dsPIC33EP64GS505T-E/PT - 16-bit 70 MIPS DSC 64KB Flash | Microchip
MPN： DSPIC33EP64GS505T-E/PT ✓ 啟用中DSPIC33EP64GS505T-E/PT 概覽
A digital signal controller combines the compute throughput of a DSP with the peripheral integration and control architecture of a microcontroller. Within the power-management semiconductor hierarchy, a DSC sits between a general-purpose MCU and a dedicated power-conversion ASIC, providing real-time loop closure for switch-mode power supplies. The dsPIC33EPXXGS50X family is specifically architected for multi-loop digital SMPS topologies.
Key differentiating features include high-speed PWM modules purpose-built for power conversion, high-speed analog-to-digital converters with an integrated programmable gain amplifier (PGA), on-chip comparators, and an interconnect fabric that ties the PWM, ADC and comparator blocks together for deterministic control-loop latency. The GS50x family also carries Functional Safety (FuSa) support documentation, enabling use in safety-conscious designs.
Architecturally, the device is built on the 16-bit dsPIC33EP core with DSP instruction extensions (MAC, DSP multiply), executing from zero-wait-state Flash at full speed. The interconnected high-speed PWM supports complementary outputs, dead-time control and fault protection essential for AC-to-DC, DC-to-DC, power factor correction (PFC) and inverter stages.
Typical applications include AC-DC power supplies, digital PFC stages, DC-DC converters, solar micro-inverters, LED drivers and battery chargers, where the combination of fast ADC sampling and high-resolution PWM directly improves loop bandwidth and efficiency.
Design consideration: the exposed-pad TQFP requires a solid ground connection to the PCB thermal pad for both heat dissipation and analog ground integrity - do not leave the ePad floating.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, as of 2026-09-25.
直接替換替代品，適用於 DSPIC33EP64GS505T-E/PT — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： DSPIC33EP64GS505T-E/PT （相同外形與佔位） — 差異在於 Package, Core Processor, Operating Temperature, Packaging, Program Memory (Flash).
DSPIC33EP64GS505T-I/PT
✅ 直接替換聯絡詢價
查看資料表 →DSPIC33EP64GS505-E/PT
✅ 直接替換聯絡詢價
查看資料表 →DSPIC33EP32GS505-E/PT
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
DSPIC33EP128GS505-E/PT
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
DSPIC33EP32GS505T-I/PT
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →DSPIC33EP64GS505T-E/PT 最大額定值與電氣特性
| Core Processor | dsPIC33EP (16-bit DSC core) |
| Core Size | 16-bit |
| Speed (MIPS) | 70 MIPS |
| Program Memory | 64KB (64K x 8) Flash |
| Series | dsPIC 33EP GS (Automotive, AEC-Q100, Functional Safety FuSa) |
| Product Type | Digital Signal Controller (DSC) for SMPS and Digital Power Conversion |
| 供應電壓 | 3.3 V |
| 封裝 | 48-TQFP-EP (7x7 mm), exposed pad |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40C to +125C (E grade) |
| Packaging | Tape & Reel (TR) |
| Qualification | AEC-Q100 qualified, automotive grade |
| Functional Safety | FuSa package available |
| Key Peripherals | High-speed PWM, high-speed ADC with PGA, comparators (digital power interconnect) |
| Target Applications | SMPS, AC-DC, DC-DC, PFC, digital power conversion |
| Programming/Debug | ICSP via MPLAB SNAP (2 device I/O pins + reset) |
| Status | Active |
DSPIC33EP64GS505T-E/PT 48-tqfp-ep (7x7 mm), exposed pad 腳位配置指南
DSPIC33EP64GS505T-E/PT（48-tqfp-ep (7x7 mm), exposed pad 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： DSPIC33EP64GS505T-E/PT.
請參閱 資料表 以查看完整腳位配置。
典型應用
DSPIC33EP64GS505T-E/PT 適用於 6 應用s: AC-DC Power Supplies, Power Factor Correction (PFC), DC-DC Converters, Solar Micro-Inverters, LED Drivers and Lighting Power, Battery Chargers.
AC-DC Power Supplies
The dsPIC33EP64GS505T-E/PT fits AC-DC power supply designs because the GS-series architecture was purpose-built by Microchip for multi-loop digital switch-mode power conversion. Its high-speed PWM module provides complementary outputs with programmable dead time for half-bridge and full-bridge primary stages, while the high-speed ADC with integrated programmable gain amplifier samples input/output current and voltage fast enough for peak and average current-mode control. In a typical design the controller closes both the fast inner current loop and the slower outer voltage loop in firmware, and the PWM-to-ADC interconnect delivers deterministic sampling instants synchronized to switching events, minimizing control jitter. The AEC-Q100 qualification and -40C to +125C E-grade allow use in server and industrial AC-DC units requiring wide ambient tolerance.
推薦
Power Factor Correction (PFC)
The dsPIC33EP64GS505T-E/PT is well suited to digital power factor correction stages because PFC demands a fast, low-jitter current loop synchronized to the AC line and the switching frequency. The GS-series high-speed PWM plus on-chip comparators support cycle-by-cycle current limiting without CPU intervention, while the high-speed ADC captures inductor current and rectified line voltage for the average-current-mode compensator running at 70 MIPS. The on-chip interconnect fabric routes comparator fault outputs directly to PWM shutdown, protecting the boost MOSFET during transients. Running the PFC and downstream DC-DC stage control on this single DSC eliminates a second controller, and the 64KB Flash accommodates compensation code plus inrush, brownout and housekeeping routines with functional-safety diagnostic margin.
