10CX220YF780I6G - Cyclone 10 GX 220K LE FPGA, 780-FCBGA | Intel
MPN： 10CX220YF780I6G ✓ 啟用中10CX220YF780I6G 概覽
A field-programmable gate array (FPGA) is a programmable logic device whose logic, routing and I/O are defined by configuration bitstream rather than hard-wired silicon. The Cyclone 10 GX family sits inside Intel's broader FPGA hierarchy: programmable logic device -> FPGA -> SRAM-based FPGA -> Cyclone series -> Cyclone 10 GX. Compared with ASICs, FPGAs give instant prototyping and field-upgrade flexibility; compared with low-cost CPLDs, they offer far higher logic density, embedded transceivers and DSP blocks for parallel arithmetic workloads.
Key features include up to 12 transceivers at 12.5 Gbps supporting PCIe Gen2 x4 hard IP, 6x 6.144 Gbps CPRI for wireless fronthaul, and 4 memory controllers with ECC. Logic resources scale to 220K logic elements and 156 DSP blocks for fixed- and floating-point compute. Industrial-grade temperature range (-40C to +100C) and lead-free/RoHS-compliant packaging suit embedded, broadcast and industrial imaging designs.
The Cyclone 10 GX architecture pairs a sea-of-LABs fabric with adaptive logic modules (ALMs), column-M20K memory blocks and 18x19 variable-precision DSP blocks with hardened IEEE-754 single-precision floating-point support. This combination lets one device implement both control-plane glue logic and high-throughput DSP pipelines without an external companion chip.
Typical applications include broadcast video processing, machine-vision frame grabbers, industrial motor control and encoder interfaces, low-cost PCIe accelerator cards, wireless baseband pre-processing (CPRI / OBSAI) and IoT edge analytics gateways. The high I/O count supports multiple camera sensors or Ethernet ports in a single device.
Designers should plan power-rail sequencing for the core, PLL and transceiver supplies separately and follow Intel's recommended decoupling per the Pin Connection Guidelines to meet transceiver jitter budgets. The I6G ordering code indicates industrial temperature grade, lead-free RoHS-compliant FCBGA.
This page synthesizes distributor pricing, drop-in Altera/Intel alternatives, application recommendations and design notes not found on any single distributor page.
直接替換替代品，適用於 10CX220YF780I6G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10CX220YF780I6G （相同外形與佔位） — 差異在於 Package, Speed Grade, Mounting Type, DSP Blocks, Temperature Grade.
10CX220YF780I5G
✅ 直接替換聯絡詢價
查看資料表 →10CX220YF780E6G
✅ 直接替換聯絡詢價
查看資料表 →10CX220YF780E5G
✅ 直接替換聯絡詢價
查看資料表 →10CX150YF780I6G
✅ 直接替換聯絡詢價
查看資料表 →10CX105YF780I6G
✅ 直接替換聯絡詢價
查看資料表 →10CX220YF780I6G 最大額定值與電氣特性
| Family | Cyclone 10 GX |
| Logic Elements (LE) | 220,000 |
| Embedded Memory (bits) | 13,752,320 |
| User I/O Pins | 284 |
| 封裝 | 780-FBGA (FCBGA), 29x29 mm |
| DSP Blocks | 156 |
| Process Technology | 20 nm |
| 工作溫度 | -40C to +100C (Industrial) |
| Temperature Grade | I (Industrial) |
| Hardened PCIe | Yes - PCIe Gen2 x4 |
| 安裝類型 | Surface Mount (BGA) |
| MSL 等級 | 3 (per JEDEC J-STD-020) |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
10CX220YF780I6G 780-fbga (fcbga), 29x29 mm 腳位配置指南
10CX220YF780I6G（780-fbga (fcbga), 29x29 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10CX220YF780I6G.
請參閱 資料表 以查看完整腳位配置。
典型應用
10CX220YF780I6G 適用於 6 應用s: Broadcast Video Processing & Display, Industrial Machine Vision & Frame Grabbers, Low-Cost PCIe Accelerator Card, Wireless Fronthaul (CPRI / OBSAI), Motor Control & Industrial Encoder Interfaces, IoT Edge Analytics Gateway.
Broadcast Video Processing & Display
The 10CX220YF780I6G's 220K logic elements and 156 DSP blocks enable multi-channel video pipeline processing in broadcast and professional display equipment. With 284 user I/O and embedded M20K memory sufficient for multiple line buffers, the device can simultaneously handle 4K upscaling, color space conversion and frame-rate conversion without external memory contention. Hardened PCIe Gen2 x4 IP allows direct capture card integration into workstation hosts.
推薦
Industrial Machine Vision & Frame Grabbers
Industrial camera aggregation benefits from the 10CX220YF780I6G's 284 user I/O for multi-sensor parallel interfaces and its hardened PCIe endpoint for host-side transfer. Industrial-grade operating range (-40C to +100C) and lead-free RoHS-compliant FCBGA package suit factory-floor deployment. The DSP block count supports real-time Bayer demosaicing, defect detection and edge preprocessing directly on the FPGA before forwarding compact payloads to the host CPU.
