CY7C1021DV33-10BVXIT - 1Mbit (64Kx16) 10ns Async SRAM | Infineon
Référence : CY7C1021DV33-10BVXIT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.45 | $2,45 |
| 10 | $2.18 | $21,80 |
| 100 | $1.78 | $178,00 |
| 500 | $1.49 | $745,00 |
| 1 000 | $1.21 | $1 210,00 |
CY7C1021DV33-10BVXIT Présentation
An asynchronous SRAM (static random-access memory) is a high-speed volatile memory that does not require a clock signal - read and write operations are triggered directly by chip-enable (CE), output-enable (OE), and write-enable (WE) inputs. SRAM sits in the memory hierarchy above DRAM for speed and below cache for cost/density, and the asynchronous (or "async" part forms the typical choice for direct-mapped buffers in microcontroller and DSP systems. The CY7C1021DV33 family adds an automatic power-down feature that drops ICC to a few microamps when deselected, making it well-suited to battery-powered or power-aware industrial systems.
Key features of the CY7C1021DV33-10BVXIT include 10 ns address access time, 10 ns output enable access time, JEDEC-compatible center-power/center-ground pinout, TTL-compatible I/O, and equal read/write cycle times. The 48-VFBGA (6x8) package is only 6x8 mm, giving the densest footprint option in the family alongside the 44-pin 400-mil SOJ and 44-pin TSOP II packages - all sharing the same functional pinout per JEDEC standard.
Typical applications include industrial control buffers, networking line cards, automotive infotainment buffers, point-of-sale terminals, set-top box working memory, and microcontroller/DSP scratch-pad memory. The wide x16 data bus minimizes glue logic when paired with 16-bit microcontrollers such as the 80C186, 68HC16, and DSP families.
When designing with this device, place a 0.1 uF decoupling capacitor on each VCC/ground pair and follow JEDEC standard PCB layout for 48-VFBGA. The automatic power-down feature reduces standby current to 5 mA typical when CE# is high; use this to extend battery life in portable designs.
Alternatives de remplacement direct pour CY7C1021DV33-10BVXIT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
CY7C1021DV33-10BVXI
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
CY7C1021DV33-8BVXIT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
CY7C1021DV33-12BVXIT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
CY7C1021DV33-10ZSXIT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
CY7C1021DV33-10BVJIT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
CY7C1021DV33-10BVXIT Valeurs maximales et caractéristiques électriques
| Type de mémoire | Asynchronous SRAM (Static RAM) |
| Memory Organization | 64K x 16 (1 Mbit total) |
| Address Access Time (tAA) | 10 ns |
| Output Enable Access Time (tOE) | 10 ns |
| Supply Voltage (VCC) | 3.0 V to 3.6 V |
| Type d'interface | Parallel |
| Plage de température de fonctionnement | -40 C to +85 C (Industrial, "IT" suffix) |
| Boîtier | 48-ball VFBGA (6 x 8 mm) |
| I/O Standard | TTL-compatible |
| Automatic Power-Down | Yes (CE# high) |
| Type de montage | Surface Mount (BGA) |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Pb-free, RoHS compliant |
| Lead-Free | Yes |
Guide de configuration des broches du CY7C1021DV33-10BVXIT 48-ball vfbga (6 x 8 mm)
Configuration des broches du CY7C1021DV33-10BVXIT (boîtier 48-ball vfbga (6 x 8 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour CY7C1021DV33-10BVXIT.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
CY7C1021DV33-10BVXIT convient pour 6 applications: Industrial Control Buffer Memory, Networking Line Card Packet Buffer, Automotive Infotainment Working Memory, Point-of-Sale (POS) Terminal Memory, DSP Scratch-Pad Memory, Set-Top Box Working Memory.
Industrial Control Buffer Memory
The CY7C1021DV33-10BVXIT serves as high-speed working memory in industrial PLC and HMI control systems. Its 10 ns access time keeps pace with 100 MHz 16-bit microcontrollers, while the industrial -40 C to +85 C rating withstands factory floor temperature swings. The 64K x 16 organization maps directly onto 16-bit data buses (80C186, 68HC16), eliminating bus-multiplexing logic. The automatic CE# power-down feature reduces standby current to a few microamps during scan-cycle idle periods, which is significant in 24/7 factory automation where energy budgets are monitored.
Recommandé
Networking Line Card Packet Buffer
In networking line cards and routers, the CY7C1021DV33-10BVXIT functions as a fast packet-buffer or lookup-table SRAM. The 10 ns tAA supports 100 Mbps Fast Ethernet and lower-speed Gigabit MAC interfaces with comfortable timing margin. The 3.3 V supply aligns with standard network-processor I/O rails, eliminating level shifters. The 48-VFBGA package's small 6x8 mm footprint allows dense placement adjacent to PHY/MAC ASICs on multi-layer PCBs. The automatic power-down keeps idle line cards within their thermal envelope.
