10M04SAE144C8G - MAX 10 FPGA 4K LE, 144-EQFP | Intel | Altera
MPN： 10M04SAE144C8G ✓ 啟用中10M04SAE144C8G 概覽
A MAX 10 FPGA is a non-volatile, flash-based programmable logic device from Intel that combines look-up-table (LUT) logic, block RAM, phase-locked loops, user flash, and - in the SA/DA variants - an on-chip ADC. Within the broader programmable logic taxonomy, MAX 10 sits below Cyclone/Cyclone V and well below Stratix, targeting glue logic, I/O expansion, bridge, and sensor-interface applications where instant-on non-volatility matters more than absolute LUT density.
Key differentiating features of the 10M04SAE144C8G include the integrated 12-bit SAR ADC capable of 1 MSPS across up to 9 analog inputs, dual-boot configuration flash for fail-safe field updates, embedded 18 x 18 multipliers, and 168 kbits of user flash. The ADC's analog inputs are routed to dedicated EQFP pins and are digitally isolated from the FPGA fabric, allowing simultaneous logic and analog acquisition without external MCU integration.
Architecturally, the device pairs a flash-backed LUT array with a hard ADC IP block, an on-chip voltage regulator, and configuration memory. The exposed thermal pad on the EQFP-144 package provides a low-thermal-resistance path to PCB copper for thermal relief during sustained ADC operation at full sample rate.
Typical applications include industrial sensor aggregation (analog front end plus glue logic in a single chip), motor control interface boards, portable test and measurement front ends, display controllers with touch/proximity sensing, and battery management subsystems that need both analog monitoring and timing/control logic.
Design consideration: ADC accuracy is sensitive to a quiet analog supply - separate AVCC from digital VCCINT/VCCIO with a ferrite and adequate decoupling to preserve 12-bit linearity.
This page synthesizes drop-in family variants, distributor pricing, and application-circuit context not found in the bare manufacturer datasheet.
直接替換替代品，適用於 10M04SAE144C8G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10M04SAE144C8G （相同外形與佔位） — 差異在於 ADC, Family, Operating Temperature, Package, Process Technology.
10M04SCE144C8G
✅ 直接替換聯絡詢價
查看資料表 →10M04SAE144I7G
✅ 直接替換📋 參考替代品（不在目錄中）
10M04SAE144C7G
✅ 直接替換📋 參考替代品（不在目錄中）
10M04SDE144C8G
✅ 直接替換📋 參考替代品（不在目錄中）
10M04SAU169C8G
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
10M04SAE144C8G 最大額定值與電氣特性
| Family | MAX 10 |
| Logic Elements | 4,000 |
| Maximum User I/Os | 101 |
| Embedded User Flash | 193,536 bits |
| User Flash Memory | 168 kbits |
| 18x18 Multipliers | Yes (block multipliers) |
| ADC | 12-bit, 1 MSPS SAR, up to 9 analog inputs |
| Process Technology | 55 nm TSMC |
| Core Voltage | 1.2 V |
| Configuration | Dual-configuration flash, instant-on |
| 封裝 | 144-EQFP (Plastic Enhanced QFP), 22 x 22 mm, 0.50 mm pitch, exposed pad |
| 安裝類型 | Surface Mount |
| 工作溫度 | Commercial (0C to 85C) |
| Speed Grade | C8 |
| RoHS 狀態 | RoHS compliant |
10M04SAE144C8G 144-eqfp (plastic enhanced qfp), 22 x 22 mm, 0.50 mm pitch, exposed pad 腳位配置指南
10M04SAE144C8G（144-eqfp (plastic enhanced qfp), 22 x 22 mm, 0.50 mm pitch, exposed pad 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10M04SAE144C8G.
請參閱 資料表 以查看完整腳位配置。
典型應用
10M04SAE144C8G 適用於 7 應用s: Industrial Sensor Aggregation, Motor Control Interface Board, Portable Test and Measurement Front End, Display Controller with Touch/Proximity Sensing, Battery Management Subsystem, I/O Expansion and Protocol Bridge, LED Lighting Control Systems.
