CY7C1021DV33-10BVXIT - 1Mbit (64Kx16) 10ns Async SRAM | Infineon
MPN： CY7C1021DV33-10BVXIT ✓ 啟用中CY7C1021DV33-10BVXIT 概覽
An asynchronous SRAM (static random-access memory) is a high-speed volatile memory that does not require a clock signal - read and write operations are triggered directly by chip-enable (CE), output-enable (OE), and write-enable (WE) inputs. SRAM sits in the memory hierarchy above DRAM for speed and below cache for cost/density, and the asynchronous (or "async" part forms the typical choice for direct-mapped buffers in microcontroller and DSP systems. The CY7C1021DV33 family adds an automatic power-down feature that drops ICC to a few microamps when deselected, making it well-suited to battery-powered or power-aware industrial systems.
Key features of the CY7C1021DV33-10BVXIT include 10 ns address access time, 10 ns output enable access time, JEDEC-compatible center-power/center-ground pinout, TTL-compatible I/O, and equal read/write cycle times. The 48-VFBGA (6x8) package is only 6x8 mm, giving the densest footprint option in the family alongside the 44-pin 400-mil SOJ and 44-pin TSOP II packages - all sharing the same functional pinout per JEDEC standard.
Typical applications include industrial control buffers, networking line cards, automotive infotainment buffers, point-of-sale terminals, set-top box working memory, and microcontroller/DSP scratch-pad memory. The wide x16 data bus minimizes glue logic when paired with 16-bit microcontrollers such as the 80C186, 68HC16, and DSP families.
When designing with this device, place a 0.1 uF decoupling capacitor on each VCC/ground pair and follow JEDEC standard PCB layout for 48-VFBGA. The automatic power-down feature reduces standby current to 5 mA typical when CE# is high; use this to extend battery life in portable designs.
直接替換替代品，適用於 CY7C1021DV33-10BVXIT — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
CY7C1021DV33-10BVXI
✅ 直接替換📋 參考替代品（不在目錄中）
CY7C1021DV33-8BVXIT
✅ 直接替換📋 參考替代品（不在目錄中）
CY7C1021DV33-12BVXIT
✅ 直接替換📋 參考替代品（不在目錄中）
CY7C1021DV33-10ZSXIT
✅ 直接替換📋 參考替代品（不在目錄中）
CY7C1021DV33-10BVJIT
✅ 直接替換📋 參考替代品（不在目錄中）
CY7C1021DV33-10BVXIT 最大額定值與電氣特性
| 記憶體類型 | Asynchronous SRAM (Static RAM) |
| Memory Organization | 64K x 16 (1 Mbit total) |
| Address Access Time (tAA) | 10 ns |
| Output Enable Access Time (tOE) | 10 ns |
| Supply Voltage (VCC) | 3.0 V to 3.6 V |
| 介面類型 | Parallel |
| 工作溫度範圍 | -40 C to +85 C (Industrial, "IT" suffix) |
| 封裝 | 48-ball VFBGA (6 x 8 mm) |
| I/O Standard | TTL-compatible |
| Automatic Power-Down | Yes (CE# high) |
| 安裝類型 | Surface Mount (BGA) |
| MSL 等級 | 3 (per JEDEC J-STD-020) |
| RoHS 狀態 | Pb-free, RoHS compliant |
| Lead-Free | Yes |
CY7C1021DV33-10BVXIT 48-ball vfbga (6 x 8 mm) 腳位配置指南
CY7C1021DV33-10BVXIT（48-ball vfbga (6 x 8 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： CY7C1021DV33-10BVXIT.
請參閱 資料表 以查看完整腳位配置。
典型應用
CY7C1021DV33-10BVXIT 適用於 6 應用s: Industrial Control Buffer Memory, Networking Line Card Packet Buffer, Automotive Infotainment Working Memory, Point-of-Sale (POS) Terminal Memory, DSP Scratch-Pad Memory, Set-Top Box Working Memory.
Industrial Control Buffer Memory
The CY7C1021DV33-10BVXIT serves as high-speed working memory in industrial PLC and HMI control systems. Its 10 ns access time keeps pace with 100 MHz 16-bit microcontrollers, while the industrial -40 C to +85 C rating withstands factory floor temperature swings. The 64K x 16 organization maps directly onto 16-bit data buses (80C186, 68HC16), eliminating bus-multiplexing logic. The automatic CE# power-down feature reduces standby current to a few microamps during scan-cycle idle periods, which is significant in 24/7 factory automation where energy budgets are monitored.
推薦
Networking Line Card Packet Buffer
In networking line cards and routers, the CY7C1021DV33-10BVXIT functions as a fast packet-buffer or lookup-table SRAM. The 10 ns tAA supports 100 Mbps Fast Ethernet and lower-speed Gigabit MAC interfaces with comfortable timing margin. The 3.3 V supply aligns with standard network-processor I/O rails, eliminating level shifters. The 48-VFBGA package's small 6x8 mm footprint allows dense placement adjacent to PHY/MAC ASICs on multi-layer PCBs. The automatic power-down keeps idle line cards within their thermal envelope.
