A54SX72A-FFGG256 - 108K Gate Antifuse FPGA, 256-BGA | Microchip
MPN: A54SX72A-FFGG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $92.5 | $92.50 |
| 10 | $86.4 | $864.00 |
| 100 | $78.9 | $7,890.00 |
| 500 | $71.2 | $35,600.00 |
| 1,000 | $65.8 | $65,800.00 |
Drop-in alternatives for A54SX72A-FFGG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A54SX72A-FFGG256A
✅ Drop-In📋 Reference alternative (not in catalog)
A54SX72A-FFGG256M
✅ Drop-In📋 Reference alternative (not in catalog)
A54SX72A-FGG256
✅ Drop-In✓ In Stock
$153.34 / Unit
View Datasheet →A54SX72A-FGG256A
✅ Drop-In✓ In Stock
$148.4 / Unit
View Datasheet →A54SX72A-1FGG256
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →A54SX72A-FGG256I
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →A54SX72A-FGG256M
✅ Drop-In✓ In Stock
$136 / Unit
View Datasheet →A54SX72A-FFGG256 Maximum Ratings & Electrical Characteristics
| Family | SX-A (Antifuse FPGA) |
| System Gates | 108,000 |
| Typical Gates | 72,000 |
| Configurable Logic Blocks (CLBs) | 6,036 |
| Number of I/O | 203 |
| Supply Voltage | 2.25 V to 2.75 V (nominal 2.5 V) |
| Maximum Clock Frequency | 172 MHz |
| Combinatorial CLB Delay | 1.8 ns (typical) |
| Process Technology | 0.25 um CMOS |
| Programmability | One-Time Programmable (antifuse) |
| Speed Grade | Standard (FF) |
| Package | 256-BGA (FBGA-256, 1.0 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +70C |
| Packaging | Tray |
| RoHS Status | Compliant |
| Lead Free Status | Lead Free |
A54SX72A-FFGG256 256-bga (fbga-256, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for A54SX72A-FFGG256 (256-bga (fbga-256, 1.0 mm pitch) package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX72A-FFGG256.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX72A-FFGG256 is suitable for 6 applications: Industrial Automation Control, Telecommunications Line Cards, Test and Measurement Instrumentation, Military and Aerospace Legacy Systems, Legacy Board Refresh and Obsolescence Management, Secure Embedded Control Systems.
Industrial Automation Control
The A54SX72A-FFGG256 fits industrial automation controllers where a single 2.5V chip must integrate bus interfaces, sequencers, and glue logic. Its 108K system gates and 6,036 CLBs absorb functions previously spread across multiple discrete devices, cutting board area and BOM cost, while the 203 user I/Os in the 256-ball FBGA handle parallel fieldbus and backplane signals. Because the antifuse configuration is one-time programmable, the logic powers up instantly with no configuration PROM and resists readback, improving uptime and security on the factory floor. Typical implementations place the FPGA between a microcontroller and I/O modules with 0.1uF decoupling per power ball; the trade-off versus a modern SRAM FPGA is lower density but zero boot-time and simpler power sequencing.
Recommended
Telecommunications Line Cards
Telecom line cards benefit from the A54SX72A-FFGG256's combination of 203 user I/Os and 172 MHz-class internal performance, which handles framing, multiplexing, and backplane interfacing at T1/E1 and SONET fringe rates. The 256-ball fine-pitch FBGA concentrates a large pin count in a compact footprint suited to high-density card slots, and the 2.25V to 2.75V supply simplifies integration with 2.5V and 3.3V-tolerant I/O banks. The one-time-programmable antifuse fabric eliminates the configuration-flash failure mode in always-on network equipment and provides tamper resistance for carrier infrastructure. Designers should verify quadrant clock assignments (A, B, C, D clock balls per the SX-A datasheet) when distributing the line-card reference clock across the fabric.
Recommended
Test and Measurement Instrumentation
In bench and automated test equipment, the A54SX72A-FFGG256 implements trigger logic, counters, pattern generators, and instrument bus glue logic where deterministic, instant-on configuration matters. Its typical 1.8 ns combinatorial CLB delay supports sub-10ns trigger-path latency, and 203 I/Os connect directly to front-end comparators and backplane connectors without external fanout logic. The antifuse architecture adds no configuration readback risk, valuable in instrumentation IP protection, and the single 2.5V rail keeps the analog section's power domain planning simple with local 10uF bulk plus 0.1uF per-region decoupling. For designs needing faster state-machine clocks, the -1 speed grade variant is a pin-compatible upgrade within the same footprint.
Recommended
Military and Aerospace Legacy Systems
Defense and aerospace sustaining programs frequently specify the A54SX72A-FFGG256 because its antifuse fabric is immune to configuration upset from single events in the ways SRAM FPGAs are not, and the one-time programming provides inherent anti-tamper and readback protection. The 108K-gate capacity accommodates command decoders, telemetry formatters, and interface bridging in avionics LRUs, while the sealed 256-ball BGA withstands vibration better than fine-pitch QFP alternatives. Verified same-family M-suffix variants (A54SX72A-FFGG256M) provide military temperature screening in the identical footprint, so qualification on the existing PCB layout is preserved. Designs should be compiled and verified in Microchip Libero SoC at worst-case 2.25V supply before programming.
