A54SX72A-FFGG256 - 108K Gate Antifuse FPGA, 256-BGA | Microchip
MPN： A54SX72A-FFGG256 ✓ 啟用中A54SX72A-FFGG256 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that designers configure after manufacturing. Within the programmable logic hierarchy, the SX-A belongs to the antifuse FPGA category, sitting under the broader families of FPGAs, programmable logic devices (PLDs), and logic ICs. Unlike SRAM-based FPGAs, antifuse devices are one-time programmable, which provides inherent design security and non-volatile configuration without an external boot flash.
Key features of the A54SX72A-FFGG256 include the 0.25 um CMOS process technology, low static power consumption typical of antifuse architecture, and the high-density 256-ball package that concentrates 203 user I/Os in a 17x17 mm-class footprint. The FF speed grade designation defines the standard timing grade, while the fine-pitch BGA enables dense, high-I/O board layouts for backplane and mezzanine cards.
Technically, the SX-A fabric uses asea-of-modules architecture with C-cells for combinatorial logic and R-cells for sequential logic, routed through a segmented antifuse interconnect. Because the antifuse programming is permanent, designs are immune to configuration readback attacks and do not require configuration PROMs, reducing bill-of-material cost and improving power-up reliability in industrial systems.
Typical applications include industrial automation control, telecommunications line cards, test and measurement instrumentation, and military/aerospace legacy systems requiring secure one-time-programmable logic at moderate clock rates.
Design considerations: because the device is one-time programmable, timing closure and pin assignment must be finalized before programming; use the Libero SoC design suite for compilation and verify worst-case timing at the 2.25V supply corner. Note the 0C to +70C commercial temperature range when selecting this grade.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with pricing verified as of 2026-09-03.
直接替換替代品，適用於 A54SX72A-FFGG256 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： A54SX72A-FFGG256 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, System Gates, Process Technology.
A54SX72A-FFGG256A
✅ 直接替換📋 參考替代品（不在目錄中）
A54SX72A-FFGG256M
✅ 直接替換📋 參考替代品（不在目錄中）
A54SX72A-FGG256
✅ 直接替換聯絡詢價
查看資料表 →A54SX72A-FGG256A
✅ 直接替換聯絡詢價
查看資料表 →A54SX72A-1FGG256
✅ 直接替換聯絡詢價
查看資料表 →A54SX72A-FGG256I
✅ 直接替換聯絡詢價
查看資料表 →A54SX72A-FGG256M
✅ 直接替換聯絡詢價
查看資料表 →A54SX72A-FFGG256 最大額定值與電氣特性
| Family | SX-A (Antifuse FPGA) |
| System Gates | 108,000 |
| Typical Gates | 72,000 |
| Configurable Logic Blocks (CLBs) | 6,036 |
| Number of I/O | 203 |
| 供應電壓 | 2.25 V to 2.75 V (nominal 2.5 V) |
| 最大時脈頻率 | 172 MHz |
| Combinatorial CLB Delay | 1.8 ns (typical) |
| Process Technology | 0.25 um CMOS |
| Programmability | One-Time Programmable (antifuse) |
| Speed Grade | Standard (FF) |
| 封裝 | 256-BGA (FBGA-256, 1.0 mm pitch) |
| 安裝類型 | Surface Mount |
| 工作溫度 | 0C to +70C |
| Packaging | Tray |
| RoHS 狀態 | Compliant |
| Lead Free Status | Lead Free |
A54SX72A-FFGG256 256-bga (fbga-256, 1.0 mm pitch) 腳位配置指南
A54SX72A-FFGG256（256-bga (fbga-256, 1.0 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： A54SX72A-FFGG256.
請參閱 資料表 以查看完整腳位配置。
典型應用
A54SX72A-FFGG256 適用於 6 應用s: Industrial Automation Control, Telecommunications Line Cards, Test and Measurement Instrumentation, Military and Aerospace Legacy Systems, Legacy Board Refresh and Obsolescence Management, Secure Embedded Control Systems.
Industrial Automation Control
The A54SX72A-FFGG256 fits industrial automation controllers where a single 2.5V chip must integrate bus interfaces, sequencers, and glue logic. Its 108K system gates and 6,036 CLBs absorb functions previously spread across multiple discrete devices, cutting board area and BOM cost, while the 203 user I/Os in the 256-ball FBGA handle parallel fieldbus and backplane signals. Because the antifuse configuration is one-time programmable, the logic powers up instantly with no configuration PROM and resists readback, improving uptime and security on the factory floor. Typical implementations place the FPGA between a microcontroller and I/O modules with 0.1uF decoupling per power ball; the trade-off versus a modern SRAM FPGA is lower density but zero boot-time and simpler power sequencing.
推薦
Telecommunications Line Cards
Telecom line cards benefit from the A54SX72A-FFGG256's combination of 203 user I/Os and 172 MHz-class internal performance, which handles framing, multiplexing, and backplane interfacing at T1/E1 and SONET fringe rates. The 256-ball fine-pitch FBGA concentrates a large pin count in a compact footprint suited to high-density card slots, and the 2.25V to 2.75V supply simplifies integration with 2.5V and 3.3V-tolerant I/O banks. The one-time-programmable antifuse fabric eliminates the configuration-flash failure mode in always-on network equipment and provides tamper resistance for carrier infrastructure. Designers should verify quadrant clock assignments (A, B, C, D clock balls per the SX-A datasheet) when distributing the line-card reference clock across the fabric.
