A3PE600-PQG208 - 600K Gate ProASIC3E FPGA 208-PQFP | Microchip
MPN: A3PE600-PQG208 ✓ 啟用中A3PE600-PQG208 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks and interconnects that the designer configures after manufacturing. The ProASIC3E family belongs to the nonvolatile flash FPGA class: unlike SRAM FPGAs, it stores its configuration in on-chip flash, so it powers up instantly as a single-chip solution with no external boot configuration PROM, no configuration controller, and inherently higher design security against bitstream copying.
Key features include single-chip, low total cost of ownership (TOC), reprogrammable flash fabric, abundant advanced features per the Microchip ProASIC3E datasheet, and a 208-pin surface-mount QFP footprint suitable for cost-sensitive boards. The 1.5V nominal core supply keeps dynamic power low, while 3.3V-capable I/O banks support standard single-ended interfaces.
Technically, the A3PE600 uses Microsemi's flash switch technology, giving it live-at-power-up behavior and no configuration time penalty. The 130nm process yields 600K system gates, and the 231 MHz performance figure enables mid-range glue logic replacement, control, and data-path designs that would otherwise require ASIC NRE investment.
Typical applications include consumer electronics, networking and communications equipment, computing platforms, industrial control, and avionics systems - markets the Microchip ProASIC3E datasheet explicitly identifies as target segments for ASIC-replacement use.
When designing with this device, verify the 1.425V to 1.575V core supply tolerance with a dedicated regulator and confirm the 0C to +70C commercial temperature range matches your environment; industrial-grade A3PE600-PQG208I variants exist for extended temperatures.
This page synthesizes distributor pricing availability, same-package drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品,適用於 A3PE600-PQG208 — 相同封裝,腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號: A3PE600-PQG208 (相同外形與佔位) — 差異在於 Package, Configuration Memory, System Gates, Family, Process Technology.
A3PE600-PQG208IX218
✅ 直接替換聯絡詢價
查看資料表 →A3PE1500-1PQG208
✅ 直接替換聯絡詢價
查看資料表 →A3PE1500-2PQG208
✅ 直接替換聯絡詢價
查看資料表 →A3P600-PQG208
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-PQ208I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-1PQG208
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-PQG208X3
✅ 直接替換聯絡詢價
查看資料表 →A3PE600-PQG208 最大額定值與電氣特性
| Family | ProASIC3E (Flash FPGA) |
| System Gates | 600,000 |
| User I/O | 147 |
| Total Embedded RAM | 110,592 bits |
| Core Supply Voltage | 1.425 V to 1.575 V |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm |
| Configuration Technology | Flash (nonvolatile, single-chip) |
| 封裝 | 208-Pin PQFP (BFQFP), surface mount |
| 工作溫度 | 0C to +70C (commercial) |
| 安裝類型 | Surface Mount |
| Programmability | In-system reprogrammable |
| Power-Up Behavior | Live at power-up (no external configuration device) |
| RoHS 狀態 | Compliant |
| Lead Free Status | Lead Free |
| Target Markets | Consumer, networking/communications, computing, avionics |
A3PE600-PQG208 208-pin pqfp (bfqfp), surface mount 腳位配置指南
A3PE600-PQG208(208-pin pqfp (bfqfp), surface mount 封裝)的腳位配置。 此數位 IC 包含 GPIO、通訊介面(UART、SPI、I2C)與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料: A3PE600-PQG208.
請參閱 資料表 以查看完整腳位配置。
典型應用
A3PE600-PQG208 適用於 6 應用s: ASIC Replacement in Consumer Electronics, Networking and Communications Equipment, Industrial Control and Automation, Computing Platform Glue Logic, Avionics and Aerospace Subsystems, Test and Measurement Instrumentation.