Recommended
Legacy Board Refresh and Obsolescence Management
When refreshing discontinued ASIC, gate-array, or older PLD content, the A54SX72A-FFGG256 serves as a single-chip consolidation target: 108K gates integrate what previously required multiple devices, and the antifuse configuration removes the external PROM that adds cost and a failure point. Because DigiKey currently shows stock and Octopart lists five distributor sources, procurement risk is low, and the same-die family (FFGG256A/M, FGG256 variants) provides speed-grade and temperature flexibility within one PCB footprint. Estimated: consolidating three to five glue-logic devices typically saves board area and BOM cost proportionally to removed placements. Recompilation in Libero SoC is required for each new programming file; HDL porting effort is modest for register-transfer level designs.
Recommended
Secure Embedded Control Systems
Applications requiring configuration confidentiality - payment terminals, access-control hardware, proprietary industrial equipment - use the A54SX72A-FFGG256 because its antifuse bitstream physically cannot be read back after programming, unlike SRAM FPGA bitstreams that traverse an external flash and can be captured at boot. The 2.5V single-rail operation and 0C to +70C range cover commercial embedded environments, and the 203 I/Os interface directly to sensors, keypads, and communication PHYs. Instant power-up without configuration time also shortens cold-start latency for always-on security devices. The trade-off is field non-upgradability: any logic change requires a new programmed device, so firmware-facing functions should remain in an attached microcontroller.
Recommended
Recommended Products Summary
Engineering reference data for A54SX72A-FFGG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX72A-FFGG256A | A54SX72A-FGG256 | A54SX72A-FGG256I |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-BGA (FBGA-256) | 256-BGA (FBGA-256) - same | 256-BGA (FBGA-256 family) | 256-BGA (FBGA-256 family) |
| System Gates | 108,000 | 108,000 | 108,000 | 108,000 |
| User I/O | 203 | 203 | 203 | 203 |
| Supply Voltage | 2.25 V to 2.75 V | 2.25 V to 2.75 V | 2.25 V to 2.75 V | 2.25 V to 2.75 V |
| Max Clock Frequency | 172 MHz (FF grade) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | 0C to +70C | 0C to +70C | [DATA_NEEDED] | Industrial grade (extended) |
| RoHS / Lead Free | Compliant / Lead Free | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Packaging | Tray | Tray | Tray | Tray |
Key Differentiators
- One-time-programmable antifuse security (vs A54SX72A-FGG256I)
- Instant power-up with no boot device (vs A54SX72A-FFGG256A)
- High I/O density per package area (vs A54SX72A-PQG208)
Design Notes
Power the A54SX72A-FFGG256 from a regulated 2.5V rail that stays within 2.25V to 2.75V under all load transients; worst-case timing is specified at the 2.25V corner, so undershoot below that invalidates your static timing report. Place one 10uF bulk capacitor plus multiple 0.1uF ceramics around the 256-ball BGA perimeter, one decoupling capacitor per VDD ball group. Estimated: antifuse static current is very low compared with SRAM FPGAs, so total budget is dominated by dynamic switching - run the Microchip power calculator with your post-layout toggle rates.
This device is one-time programmable: once antifuses are blown, the part cannot be erased or reused. Always complete pin assignment, timing closure, and design review in Microchip Libero SoC before committing a device, and program one prototype first. Also remember the four quadrant clock balls (A, B, C, D for bottom-left, bottom-right, top-left, top-right quadrants per the SX-A datasheet) - clock signals entering the wrong quadrant cannot reach the target logic region efficiently, degrading timing.
The 256-ball FBGA uses a 1.0 mm ball pitch; fan out with via-in-pad or dogbone escapes on a minimum 4-layer board, dedicating one internal layer to a solid ground plane to return I/O currents and control crosstalk on the 203 user I/Os. Keep series termination resistors within 10 mm of fast-switching banks and match lengths on parallel buses. Verify the exact land pattern dimensions against the package drawing in the Microchip SX-A family datasheet before releasing the PCB fabrication package.
At 172 MHz-class internal clocks with fast output edges, use the I/O bank drive-strength and slew settings in Libero SoC to limit edge rates on board traces; overdriving unnecessarily causes overshoot and EMI. For long parallel buses, terminate with series resistors at the driver and check stub lengths to keep reflections within the 3.3V-tolerant input thresholds. Simulate critical nets with an IBIS model from Microchip if your traces exceed roughly 10 cm.
Compliance Information
Verified data states Lead Free Status: Lead Free and RoHS Status: RoHS Compliant. REACH, halogen-free, and conflict-minerals declarations were not present in the verified data.
