AM263P2-Q1 - Dual-Core 400MHz Automotive MCU | Texas Instruments
MPN： AM263P2-Q1 ✓ 啟用中AM263P2-Q1 概覽
A microcontroller (MCU) is a compact integrated circuit that contains a processor core, memory, and programmable input/output peripherals. The AM263P2-Q1 sits in the Sitara family of TI microcontrollers, positioned specifically for vehicle control systems where deterministic real-time performance is critical. Its dual-core architecture allows lockstep or dual-core operation for functional safety configurations.
Key features include two Arm Cortex-R5F cores running at up to 400MHz, providing high-performance computation for closed-loop control loops. The device integrates industrial communications subsystems (PRU-ICSS) for protocols like EtherCAT, and supports opTI-flash for executing code directly from flash. Its 256KB on-chip flash enables real-time control algorithms without external memory.
Technically, the AM263P2-Q1 offers a 32-bit data bus and supports multiple interface options, including CAN, UART, SPI, and I2C. The functional safety features and wide operating temperature range [data needed] make it ideal for automotive powertrain, chassis, and body electronics. The 324-NFBGA package provides a compact footprint with high pin count for peripheral-rich designs.
Typical applications include motor control for electric power steering, battery management systems, and industrial communication gateways. The device's real-time control co-processors (R5F cores) can execute PWM generation and ADC sampling with minimal latency.
When designing, ensure proper decoupling capacitors on all power rails and follow TI's layout recommendations for the thermal pad. Use the available JTAG interface for debugging and programming via the 20-pin emulation header.
直接替換替代品，適用於 AM263P2-Q1 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： AM263P2-Q1 （相同外形與佔位） — 差異在於 Core Processor, Flash Memory, Series.
AM263P4-Q1
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →AM263P1-Q1
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
AM263P2-Q1 最大額定值與電氣特性
| Core Type | Arm Cortex-R5F |
| Number of Cores | 2 (Dual-core) |
| Max Clock Speed | 400 MHz |
| Flash Memory | 256 KB |
| Package Type | 324-NFBGA |
| Package Size | 15x15 mm |
| 腳位數 | 324 |
| 資料匯流排寬度 | 32-bit |
| Series | Sitara |
| 安裝類型 | Surface Mount |
| Automotive Grade | AEC-Q100 qualified |
| RoHS 狀態 | unknown |
AM263P2-Q1 15x15 mm 腳位配置指南
AM263P2-Q1（15x15 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： AM263P2-Q1.
請參閱 資料表 以查看完整腳位配置。
典型應用
AM263P2-Q1 適用於 6 應用s: Electric Power Steering (EPS) Motor Control, Automotive Battery Management System, Industrial Communication Gateway, Onboard Charger (OBC) Control, Body Control Module, Advanced Driver Assistance Systems (ADAS) Sensor Fusion.
Electric Power Steering (EPS) Motor Control
The AM263P2-Q1 dual-core R5F architecture at 400MHz enables high-frequency PWM control for EPS motors. Its real-time control peripherals provide deterministic gate drive signals, while 256KB flash stores the control algorithm. The AEC-Q100 qualification ensures reliability in harsh under-hood environments. A companion DRV8353SRTAR driver interfaces with the MCU for three-phase motor commutation.
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Automotive Battery Management System
The AM263P2-Q1 manages battery cell monitoring and balancing in electric vehicles. Its high-speed Cortex-R5F cores process voltage and current data from BQ79616 battery monitors, ensuring real-time safety decisions. The 324-NFBGA package fits compact BMS boards, and the dual-core architecture allows redundant computation for functional safety. The device supports CAN communication with the vehicle controller.
推薦
Industrial Communication Gateway
The AM263P2-Q1's PRU-ICSS subsystem enables real-time industrial protocols like EtherCAT and PROFINET, making it ideal for gateways. At 400MHz, it handles data packets with low latency, while the dual-core design separates protocol processing from application logic. The MCU interfaces with DP83TD555J-Q1 Ethernet PHY for wireline communication, and its 256KB flash stores firmware for flexible protocol stacks.
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Onboard Charger (OBC) Control
The AM263P2-Q1 controls power conversion in onboard chargers, orchestrating AC/DC and DC/DC stages with high-precision PWM at 400MHz. Its dual cores handle multiple control loops concurrently, while the AEC-Q100 grade ensures operation at automotive temperatures. The MCU coordinates with LMG3422R030RQZT GaN power devices for high-efficiency switching, and its integrated ADCs sample voltage/current feedback.
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Body Control Module
The AM263P2-Q1 serves as the central controller for body electronics, managing windows, lights, and door locks. Its multiple UART/SPI interfaces connect to switch sensors and actuators, while the dual-core architecture provides redundancy for safety-critical functions. The MCU's 256KB flash stores configurable logic, and its 324-NFBGA package enables dense integration in the cabin ECU. CAN communication via TCAN337G handles network commands.
推薦
Advanced Driver Assistance Systems (ADAS) Sensor Fusion
The AM263P2-Q1 processes sensor data for ADAS, fusing radar and camera inputs at 400MHz. Its dual R5F cores execute real-time object detection algorithms, while the PRU-ICSS enables low-latency data capture from multiple sources. The AEC-Q100 qualification supports automotive reliability. Together with TIA3MV, it provides a robust computing platform for safety-critical perception tasks.
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推薦產品摘要
工程參考資料，適用於 AM263P2-Q1 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | AM263P4-Q1 | AM263P1-Q1 | AM2632-Q1 |
|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 324-NFBGA (15x15 mm) | 324-NFBGA (15x15 mm) - same | 324-NFBGA (15x15 mm) - same | 324-NFBGA (15x15 mm) - same |
主要差異化特點
- Dual-core performance with functional safety (對比AM263P1-Q1)
- Mid-range core count for balanced cost (對比AM263P4-Q1)
- Confirmed pin compatibility in AM263Px family (對比AM2632-Q1)
設計說明
Ensure clean power delivery to the AM263P2-Q1 by placing 100nF decoupling capacitors close to each supply pin. Use a 4.7uF bulk capacitor on the main VDD rail to handle transient currents. All digital and analog supplies should be separated via ferrite beads to prevent noise coupling.
For the 324-NFBGA package, route high-speed signals with controlled impedance (50-ohm) and keep trace lengths matched. The thermal pad must be connected to ground with multiple vias to dissipate heat. Refer to TI's layout guidelines for the AM263Px family to minimize signal integrity issues.
Avoid floating unused pins; configure them as inputs with pull-ups or pull-downs to prevent excessive current. Ensure the JTAG debug pins are not shared with other peripherals during development. Also, verify the boot mode selection pins are correctly set to avoid accidental erase of the flash.
合規資訊
AEC-Q100 qualified per TI product page. Other compliance status is not available in the provided data.