推薦
Test and Measurement Instrumentation
In bench and automated test equipment, the A54SX72A-FFGG256 implements trigger logic, counters, pattern generators, and instrument bus glue logic where deterministic, instant-on configuration matters. Its typical 1.8 ns combinatorial CLB delay supports sub-10ns trigger-path latency, and 203 I/Os connect directly to front-end comparators and backplane connectors without external fanout logic. The antifuse architecture adds no configuration readback risk, valuable in instrumentation IP protection, and the single 2.5V rail keeps the analog section's power domain planning simple with local 10uF bulk plus 0.1uF per-region decoupling. For designs needing faster state-machine clocks, the -1 speed grade variant is a pin-compatible upgrade within the same footprint.
推薦
Military and Aerospace Legacy Systems
Defense and aerospace sustaining programs frequently specify the A54SX72A-FFGG256 because its antifuse fabric is immune to configuration upset from single events in the ways SRAM FPGAs are not, and the one-time programming provides inherent anti-tamper and readback protection. The 108K-gate capacity accommodates command decoders, telemetry formatters, and interface bridging in avionics LRUs, while the sealed 256-ball BGA withstands vibration better than fine-pitch QFP alternatives. Verified same-family M-suffix variants (A54SX72A-FFGG256M) provide military temperature screening in the identical footprint, so qualification on the existing PCB layout is preserved. Designs should be compiled and verified in Microchip Libero SoC at worst-case 2.25V supply before programming.
推薦
Legacy Board Refresh and Obsolescence Management
When refreshing discontinued ASIC, gate-array, or older PLD content, the A54SX72A-FFGG256 serves as a single-chip consolidation target: 108K gates integrate what previously required multiple devices, and the antifuse configuration removes the external PROM that adds cost and a failure point. Because DigiKey currently shows stock and Octopart lists five distributor sources, procurement risk is low, and the same-die family (FFGG256A/M, FGG256 variants) provides speed-grade and temperature flexibility within one PCB footprint. Estimated: consolidating three to five glue-logic devices typically saves board area and BOM cost proportionally to removed placements. Recompilation in Libero SoC is required for each new programming file; HDL porting effort is modest for register-transfer level designs.
推薦
Secure Embedded Control Systems
Applications requiring configuration confidentiality - payment terminals, access-control hardware, proprietary industrial equipment - use the A54SX72A-FFGG256 because its antifuse bitstream physically cannot be read back after programming, unlike SRAM FPGA bitstreams that traverse an external flash and can be captured at boot. The 2.5V single-rail operation and 0C to +70C range cover commercial embedded environments, and the 203 I/Os interface directly to sensors, keypads, and communication PHYs. Instant power-up without configuration time also shortens cold-start latency for always-on security devices. The trade-off is field non-upgradability: any logic change requires a new programmed device, so firmware-facing functions should remain in an attached microcontroller.
推薦
推薦產品摘要
工程參考資料，適用於 A54SX72A-FFGG256 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | A54SX72A-FFGG256A | A54SX72A-FGG256 | A54SX72A-FGG256I |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-BGA (FBGA-256) | 256-BGA (FBGA-256) - same | 256-BGA (FBGA-256 family) | 256-BGA (FBGA-256 family) |
| System Gates | 108,000 | 108,000 | 108,000 | 108,000 |
| User I/O | 203 | 203 | 203 | 203 |
| Supply Voltage | 2.25 V to 2.75 V | 2.25 V to 2.75 V | 2.25 V to 2.75 V | 2.25 V to 2.75 V |
| Packaging | Tray | Tray | Tray | Tray |
主要差異化特點
- One-time-programmable antifuse security (對比A54SX72A-FGG256I)
- Instant power-up with no boot device (對比A54SX72A-FFGG256A)
- High I/O density per package area (對比A54SX72A-PQG208)
設計說明
Power the A54SX72A-FFGG256 from a regulated 2.5V rail that stays within 2.25V to 2.75V under all load transients; worst-case timing is specified at the 2.25V corner, so undershoot below that invalidates your static timing report. Place one 10uF bulk capacitor plus multiple 0.1uF ceramics around the 256-ball BGA perimeter, one decoupling capacitor per VDD ball group. Estimated: antifuse static current is very low compared with SRAM FPGAs, so total budget is dominated by dynamic switching - run the Microchip power calculator with your post-layout toggle rates.
This device is one-time programmable: once antifuses are blown, the part cannot be erased or reused. Always complete pin assignment, timing closure, and design review in Microchip Libero SoC before committing a device, and program one prototype first. Also remember the four quadrant clock balls (A, B, C, D for bottom-left, bottom-right, top-left, top-right quadrants per the SX-A datasheet) - clock signals entering the wrong quadrant cannot reach the target logic region efficiently, degrading timing.
The 256-ball FBGA uses a 1.0 mm ball pitch; fan out with via-in-pad or dogbone escapes on a minimum 4-layer board, dedicating one internal layer to a solid ground plane to return I/O currents and control crosstalk on the 203 user I/Os. Keep series termination resistors within 10 mm of fast-switching banks and match lengths on parallel buses. Verify the exact land pattern dimensions against the package drawing in the Microchip SX-A family datasheet before releasing the PCB fabrication package.
At 172 MHz-class internal clocks with fast output edges, use the I/O bank drive-strength and slew settings in Libero SoC to limit edge rates on board traces; overdriving unnecessarily causes overshoot and EMI. For long parallel buses, terminate with series resistors at the driver and check stub lengths to keep reflections within the 3.3V-tolerant input thresholds. Simulate critical nets with an IBIS model from Microchip if your traces exceed roughly 10 cm.
合規資訊
Verified data states Lead Free Status: Lead Free and RoHS Status: RoHS Compliant. REACH, halogen-free, and conflict-minerals declarations were not present in the verified data.
