ATSAM3S1BA-MUR - 64MHz Cortex-M3 MCU, 64KB Flash | Microchip
MPN： ATSAM3S1BA-MUR ✗ 停產ATSAM3S1BA-MUR 概覽
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, memory, and peripherals into one chip, forming the lowest programmable layer of an embedded system hierarchy: MCU -> embedded processor -> semiconductor device. The SAM3S family belongs to Microchip (formerly Atmel) ARM-based flash MCU portfolio and sits in the mainstream 32-bit class between small Cortex-M0 parts and higher-performance Cortex-M4 devices.
Key features of the ATSAM3S1BA-MUR include the ARM Cortex-M3 core with 64MHz maximum clock, 64KB (64K x 8) of in-system-programmable Flash, 16KB of SRAM, and an integrated analog front end: a 10-bit ADC with up to 10 channels and two 12-bit DACs (per the ATSAM3S1BA-AUR variant data for the same die). Peripheral set includes DMA, I2S, PWM, brown-out detect/reset, power-on reset, and watchdog timer.
Technically, the device operates over an industrial temperature range of -40C to +85C and a supply range of 1.8V/3.3V nominal (1.62V to 3.6V). The parallel data capture mode on the PIOs collects data from external devices not compliant with standard memory read protocols, such as low-cost image sensors, with DMA offloading transfers from the CPU. The 64-QFN exposed-pad package improves thermal and ground performance for surface-mount assembly.
Typical applications include industrial automation, consumer electronics, medical devices, IoT sensor nodes, and motor control - domains cited by distributors for this exact part.
A key design consideration is supply-chain status: multiple distributors list this part as discontinued, so new designs should evaluate pin-compatible SAM3S family upgrades or stock buffer quantities before layout freeze.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with data verified as of 2026-09-19.
直接替換替代品，適用於 ATSAM3S1BA-MUR — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： ATSAM3S1BA-MUR （相同外形與佔位） — 差異在於 Package, Flash Memory, Operating Temperature, Peripherals, RoHS Status.
ATSAM3S1BA-MU
✅ 直接替換聯絡詢價
查看資料表 →ATSAM3S1BB-MU
✅ 直接替換聯絡詢價
查看資料表 →ATSAM3S2BA-MU
✅ 直接替換聯絡詢價
查看資料表 →ATSAM3S4BA-MU
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ATSAM3N4BA-MU
✅ 直接替換聯絡詢價
查看資料表 →ATSAM3S1BA-MUR 最大額定值與電氣特性
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-bit single-core |
| 最大時脈頻率 | 64 MHz |
| Flash Memory | 64 KB (64K x 8) |
| SRAM | 16 KB |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Nominal Supply | 1.8 V / 3.3 V |
| 工作溫度 | -40C to +85C |
| 封裝 | 64-VFQFN (9x9 mm) Exposed Pad |
| 安裝類型 | Surface Mount |
| ADC Resolution | 10-bit (up to 10 channels) |
| DAC | 2 x 12-bit |
| Peripherals | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT |
| Series | SAM3S |
| Packaging | Tape & Reel (TR) |
ATSAM3S1BA-MUR 64-vfqfn (9x9 mm) exposed pad 腳位配置指南
ATSAM3S1BA-MUR（64-vfqfn (9x9 mm) exposed pad 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： ATSAM3S1BA-MUR.
請參閱 資料表 以查看完整腳位配置。
典型應用
ATSAM3S1BA-MUR 適用於 6 應用s: Industrial Automation, IoT Sensor Nodes, Medical Devices, Motor Control, Consumer Electronics, Image Sensor Data Capture.
Industrial Automation
The ATSAM3S1BA-MUR fits industrial automation nodes that need deterministic 32-bit processing with analog sensing: the 64MHz ARM Cortex-M3 core handles control loops, while the 10-bit ADC with up to 10 channels digitizes sensor inputs such as potentiometers, pressure, and temperature signals. The PWM peripheral drives actuators and motor drivers, and the DMA controller keeps data movement off the CPU for consistent loop timing. Operating from a 1.8V/3.3V nominal supply (1.62V to 3.6V) and rated -40C to +85C, it survives typical factory-floor temperature conditions in the 64-QFN exposed-pad package, whose thermal pad also improves ground integrity for mixed-signal boards.
推薦
IoT Sensor Nodes
For IoT sensor nodes, the ATSAM3S1BA-MUR provides a balance of compute and power efficiency: the Cortex-M3 at 64MHz executes protocol stacks such as Modbus or custom RF link firmware within its 64KB Flash and 16KB SRAM, while the wide 1.62V to 3.6V supply range allows direct operation from battery-backed rails. The DMA plus parallel data capture on the PIOs lets low-cost external sensors stream data without CPU intervention, extending sleep time and battery life. Distributors (Veswin) explicitly position this part for IoT devices, and the 64-QFN 9x9 mm footprint suits compact node hardware where the exposed pad aids thermal dissipation and EMI grounding.