ASIC Replacement in Consumer Electronics
The Microchip ProASIC3E datasheet explicitly positions the family as a cost-effective ASIC replacement for consumer markets. The A3PE600-PQG208's 600,000 system gates and 231 MHz performance cover mid-complexity control, interface, and data-path logic that would otherwise require ASIC NRE and mask charges. Because configuration is stored in nonvolatile on-chip flash, the board needs no external boot PROM or configuration controller, cutting BOM cost and board area - critical in price-sensitive consumer designs. The single 1.5V nominal core supply keeps dynamic power low, and the 208-pin PQFP is inexpensive to assemble versus BGA packages. The device remains reprogrammable in the field, so late feature changes or bug fixes ship as firmware updates instead of hardware respins, protecting consumer product schedules.
推薦
Networking and Communications Equipment
Networking and communications systems use the A3PE600-PQG208 for glue logic, line-card control, backplane interfacing, and protocol bridging. The 147 user I/Os, organized in multiple banks with independent VCCI supplies, map naturally to mixed-voltage interfaces common in communications backplanes, while the 110,592-bit embedded RAM implements FIFOs and buffering between clock domains. The 231 MHz system performance supports fast data-path functions, and flash-based, live-at-power-up startup means the card is functional the instant power is applied - valuable for hot-swap and fast-restart behavior in telecom shelves. The Microchip ProASIC3E datasheet lists networking/communications as a primary target market, and the commercial 0C to +70C grade fits centrally managed, climate-controlled equipment rooms.
推薦
Industrial Control and Automation
In industrial control panels, PLC I/O modules, and machine controllers, the A3PE600-PQG208 implements deterministic state machines, encoder interfaces, and safety interlock logic. The flash fabric is live at power-up with no configuration delay, so the controller is ready within milliseconds of power application - an advantage over SRAM FPGAs that spend boot time loading a bitstream. For factory-floor environments beyond the commercial 0C to +70C range, the pin-identical industrial grade A3PE600-PQG208IX218 extends temperature capability without any PCB change, as both share the 208-pin PQFP footprint and identical die. The single 1.425V to 1.575V core eases power-supply design, and 147 I/Os provide ample banked interfaces to sensors, relays, and fieldbus transceivers.
推薦
Computing Platform Glue Logic
Server, storage, and embedded computing boards use the A3PE600-PQG208 for address decoding, bus bridging, power-sequencing control, and board-management logic around the main processor. The 110,592 bits of embedded RAM buffer status and telemetry data, while 147 I/Os connect to I2C/SMBus-style management buses, LEDs, and reset trees. Flash configuration with live-at-power-up behavior means the management FPGA is supervising the board before the CPU leaves reset - essential for correct power sequencing and early fault reporting. The commercial temperature grade and inexpensive PQFP package suit high-volume computing hardware, and the Microchip ProASIC3E datasheet names computing as a target market for exactly this ASIC-replacement role.
推薦
Avionics and Aerospace Subsystems
The Microchip ProASIC3E datasheet explicitly targets avionics applications, and the A3PE600-PQG208 fits roles such as discrete-to-digital adaptation, ARINC-style interface consolidation, and Built-In Test logic in avionics line-replaceable units. The single-chip flash architecture eliminates the external configuration device - a common reliability and security concern in airborne hardware - and the nonvolatile bitstream resists readback-based IP extraction. 147 I/Os absorb the large discrete counts typical of avionics interfaces, and the 600K-gate fabric implements dual-redundant control paths with margin. For programs with environmental qualification requirements, specify the industrial-temperature A3PE600-PQG208IX218 drop-in, which preserves the PCB footprint while extending the operating range beyond the commercial 0C to +70C grade.