推薦
DC-DC Converters
For DC-DC converter control, the dsPIC33EP64GS505T-E/PT delivers the switching frequency capability and analog bandwidth that high-density buck, boost and synchronous buck-boost modules require. The interconnected high-speed PWM supports phase-shifted and interleaved topologies with precise phase offsets, enabling multi-phase designs that reduce output ripple and input capacitor stress. The PGA ahead of the ADC allows direct connection of low-amplitude current-shunt signals without an external amplifier, reducing BOM count. Because the control loop executes in firmware at 70 MIPS, designers can implement non-linear or adaptive control strategies - such as mode hopping between CCM and DCM - that fixed-function controllers cannot offer. The exposed-pad 48-TQFP dissipates controller heat into the power ground plane efficiently.
推薦
Solar Micro-Inverters
The dsPIC33EP64GS505T-E/PT addresses solar micro-inverter requirements with its combination of high-resolution PWM, fast ADC sampling and DSP math capability. A micro-inverter must run MPPT on the panel, control a DC-DC stage, and shape grid-synchronized AC output current - the GS-series interconnect lets one device close all three loops with deterministic latency. The 16-bit DSP core executes the sine-reference generation, grid PLL and MPPT perturb-and-observe algorithm at 70 MIPS, while comparators provide hardware overcurrent protection for the bridge. AEC-Q100 qualification and the -40C to +125C operating range match rooftop enclosure ambient conditions where electronics see extreme thermal cycling, and functional-safety documentation supports grid-interconnection certification programs.
推薦
LED Drivers and Lighting Power
Digital LED driver designs benefit from the dsPIC33EP64GS505T-E/PT because dimming resolution and current accuracy depend directly on PWM granularity and ADC quality. The GS-series high-speed PWM can generate both the switching converter drive and the high-resolution dimming channels, while the ADC monitors LED string current and temperature for closed-loop current regulation and thermal foldback. Firmware-based control permits color-mixing, phase-cut dimming compatibility and DALI-style communication on the same die, avoiding an external MCU. The 3.3V supply, small 7x7 mm footprint and -40C to +125C E-grade temperature range suit both outdoor luminaires and enclosed industrial fixtures, and the AEC-Q100 qualification supports automotive interior and exterior lighting modules.
推薦
Battery Chargers
The dsPIC33EP64GS505T-E/PT is a strong fit for smart battery charger control across Li-ion, lead-acid and other chemistries. Chargers require precise multi-phase charge profiles (trickle, constant current, constant voltage, termination), which map naturally to the GS-series firmware-controlled architecture: the high-speed PWM regulates the converter power stage while the ADC-with-PGA tracks charge current and pack voltage through low-value shunts. The comparators provide hardware-level overvoltage and overcurrent cutoff independent of software, a key safety layer. The 64KB Flash holds charge algorithms, chemistry tables, cell-balancing logic and communication protocols (SMBus/UART) concurrently. AEC-Q100 qualification makes this device appropriate for onboard automotive chargers and 125C-ambient industrial charging cabinets.
推薦
推薦產品摘要
工程參考資料，適用於 DSPIC33EP64GS505T-E/PT — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | DSPIC33EP64GS505T-I/PT | DSPIC33EP32GS505-E/PT | DSPIC33EP128GS505-E/PT |
|---|---|---|---|---|
| Package | 48-TQFP-EP (7x7 mm) | 48-TQFP-EP (7x7 mm) - same | 48-TQFP-EP (7x7 mm) - same | 48-TQFP-EP (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64KB (64K x 8) | 64KB | 32KB | 128KB |
| Core / Speed | 16-bit dsPIC33EP, up to 70 MIPS | 16-bit, up to 70 MIPS | 16-bit, up to 70 MIPS | 16-bit, up to 70 MIPS |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Relative Cost | Baseline | Lower (industrial temp grade) | Lower (half Flash) | Higher (double Flash) |
主要差異化特點
- Extended temperature range for automotive power electronics (對比DSPIC33EP64GS505T-I/PT)
- More program memory for functional-safety code (對比DSPIC33EP32GS505-E/PT)
- Cost optimization path without PCB change (對比DSPIC33EP128GS505-E/PT)
設計說明
Solder the exposed pad of the 48-TQFP-EP to a stitched ground pour. The ePad is the primary ground return for PWM switching currents and the main thermal path; a floating or thermally-relieved ePad raises ground bounce and degrades ADC accuracy in current-mode loops. Use a via array (minimum 3x3) under the pad to the internal ground plane, per standard Microchip layout guidance for GS-series digital power parts.
Verify achievable MIPS against your operating point: the 70 MIPS headline rating applies under specific supply/temperature conditions, while DigiKey lists 60 MIPS for this ordering code. Consult the electrical characteristics table in the manufacturer datasheet and derate the core clock if the junction temperature approaches 125C. Budget decoupling: place 100 nF ceramic caps at each VDD/VSS pin pair plus one bulk 10 uF, as close to the package as possible.
Reserve the ICSP/PGD/PGC pins for the programming header even in production boards - the MPLAB SNAP requires two device I/O pins plus reset for in-circuit debugging and ICSP. Forgetting this header forces fixture-based reprogramming later. Also, when substituting the I-temp (85C) variant for the E-temp (125C) part in derated designs, revalidate the full thermal budget, not just ambient temperature.
合規資訊
AEC-Q100 automotive qualification and Functional Safety (FuSa) support confirmed by DigiKey and GlobalSpec listings. RoHS/lead-free per standard Microchip E/PT tape-and-reel suffix; REACH and halogen-free status not stated in provided data.