推薦
Low-Cost PCIe Accelerator Card
The 10CX220YF780I6G integrates PCIe Gen2 x4 hard IP, eliminating the need for an external bridge chip on cost-optimized accelerator cards. With 220K logic elements and 13.75 Mbits of embedded memory, the device can implement moderate-throughput inference, compression or signal-processing pipelines. Its 12.5 Gbps transceivers connect to SFP+ cages for networked accelerator topologies.
推薦
Wireless Fronthaul (CPRI / OBSAI)
The 10CX220YF780I6G's 12 transceivers at up to 12.5 Gbps support up to 6 CPRI links at 6.144 Gbps or equivalent OBSAI rates for small-cell and remote-radio-head (RRH) fronthaul. Cyclone 10 GX's hardened PCS and deterministic latency allow time-synchronized IQ sample transport, while 220K logic elements host PHY-layer processing, framing and synchronization. Industrial temperature grade suits outdoor base-station enclosures.
推薦
Motor Control & Industrial Encoder Interfaces
Industrial servo and stepper motor control benefits from the 10CX220YF780I6G's combination of 284 user I/O (to interface encoders, Hall sensors and power-stage PWM channels) and 156 DSP blocks for Field-Oriented Control (FOC) math. Industrial-grade temperature range supports cabinet-mounted equipment, while the FCBGA package's high I/O density allows integration of multiple axes in a single device, reducing BOM and PCB area.
推薦
IoT Edge Analytics Gateway
The 10CX220YF780I6G supports edge analytics, protocol bridging and local storage in industrial IoT gateways. Its 220K logic elements run lightweight ML inference, encryption and protocol stacks (Modbus, EtherCAT, OPC-UA) while transceivers handle gigabit Ethernet uplinks. The hardened PCIe Gen2 endpoint lets designers add Wi-Fi 6 or 5G modems via M.2 sockets, and industrial temperature grade suits factory and outdoor cabinet deployments.
推薦
推薦產品摘要
工程參考資料，適用於 10CX220YF780I6G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10CX220YF780I5G | 10CX220YF780E6G | 10CX220YF780E5G | 10CX150YF780I6G | 10CX105YF780I6G |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (FCBGA), 29x29 mm | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 220,000 | 220,000 | 220,000 | 220,000 | 150,000 | 105,000 |
| User I/O | 284 | 284 | 284 | 284 | 284 | 284 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
主要差異化特點
- Highest-density Cyclone 10 GX in the 780-FBGA footprint (對比10CX150YF780I6G)
- Industrial temperature grade (-40C to +100C) (對比10CX220YF780E6G)
- Latest process revision (I6G) for improved silicon yield and power (對比10CX220YF780I5G)
設計說明
The 10CX220YF780I6G requires separate power rails for the core (VCC), PLL (VCCA_PLL), transceiver blocks (VCCR_GXB / VCCT_GXB) and I/O banks (VCCIO). Power-rail ramp rates must follow Intel's Power-Up and Sequencing Guidelines for Cyclone 10 GX - typically monotonic ramp within 10 ms with strict sequencing of VCC before VCCIO. Failure to sequence correctly risks latch-up or in-rush currents that exceed package current limits.
Estimated: at full transceiver utilization (12 lanes at 12.5 Gbps) plus 70% logic utilization in a still-air environment, junction temperature can approach 95C. The 780-FBGA package exposes a thermal pad that must be soldered to a continuous ground plane with thermal vias (0.3 mm pitch, 0.2 mm drill) per Intel's Thermal Management Guidelines. For 10W+ designs, add a heatsink or forced-air cooling to maintain industrial-grade temperature margin.
Decoupling: place 0.1 uF MLCCs every 5-8 mm along VCCIO rails and 10 uF bulk caps within 50 mm of each supply pin. Transceiver rails need 0.01 uF + 0.1 uF + 4.7 uF per channel. Matched-length differential pairs for transceivers must be length-matched within 0.127 mm and skew-matched to the reference clock per Intel's Pin Connection Guidelines (PCG) for Cyclone 10 GX. Use a 4-8 layer stack-up with dedicated ground and power planes adjacent to the BGA break-out layer.
Do not confuse the F780 780-FBGA package with the F672 672-FBGA - they have different ball patterns, different I/O counts, and require entirely different PCB footprints. Reusing a 780-FBGA symbol on a 672-FBGA board will cause assembly failure. Also note that Cyclone 10 GX bitstreams are not compatible with Cyclone V or Cyclone IV - design reuse must include re-compilation with the Cyclone 10 GX device library in Intel Quartus Prime.
Transceiver channels require AC-coupling capacitors (typically 100 nF) on each serial link. Reference clock must be a low-jitter oscillator (typically <300 fs RMS for 10.3125 Gbps operation). Use IBIS-AMI models from Intel for channel simulation; run link-training with the Quartus Prime Transceiver Toolkit to validate eye margin before committing to PCB fabrication.
合規資訊
RoHS and lead-free confirmed via I6G ordering code suffix per Intel/Altera ordering code reference. Not AEC-Q100 qualified (industrial-grade FPGAs typically not qualified to AEC-Q100; AEC-Q100 parts are separate automotive OPNs). MSL 3 per JEDEC J-STD-020.
