10CL016YF484I7G - Cyclone 10 LP FPGA 15K LE FBGA-484 | Intel
MPN： 10CL016YF484I7G ✓ 啟用中10CL016YF484I7G 概覽
A Cyclone 10 LP FPGA is a SRAM-based programmable logic device that combines a look-up-table (LUT)-based logic fabric with embedded memory blocks, DSP blocks, and high-speed I/O. Within the broader Intel FPGA hierarchy, Cyclone 10 LP sits below Cyclone V and MAX series for low-power, low-cost designs, and above small CPLDs such as MAX II/V. As a programmable logic device, it belongs to the category of digital ICs used in place of discrete glue logic or custom ASICs.
Key features include 56 embedded 18x18 multipliers, 4 phase-locked loops (PLLs), and support for DDR3, DDR3L, LPDDR2, and LPDDR external memory interfaces. The device operates from a 1.0 V core with separate bank I/O voltages down to 1.2 V and up to 3.3 V, allowing direct interfacing to legacy 3.3 V logic. Configuration is via standard JTAG or serial flash.
The Cyclone 10 LP architecture emphasizes low static and dynamic power consumption. It supports partial reconfiguration, design security bit-stream encryption (AES), and the Quartus Prime Lite design flow, making it well suited to industrial control, video bridging, motor control, and protocol bridging designs.
Typical applications include industrial machine vision, factory automation I/O expansion, video format conversion, motor drive peripherals, and low-cost software-defined radio front-ends. The combination of 56 hardware multipliers and 4 PLLs enables moderate DSP workloads without external DSP chips.
When designing with this FPGA, use the Quartus Prime Lite toolchain and plan I/O bank assignments carefully so that mixed-voltage rails are assigned to different I/O banks. The 484-ball FBGA package requires a 1.0 mm ball pitch PCB with microvia stack-ups.
This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes not found on a single manufacturer or distributor page.
直接替換替代品，適用於 10CL016YF484I7G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10CL016YF484I7G （相同外形與佔位） — 差異在於 Speed Grade, Package, Core Voltage, Mounting Type, Configuration Modes.
10CL016YF484C8G
✅ 直接替換聯絡詢價
查看資料表 →10CL016YF484C6G
✅ 直接替換聯絡詢價
查看資料表 →10CL016YF484I7G
✅ 直接替換聯絡詢價
查看資料表 →10CL016YF484C7G
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
10CL016YF484I7G 最大額定值與電氣特性
| Family | Cyclone 10 LP |
| Logic Elements | 15,408 |
| Embedded Memory | 516,096 bits |
| User I/O Pins | 340 |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Node | TSMC 60 nm low-power |
| Core Voltage | 1.0 V (typical) |
| I/O Voltage Range | 1.2 V to 3.3 V (per bank) |
| 封裝 | 484-ball FBGA, 1.0 mm pitch |
| Configuration | JTAG or serial flash (AES encryption supported) |
| 工作溫度 | -40C to +100C (Industrial) |
| Speed Grade | I7 |
| RoHS 狀態 | Compliant |
| 安裝類型 | Surface Mount |
10CL016YF484I7G 484-ball fbga, 1.0 mm pitch 腳位配置指南
10CL016YF484I7G（484-ball fbga, 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10CL016YF484I7G.
請參閱 資料表 以查看完整腳位配置。
典型應用
10CL016YF484I7G 適用於 6 應用s: Industrial Machine Vision, Video Format Conversion and Bridging, Motor Drive Peripherals, Factory Automation I/O Expansion, Software-Defined Radio Front-End, Low-Cost Embedded Computing Platform.
Industrial Machine Vision
The 10CL016YF484I7G fits industrial machine vision pipelines because it offers 56 hardware 18x18 multipliers for real-time image preprocessing and 4 PLLs for pixel-clock generation. Its 340 user I/O pins support multi-camera sensor aggregation through parallel LVDS or sub-LVDS lanes, while the -40C to +100C industrial temperature grade allows deployment near motors and lighting fixtures without thermal screening. The 1.0 V core and 1.2-3.3 V I/O banks interface directly to CMOS image sensors without level translators. Quartus Prime Lite support keeps development tooling costs low for factory OEMs. Compared to DSP + ASSP solutions, this FPGA provides upgradeable image processing algorithms in the field.
推薦
Video Format Conversion and Bridging
The 10CL016YF484I7G is well suited for video format conversion between HDMI, MIPI, parallel CMOS, and LVDS interfaces because of its 340 I/O pins and high-speed LVDS capability on every bank. The 516 Kbits of embedded memory buffer active video lines without external SDRAM in single-stream designs, and the 56 DSP blocks perform real-time scaling and color-space conversion. Designers can implement multiple video pipelines concurrently using the 15,408 logic elements, with 4 PLLs providing independent pixel clocks for input and output. The FBGA-484 footprint suits mid-size video processing boards.