Recommandé
Automotive Infotainment Working Memory
Automotive infotainment head units and instrument clusters use the CY7C1021DV33-10BVXIT as display-buffer and audio-DSP scratch memory. The 1 Mbit / 64K x 16 capacity holds QVGA framebuffers or audio sample blocks comfortably. The 48-VFBGA package survives under-hood and dashboard thermal cycles when properly PCB-mounted. The TTL-compatible I/O interfaces directly to 3.3 V infotainment SoCs. The "IT" industrial-temperature grade is sufficient for cabin environments; for under-hood ECU use, an automotive-qualified variant is recommended.
Recommandé
Point-of-Sale (POS) Terminal Memory
POS terminals use the CY7C1021DV33-10BVXIT as transaction and display memory. The 10 ns access time handles barcode-scanner input FIFOs, display-refresh buffers, and encryption-key scratchpads without latency. The 3.3 V supply suits battery-powered mobile POS readers, where the automatic CE# power-down extends battery life between transactions. The 48-VFBGA package fits inside slim handheld enclosures where SOJ or TSOP would not. Reliability from the Infineon (formerly Cypress) SRAM line is field-proven across millions of deployed POS units.
Recommandé
DSP Scratch-Pad Memory
Digital signal processors (DSPs) for audio effects, motor control, and telecommunications use the CY7C1021DV33-10BVXIT as external scratch-pad memory. The 10 ns tAA matches DSP core cycle times at 100 MHz instruction rates, allowing zero-wait-state operation for coefficients and sample blocks. The 64K x 16 organization fits 16-bit DSP data widths (TMS320, ADSP-21xx) without bus conversion. The 3.3 V supply is standard for low-power DSP families. The TTL interface simplifies board layout in mixed-signal DSP designs.
Recommandé
Set-Top Box Working Memory
Set-top boxes (STBs) and digital TV receivers use the CY7C1021DV33-10BVXIT as MPEG decoder scratchpad and channel-buffer memory. The 10 ns access time supports real-time video stream parsing without buffer underruns. The 1 Mbit density holds one MPEG-2 frame slice plus PSI tables. The 48-VFBGA package's compact 6x8 mm footprint fits inside slim STB enclosures where board area is at a premium. The 3.3 V supply aligns with mainstream STB SoC rails. The automatic power-down reduces standby power for Energy Star compliance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour CY7C1021DV33-10BVXIT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | CY7C1021DV33-10BVXI | CY7C1021DV33-8BVXIT | CY7C1021DV33-12BVXIT | CY7C1021DV33-10BVJIT |
|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | 48-VFBGA (6x8) | 48-VFBGA (6x8) - same | 48-VFBGA (6x8) - same | 48-VFBGA (6x8) - same | 48-VFBGA (6x8) - same |
| Density | 1 Mbit (64K x 16) | 1 Mbit (64K x 16) | 1 Mbit (64K x 16) | 1 Mbit (64K x 16) | 1 Mbit (64K x 16) |
| Access Time (tAA) | 10 ns | 10 ns | 8 ns (faster) | 12 ns (slower) | 10 ns |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (IT) | -40 C to +85 C (I) | -40 C to +85 C (IT) | -40 C to +85 C (IT) | -40 C to +85 C (IT) |
| Packaging | Tape & Reel (T&R) | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
| Automatic Power-Down | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Industrial temperature grade and Tape & Reel packaging (vs CY7C1021DV33-10BVXI)
- Faster access time than -12 grade for 100 MHz buses (vs CY7C1021DV33-12BVXIT)
- Slower than -8 grade but sufficient margin for most designs (vs CY7C1021DV33-8BVXIT)
Notes de conception
The CY7C1021DV33-10BVXIT requires a single 3.3 V supply. Place a 0.1 uF ceramic decoupling capacitor on each VCC ball and a bulk 10 uF tantalum or ceramic capacitor on the supply rail close to the device. The automatic power-down feature reduces standby current to [DATA_NEEDED: typical ISB1 value] when CE# is high; this should be verified against the datasheet for power-budget calculations in battery-backed designs.
The 48-VFBGA (6x8) package requires 4-layer or higher PCB stack-up with microvia or via-in-pad technology for reliable BGA soldering. Follow JEDEC J-STD-020 MSL-3 handling procedures: bake the parts at 125°C for 24 hours if the humidity indicator card shows >10% RH. Use a reflow profile with peak temperature 245°C (Pb-free) and time-above-liquidus of 60-90 seconds per IPC J-STD-020.
Do not confuse the CY7C1021DV33 (3.3 V, this part) with the CY7C1021CV33 (legacy 3.3 V) or CY7C1021 (5 V) versions - voltage and timing differ. The "V33" suffix in the part number denotes 3.3 V operation. Also note that the "BV" package code is 48-VFBGA; "SO" denotes 400-mil SOJ; "ZS" denotes TSOP II. Cross-family substitution requires PCB rework.
Informations de conformité
Pb-free / RoHS compliant per Infineon product page. Industrial temperature grade only; not AEC-Q100 qualified - this is not an automotive-qualified part. For automotive applications requiring AEC-Q100, consult Infineon automotive-grade SRAM portfolio.