推薦
Automotive Infotainment Working Memory
Automotive infotainment head units and instrument clusters use the CY7C1021DV33-10BVXIT as display-buffer and audio-DSP scratch memory. The 1 Mbit / 64K x 16 capacity holds QVGA framebuffers or audio sample blocks comfortably. The 48-VFBGA package survives under-hood and dashboard thermal cycles when properly PCB-mounted. The TTL-compatible I/O interfaces directly to 3.3 V infotainment SoCs. The "IT" industrial-temperature grade is sufficient for cabin environments; for under-hood ECU use, an automotive-qualified variant is recommended.
推薦
Point-of-Sale (POS) Terminal Memory
POS terminals use the CY7C1021DV33-10BVXIT as transaction and display memory. The 10 ns access time handles barcode-scanner input FIFOs, display-refresh buffers, and encryption-key scratchpads without latency. The 3.3 V supply suits battery-powered mobile POS readers, where the automatic CE# power-down extends battery life between transactions. The 48-VFBGA package fits inside slim handheld enclosures where SOJ or TSOP would not. Reliability from the Infineon (formerly Cypress) SRAM line is field-proven across millions of deployed POS units.
推薦
DSP Scratch-Pad Memory
Digital signal processors (DSPs) for audio effects, motor control, and telecommunications use the CY7C1021DV33-10BVXIT as external scratch-pad memory. The 10 ns tAA matches DSP core cycle times at 100 MHz instruction rates, allowing zero-wait-state operation for coefficients and sample blocks. The 64K x 16 organization fits 16-bit DSP data widths (TMS320, ADSP-21xx) without bus conversion. The 3.3 V supply is standard for low-power DSP families. The TTL interface simplifies board layout in mixed-signal DSP designs.
推薦
Set-Top Box Working Memory
Set-top boxes (STBs) and digital TV receivers use the CY7C1021DV33-10BVXIT as MPEG decoder scratchpad and channel-buffer memory. The 10 ns access time supports real-time video stream parsing without buffer underruns. The 1 Mbit density holds one MPEG-2 frame slice plus PSI tables. The 48-VFBGA package's compact 6x8 mm footprint fits inside slim STB enclosures where board area is at a premium. The 3.3 V supply aligns with mainstream STB SoC rails. The automatic power-down reduces standby power for Energy Star compliance.
推薦
推薦產品摘要
工程參考資料，適用於 CY7C1021DV33-10BVXIT — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | CY7C1021DV33-10BVXI | CY7C1021DV33-8BVXIT | CY7C1021DV33-12BVXIT | CY7C1021DV33-10BVJIT |
|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | 48-VFBGA (6x8) | 48-VFBGA (6x8) - same | 48-VFBGA (6x8) - same | 48-VFBGA (6x8) - same | 48-VFBGA (6x8) - same |
| Density | 1 Mbit (64K x 16) | 1 Mbit (64K x 16) | 1 Mbit (64K x 16) | 1 Mbit (64K x 16) | 1 Mbit (64K x 16) |
| Access Time (tAA) | 10 ns | 10 ns | 8 ns (faster) | 12 ns (slower) | 10 ns |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (IT) | -40 C to +85 C (I) | -40 C to +85 C (IT) | -40 C to +85 C (IT) | -40 C to +85 C (IT) |
| Packaging | Tape & Reel (T&R) | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
| Automatic Power-Down | Yes | Yes | Yes | Yes | Yes |
主要差異化特點
- Industrial temperature grade and Tape & Reel packaging (對比CY7C1021DV33-10BVXI)
- Faster access time than -12 grade for 100 MHz buses (對比CY7C1021DV33-12BVXIT)
- Slower than -8 grade but sufficient margin for most designs (對比CY7C1021DV33-8BVXIT)
設計說明
The CY7C1021DV33-10BVXIT requires a single 3.3 V supply. Place a 0.1 uF ceramic decoupling capacitor on each VCC ball and a bulk 10 uF tantalum or ceramic capacitor on the supply rail close to the device. The automatic power-down feature reduces standby current to [DATA_NEEDED: typical ISB1 value] when CE# is high; this should be verified against the datasheet for power-budget calculations in battery-backed designs.
The 48-VFBGA (6x8) package requires 4-layer or higher PCB stack-up with microvia or via-in-pad technology for reliable BGA soldering. Follow JEDEC J-STD-020 MSL-3 handling procedures: bake the parts at 125°C for 24 hours if the humidity indicator card shows >10% RH. Use a reflow profile with peak temperature 245°C (Pb-free) and time-above-liquidus of 60-90 seconds per IPC J-STD-020.
Do not confuse the CY7C1021DV33 (3.3 V, this part) with the CY7C1021CV33 (legacy 3.3 V) or CY7C1021 (5 V) versions - voltage and timing differ. The "V33" suffix in the part number denotes 3.3 V operation. Also note that the "BV" package code is 48-VFBGA; "SO" denotes 400-mil SOJ; "ZS" denotes TSOP II. Cross-family substitution requires PCB rework.
合規資訊
Pb-free / RoHS compliant per Infineon product page. Industrial temperature grade only; not AEC-Q100 qualified - this is not an automotive-qualified part. For automotive applications requiring AEC-Q100, consult Infineon automotive-grade SRAM portfolio.