推薦
Motor Drive Peripherals
The 10CL016YF484I7G serves motor drive peripheral roles such as encoder decoding, commutation logic, and isolated communication bridges. Its 56 hardware multipliers accelerate field-oriented control (FOC) observers and current-loop calculations, while the 4 PLLs generate the high-resolution PWM clocks required by modern IGBT gate drivers. Industrial temperature rating and 1.0 V core power support embedded mounting inside inverter cabinets. The 20 global clock networks distribute multi-axis timing precisely, and the FBGA-484 footprint fits standard 4-layer motor control PCBs.
推薦
Factory Automation I/O Expansion
The 10CL016YF484I7G expands PLC and industrial PC systems by providing hundreds of customizable digital I/O lines, real-time fieldbus protocol handling (EtherCAT, Profinet, Modbus), and machine-safety logic. The 340 user I/O pins aggregate multiple fieldbus segments and discrete sensors, while the 56 multipliers accelerate CRC and protocol-stack computations. Industrial temperature grade and AES-encrypted bitstreams support factory-floor reliability and IP protection. Quartus Prime Lite enables PLC OEMs to deliver custom I/O configurations without per-seat toolchain costs.
推薦
Software-Defined Radio Front-End
The 10CL016YF484I7G can implement SDR front-end stages such as digital up/down-conversion, channelization, and baseband preprocessing. Its 56 DSP blocks provide sufficient throughput for narrow-band signals below 50 MHz, and 4 PLLs synthesize the required sampling clocks with low jitter. The 340 I/O pins accept parallel ADC data from high-speed converters while the 1.0 V core keeps dynamic power below 1.5 W for portable SDR enclosures. AES bitstream encryption protects proprietary waveform IP.
推薦
Low-Cost Embedded Computing Platform
The 10CL016YF484I7G functions as a soft-processor host (NIOS II or RISC-V cores) for low-cost embedded computing. Its 15,408 logic elements fit a 32-bit RISC-V core plus peripheral IP, while 516 Kbits of on-chip memory serves as tightly-coupled scratchpad storage. 340 I/O pins expose the soft processor to external memories, sensors, and communication peripherals. Industrial temperature grade and AES bitstream security suit edge-computing nodes deployed in harsh environments. Quartus Prime Lite and free RISC-V toolchains keep total BOM and tooling costs minimal.
推薦
推薦產品摘要
工程參考資料，適用於 10CL016YF484I7G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10CL016YF484C8G | 10CL016YF484C6G | 10CL016YF484C7G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | FBGA-484 (1.0 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Logic Elements | 15,408 | 15,408 - same | 15,408 - same | 15,408 - same |
| Embedded Memory (bits) | 516,096 | 516,096 - same | 516,096 - same | 516,096 - same |
| 18x18 Multipliers | 56 | 56 - same | 56 - same | 56 - same |
| PLLs | 4 | 4 - same | 4 - same | 4 - same |
| User I/O | 340 | 340 - same | 340 - same | 340 - same |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Speed Grade | I7 | C8 (slower) | C6 (slowest) | C7 |
主要差異化特點
- Industrial temperature grade with fastest speed bin (對比10CL016YF484C8G)
- Maximum Fmax within 10CL016 family (對比10CL016YF484C6G)
- Same die across commercial and industrial SKUs (對比10CL016YF484C8G)
設計說明
The 484-ball FBGA package uses 1.0 mm ball pitch. PCB design requires microvia (laser-drilled) stack-ups with at least a 4-2-4 or 6-layer HDI construction to fan out the BGA signals. Use a 0.5 mm via pad with 0.2 mm drill for inner-layer escape. Per Intel Cyclone 10 LP hardware design guidelines, decouple each VCC and VCCIO pin with a 0.1 uF X7R ceramic placed within 100 mils of the ball to minimize PDN inductance for the 1.0 V core.
Estimated: at 100% logic utilization with default toggle rate, the 10CL016YF484I7G dissipates approximately 1.2 W from the 1.0 V core. The FBGA-484 theta_JA is roughly 15 C/W on a 4-layer JEDEC test board with adequate thermal vias under the central ball grid. For enclosed industrial cabinets, derate ambient to +85C max and add a center thermal pad with 25 thermal vias tied to internal ground planes to keep junction temperature below +100C.
Do not mix 3.3 V and 1.2 V I/O standards on the same I/O bank of the 10CL016YF484I7G - each bank shares one VCCIO rail. Plan bank assignments in Quartus Pin Planner before PCB layout. Also, JTAG and serial flash configuration modes use different dedicated pins; populating both interfaces requires careful shared-pin management. Finally, enable AES-encrypted bitstream mode if your design IP is sensitive, since unencrypted SRAM FPGAs expose netlist data on every power-up.
Per Intel hardware guidelines, place the 50 MHz configuration clock oscillator within 1 inch of the nCONFIG/nSTATUS pins and use a 33 ohm series termination if the trace exceeds 2 inches. Separate PLL analog supply pins (VCC_PLL) require their own ferrite-bead-isolated 1.0 V LDO output with 1 uF + 0.1 uF decoupling. Route all four PLL feedback paths as short, guard-banded differential traces to minimize jitter.
合規資訊
RoHS and REACH compliance per Altera/Intel product declaration. Not AEC-Q100 qualified - this is a commercial/industrial part. For automotive safety applications, contact Intel about AEC-Q100 Cyclone 10 LP variants.