推薦
Test and Measurement Instrumentation
Bench instruments, automated test equipment, and data-acquisition front ends deploy the A3PE600-PQG208 for timing generation, trigger logic, and interface translation. The 231 MHz fabric performance supports fast trigger paths and counter/timer functions, while the 110,592-bit embedded RAM captures transient event logs or sample buffers without external SRAM. Designers value the flash fabric's deterministic, configuration-free startup: the instrument is measuring from the moment power stabilizes, with no boot latency. The 208-pin PQFP simplifies prototyping and rework compared with fine-pitch BGAs, an advantage in instrumentation programs with frequent engineering changes, and the field-reprogrammable fabric lets one PCB serve multiple instrument variants simply by loading different firmware images.
推薦
推薦產品摘要
工程參考資料,適用於 A3PE600-PQG208 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | A3PE600-PQG208IX218 | A3PE1500-1PQG208 | A3P600-PQG208 | A3PE3000L-PQ208I |
|---|---|---|---|---|---|
| Package | 208-Pin PQFP (PQG208) | 208-Pin PQFP - same | 208-Pin PQFP - same | 208-BFQFP - same | 208-Pin PQFP - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600,000 | 600,000 | 1,500,000 | 600,000 | 3,000,000 |
| Core Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Operating Temperature | 0C to +70C (commercial) | Industrial (extended) | Commercial grade (-1 speed) | Commercial grade | Industrial (extended) |
| Configuration | Nonvolatile flash, live at power-up | Nonvolatile flash - same | Nonvolatile flash - same | Nonvolatile flash - same | Nonvolatile flash - same |
| Process / Performance | 130 nm, 231 MHz | 130 nm, 231 MHz | 130 nm, speed grade -1 | 130 nm, ProASIC3 | 130 nm, low-power 3000L |
主要差異化特點
- Nonvolatile flash configuration - no external boot device (對比A3P600-PQG208)
- Footprint-compatible upward migration (對比A3PE1500-1PQG208)
- Commercial-grade cost advantage (對比A3PE600-PQG208IX218)
- Trade-off: lower I/O count within family (對比A3P600-PQG208)
設計說明
Supply the 1.5V core from a dedicated regulator meeting the 1.425V to 1.575V tolerance across all load and temperature corners; do not share the rail with noisy digital loads such as DDR terminations. Bank I/O supplies (VCCI) must each be pinned out per the ProASIC3E datasheet package tables - mixing 3.3V and lower-voltage banks on one rail defeats the banked I/O standard flexibility. Estimated: at 600K gates, core current scales with toggle rate, so size the core regulator using Libero SmartPower estimates rather than assuming worst-case datasheet numbers.
The 208-pin PQFP dissipates heat primarily through its leads into the PCB. Estimated: dynamic power at 231 MHz with a heavily toggling fabric can reach the watt class; verify junction temperature using the datasheet thermal resistance figures for the PQG208 package and your airflow assumption. Provide solid ground planes under the package and connect all GND pins; avoid thermal relief spokes on ground leads to keep effective theta_JA low. If your application runs near the +70C commercial limit, consider the A3PE600-PQG208IX218 industrial variant for added margin.
Three frequent mistakes with ProASIC3E PQFP designs: (1) Assuming SRAM-FPGA behavior - the A3PE600 is live at power-up, so input glitching during configuration does not occur, but designers must still define pin states during power ramp. (2) Exceeding the commercial 0C to +70C rating with the standard part in industrial enclosures - specify the PQG208I grade up front. (3) Neglecting JTAG access in PCB layout - keep the TDI/TDO/TMS/TCK chain routable to a programming header for FlashPro in-circuit programming and field updates.
Group high-speed I/O within the same VCCI bank and keep stub lengths on the PQFP gull-wing leads short; 231 MHz fabric paths allow fast output edges that can ring on unmatched traces. Reference timing-critical signals to a contiguous ground plane and add series termination (22-33 ohm, estimated starting values) on fast single-ended outputs driving off-board loads. Route JTAG as a clean, short chain even in production boards - it doubles as your in-system update path.
合規資訊
RoHS Compliant and Lead Free per digchip distributor datasheet summary. REACH and conflict-minerals declarations not stated in provided data.