推薦
Medical Devices
Medical monitoring equipment benefits from the ATSAM3S1BA-MUR analog subsystem: the 10-bit, 10-channel ADC samples physiological sensors while the two 12-bit DACs generate calibration or stimulation outputs, a combination Microchip USA cites for medical device usage of this family. The brown-out detect/reset and power-on reset peripherals support safe state recovery in duty-cycled patient-adjacent equipment, and the -40C to +85C industrial rating covers sterilization-adjacent ambient conditions. Firmware for filtering and protocol handling fits comfortably in 64KB Flash with 16KB SRAM, and the 64MHz core leaves timing margin for real-time alarm logic in the 64-QFN surface-mount package.
推薦
Motor Control
The ATSAM3S1BA-MUR serves small motor control applications through its PWM peripheral and fast Cortex-M3 core: the 64MHz clock provides the resolution needed for center-aligned PWM at audible-suppressed frequencies, while the 10-bit ADC feeds back current and position measurements with up to 10 input channels for multi-phase or multi-motor sensing. DMA transfers ADC results without CPU loading, keeping the control loop jitter low. Veswin explicitly lists motor control among target uses for this exact MPN. The exposed-pad 64-QFN package helps dissipate driver-stage proximity heat, and the wide 1.62V to 3.6V operating range simplifies integration with 3.3V gate-driver logic.
推薦
Consumer Electronics
Consumer product designs use the ATSAM3S1BA-MUR where touch, display, or audio-adjacent features need a 32-bit MCU: the I2S interface connects to digital audio codecs, the 12-bit DACs drive analog outputs such as tones or bias levels, and the parallel PIO capture mode interfaces image sensors that do not follow standard memory read protocols - data Microchip documents for the SAM3S family. At 64MHz with 64KB Flash and 16KB SRAM, the device covers appliance UIs, small displays, and accessory devices. The 3.3V nominal supply integrates directly with common consumer board rails, and tape-and-reel ATSAM3S1BA-MUR packaging supports high-volume SMT assembly.
推薦
Image Sensor Data Capture
A distinctive SAM3S capability relevant to the ATSAM3S1BA-MUR is the parallel data capture mode on the PIOs, which collects data from external devices not compliant with standard memory read protocols, such as low-cost image sensors; DMA then transfers frames to SRAM offloading the CPU, per Microchip's official product documentation. With 16KB SRAM the part handles line-based or small-region capture and streaming, and the 64MHz core performs framing, compression pre-processing, or forwarding over serial links. The 10-channel ADC simultaneously samples analog telemetry (light level, temperature), making the 64-QFN ATSAM3S1BA-MUR a compact single-chip front end for simple vision modules.
推薦
推薦產品摘要
工程參考資料，適用於 ATSAM3S1BA-MUR — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | ATSAM3S1BA-MU | ATSAM3S1BB-MU | ATSAM3S2BA-MU | ATSAM3N4BA-MU |
|---|---|---|---|---|---|
| Package | 64-VFQFN (9x9) Exposed Pad | 64-VFQFN (9x9) Exposed Pad - same | 64-QFN EP - same | 64-QFN - same | 64-QFN - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Clock | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 96 MHz |
| Flash Memory | 64 KB | 64 KB | 64 KB | 128 KB | 128 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.8 V / 3.3 V | 1.8 V / 3.3 V | 1.62 V to 3.6 V |
| DAC / I2S | 2 x 12-bit DAC, I2S | 2 x 12-bit DAC, I2S | Yes (SAM3S family) | Yes (SAM3S family) | No DAC / No I2S |
主要差異化特點
- Integrated audio and analog blocks (對比ATSAM3N4BA-MU)
- Memory-scalable pin-compatible upgrade path (對比ATSAM3S2BA-MU)
- Parallel sensor capture with DMA (對比ATSAM3S1BA-MU)
設計說明
Design the 3.3V rail to stay within the 1.62V to 3.6V operating window under all load transients; the SAM3S family specifies 1.8V/3.3V nominal operation. Decouple each VDD/VDDIO pin with 100nF ceramics placed within 2mm of the pin, plus bulk 4.7uF-10uF near the package. The exposed pad on the 64-QFN must be soldered to a ground array - it is the primary ground and thermal path, not an option.
For the 9x9 mm 64-QFN exposed pad, create a solder-mask-defined landing pattern per the SAM3S datasheet footprint drawing and a via array (5x5 or denser) under the pad tied to the ground plane to limit paste voiding. Because this is a legacy EOL part, ensure your CAD library footprint matches the datasheet exactly before re-spinning old boards; LQFP (ATSAM3S1BA-AUR) boards cannot accept the QFN without a redesign.
The largest program risk is sourcing, not electrical: this MPN is listed as Discontinued by some distributors (SSFKG) and available only through last-time-buy channels (Rochester Electronics offers ATSAM3S1BA-MU). Before committing production, qualify ATSAM3S2BA-MU (128KB Flash, pin-compatible) or ATSAM3S4BA-MU as supply-chain alternates, and buy sufficient buffer stock of the original. Do not substitute SAM3N parts in designs using the 12-bit DACs or I2S.
合規資訊
Jotrin listing references 'QFN GREEN IND TEMPMRL', suggesting green (halogen-free) packaging, but explicit RoHS/REACH declarations were not present in the provided verified data; confirm via Microchip's environmental page.