Industrial Sensor Aggregation
The 10M04SAE144C8G consolidates multi-channel analog sensing and glue logic onto a single chip. Its 12-bit 1 MSPS SAR ADC accepts up to 9 analog inputs from temperature, pressure, or current-shunt sensors, while the 4,000 logic elements handle filtering, threshold detection, and protocol formatting (Modbus RTU, CAN, RS-485). The non-volatile flash-based configuration eliminates the boot delay of SRAM FPGAs, allowing sub-10 ms power-up - ideal for industrial controllers that must respond to safety commands within milliseconds. The exposed thermal pad on the EQFP-144 keeps junction temperatures manageable when the ADC runs continuously at 1 MSPS, preserving the 12-bit linearity required for precision measurement.
推薦
Motor Control Interface Board
The integrated ADC and high-speed FPGA fabric suit low-cost BLDC or stepper control designs. The 12-bit 1 MSPS ADC digitizes phase-current shunt amplifiers and back-EMF sense signals, while the FPGA generates center-aligned PWM with programmable dead time and decodes Hall-effect or quadrature encoder feedback directly in hardware - offloading work from a host MCU. With 101 user I/Os, the device can also drive gate-driver enable lines, fault inputs, and brake logic without external logic ICs. Designers should isolate AVCC from switching noise with a ferrite and dedicate a quiet analog ground pour under the ADC pin group to maintain 12-bit dynamic range.
推薦
Portable Test and Measurement Front End
For handheld oscilloscope probes, data loggers, or field instrumentation, the 10M04SAE144C8G provides an integrated analog front end plus custom DSP. The 12-bit ADC samples at up to 1 MSPS, enough for audio-bandwidth measurement and many sensor signals, while the FPGA fabric runs custom FIR/IIR filters, peak detection, and trigger logic. Instant-on configuration lets the instrument boot and present a UI within tens of milliseconds - a critical UX factor for portable tools. With 4,000 LEs available, designers can implement waveform math, RMS calculation, and frequency analysis without adding a separate DSP chip, reducing BOM and PCB area.
推薦
Display Controller with Touch/Proximity Sensing
The on-chip ADC simplifies touch and proximity sensing by digitizing capacitive or resistive sense lines directly, while the FPGA fabric drives LCD or TFT data and control signals. With 101 user I/Os, the 10M04SAE144C8G can interface to RGB parallel panels, SPI peripherals, and backlight PWM channels without external logic. The non-volatile boot avoids the flash-PROM of SRAM FPGAs, reducing the BOM for cost-sensitive consumer appliances. Designers should keep ADC traces short and guard them against display switching noise to preserve touch accuracy across the panel area.
推薦
Battery Management Subsystem
Lithium-ion battery packs and UPS modules benefit from combining cell-voltage monitoring, current sensing, and balancing control on one chip. The 10M04SAE144C8G's 12-bit ADC reads individual cell voltages through resistor dividers and a Hall-effect or shunt current sensor, while the FPGA computes state-of-charge and state-of-health algorithms and drives balancing FETs. With dual-configuration flash, firmware updates for new battery chemistries can be deployed safely in the field with automatic fallback on bad images. The exposed thermal pad on the EQFP-144 helps dissipate heat from sustained ADC sampling during fast-charge monitoring.
推薦
I/O Expansion and Protocol Bridge
A common MAX 10 use case is bridging between incompatible interfaces - for example, SPI to I2C, UART to parallel, or LVDS to LVCMOS - and adding GPIOs to MCUs that have run out of pins. The 10M04SAE144C8G delivers 101 user I/Os at up to 3.3 V LVCMOS with LVDS support, and the 4,000 LEs handle modest glue logic, FIFOs, and state machines. Because MAX 10 is flash-based, no boot PROM is needed and configuration is retained through power cycles - ideal for industrial backplanes, retrofits, and protocol-converter modules that must be plug-and-play.
