or -1 speed grade if timing closure allows. Also note: bitstream compatibility across speed grades is NOT guaranteed; you may need to re-compile the Quartus Prime design when changing -3 to -2/-1. Always run the TimeQuest timing report before committing to a production speed grade.
The 24 transceivers at 14.1 Gbps require controlled-impedance routing (100 ohm differential, 85 ohm common-mode) with skew less than 1 ps/mm between P/N pairs. Reference Intel's Arria 10 transceiver signal integrity guidelines for via stub length, AC-coupling capacitor selection, and S-parameter models. Pre-emphasis and equalization settings must be tuned per board via the Quartus Prime Transceiver Toolkit.
Compliance Information
RoHS and REACH compliant per Intel Arria 10 product page. AEC-Q100 not applicable - this is a programmable logic IC, not an automotive-qualified ASIC. Halogen-free and conflict-minerals-compliant per Intel's product content disclosure.