推薦
LED Lighting Control Systems
Architectural and stage lighting systems need many PWM channels with precise phase control and smooth dimming. The 10M04SAE144C8G's 101 user I/Os and 4,000 LEs can drive dozens of constant-current LED drivers directly, while the integrated ADC reads ambient light sensors and potentiometer dim inputs. The non-volatile flash boots instantly, so lights respond to DMX or DALI commands with no warm-up delay. Designers can implement per-channel gamma correction, color-mixing, and thermal-foldback algorithms in the FPGA fabric, eliminating an external MCU for the lighting logic.
推薦
推薦產品摘要
工程參考資料，適用於 10M04SAE144C8G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10M04SCE144C8G | 10M04SAE144I7G | 10M04SAE144C7G | 10M04SDE144C8G |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-EQFP (22 x 22 mm, 0.50 mm pitch) | 144-EQFP - same | 144-EQFP - same | 144-EQFP - same | 144-EQFP - same |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| On-chip ADC | 12-bit, 1 MSPS, 9 inputs | None (SC variant) | 12-bit, 1 MSPS, 9 inputs | 12-bit, 1 MSPS, 9 inputs | 12-bit, 1 MSPS, 9 inputs |
| Maximum User I/Os | 101 | 101 | 101 | 101 | 101 |
| Configuration Flash | Dual-configuration | Dual-configuration | Dual-configuration | Dual-configuration | Single-configuration |
| Speed Grade | C8 (commercial) | C8 | I7 (industrial) | C7 (faster) | C8 |
| Operating Temperature | Commercial (0C to 85C) | Commercial | Industrial (-40C to 100C) | Commercial | Commercial |
| Process / Core Voltage | 55 nm / 1.2 V | 55 nm / 1.2 V | 55 nm / 1.2 V | 55 nm / 1.2 V | 55 nm / 1.2 V |
主要差異化特點
- Integrated 12-bit 1 MSPS ADC eliminates external measurement IC (對比10M04SCE144C8G)
- Industrial temperature grade variant available in same footprint (對比10M04SAE144I7G)
- Dual-configuration flash enables fail-safe remote firmware updates (對比10M04SDE144C8G)
設計說明
The MAX 10 internal regulator generates 1.2 V VCCINT from an external 3.3 V supply; supply a clean 3.3 V on VCCA and decouple VCCIO banks per-bank. The ADC analog supply AVCC must be low-noise: place a ferrite between digital 3.3 V and AVCC, with 10 uF + 100 nF decoupling at the AVCC pin. Estimated: at 1 MSPS continuous ADC sampling plus 50 MHz fabric activity, total device current is approximately 100-150 mA from the 3.3 V rail.
Solder the exposed thermal pad on the EQFP-144 to a continuous copper pour connected to a quiet ground plane. With the ADC running continuously at full sample rate and high fabric utilization, junction temperature rise is the limiting factor - the exposed pad provides the primary heat path. Estimated: at 0.5 W dissipation with a properly soldered thermal pad, junction-to-ambient thermal resistance is approximately 25-30 C/W on a 4-layer JEDEC test board.
Route ADC analog traces over a continuous analog ground pour, kept separate from digital switching returns. Use guard rings around ADC input pins and keep analog traces short (less than 25 mm where possible). Place the AVCC decoupling capacitor within 5 mm of the AVCC pin. Route high-speed digital signals (clock, DDR) on inner layers away from the analog section to preserve 12-bit linearity.
Do not omit the JTAG pull-up resistor on TCK/TMS/TDI or the configuration will fail to load in some programmer chains. Do not tie nCONFIG low during power-up unless intentional - the device samples nCONFIG on rising edge of VCC. When migrating from the SC variant to SA, ensure your Quartus pin assignments match the analog-capable pins; analog input pins on the SA variant are not general-purpose GPIO and must be assigned to the ADC IP block.
合規資訊
RoHS compliant per Altera/Intel product page documentation. Not AEC-Q100 qualified - choose a different part for automotive applications requiring Grade 1 qualification.
