EP1AGX50DF780C6N - 50K LE Arria GX FPGA with 3.125Gbps Transceivers | Intel
MPN： EP1AGX50DF780C6N ✗ 停產EP1AGX50DF780C6N 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and hardened I/O peripherals, allowing hardware designers to implement arbitrary digital logic that is re-programmable in the field. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) alongside CPLDs and are widely used for digital signal processing, protocol bridging, parallel processing, and ASIC prototyping. The Arria GX family specifically targets mid-density designs with integrated multi-gigabit transceivers (MGTs), occupying the middle ground between Intel's low-cost Cyclone and high-end Stratix lines.
Key features of the EP1AGX50DF780C6N include 4 transceivers operating up to 3.125 Gbps (supporting PCIe Gen1, Gigabit Ethernet, Serial RapidIO, and XAUI), 2,475,072 bits of embedded RAM (roughly 303 Kbytes), and a -6 speed grade with commercial 0°C to 85°C operating temperature. The device also offers dedicated DSP blocks for high-performance fixed- and floating-point math, on-chip PLLs, and JTAG-based configuration via the IEEE 1149.1 boundary-scan and IEEE 1532 in-system programmability standards.
Architecturally, the Arria GX family uses a 90 nm process with a 1.2 V core supply and 3.3 V/2.5 V tolerant I/O banks. Embedded transceiver macro hard IP delivers signal-integrity features such as adaptive equalization, pre-emphasis, and 8b/10b encoding, eliminating external PHY devices on most serial links. The combination of hard transceivers, embedded memory, and rich DSP makes this part a single-chip solution for mid-range communication and image-processing cards.
Typical applications include PCIe endpoint cards, gigabit Ethernet bridges, Serial RapidIO fabrics in wireless baseband boards, broadcast video conversion (SDI/HD-SDI), and protocol-conversion mezzanine cards. The 780-BGA package provides ample user I/O and supply pins for high-speed serial channel routing and parallel memory interfaces such as DDR2/QDRII.
When designing with this device, ensure the board provides clean 1.2 V core and 3.3 V auxiliary rails with sufficient bulk capacitance near the BGA, follow Intel's transceiver PCB layout guidelines for 100-ohm differential routing, and use the Quartus II design software (version supporting Arria GX) for compilation and configuration file generation. The device is now NRND/EOL — verify long-term availability with Intel before committing to new production designs.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 EP1AGX50DF780C6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1AGX50DF780C6N （相同外形與佔位） — 差異在於 Speed Grade, Package, Operating Temperature, RoHS Status, Process Technology.
EP1AGX60DF780C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1AGX35DF780C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1AGX50DF780C6
✅ 直接替換聯絡詢價
查看資料表 →EP1AGX50DF780C6N 最大額定值與電氣特性
| Family | Arria GX |
| Logic Elements | 50,160 |
| Number of LABs/CLBs | 2,508 |
| Total RAM Bits | 2,475,072 (303 Kbytes) |
| User I/O Count | 350 |
| Number of Transceivers | 4 (up to 3.125 Gbps) |
| Core Voltage | 1.2 V |
| Speed Grade | -6 |
| 工作溫度 | 0°C to 85°C (Commercial) |
| Package Type | 780-pin FC-FBGA (DF780) |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant (lead-free per verified data) |
| Configuration Interface | JTAG (IEEE 1149.1), IEEE 1532 in-system programmability |
| DSP Blocks | Yes (dedicated hardware multipliers) |
| On-chip PLLs | Yes |
EP1AGX50DF780C6N 780-pin fc-fbga (df780) 腳位配置指南
EP1AGX50DF780C6N（780-pin fc-fbga (df780) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1AGX50DF780C6N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1AGX50DF780C6N 適用於 6 應用s: PCI Express Endpoint Cards, Gigabit Ethernet Bridge and Switch Fabric, Serial RapidIO Baseband Cards, Broadcast Video SDI/HD-SDI Converters, ASIC Prototyping Platforms, Industrial Motor Control and Servo Drives.
PCI Express Endpoint Cards
The EP1AGX50DF780C6N fits PCIe Gen1 x4 endpoint designs because its 4 integrated 3.125 Gbps transceivers map directly to the PCIe PHY Interface (PIPE) without external SERDES. Its 50,160 logic elements comfortably host a PCIe Hard IP block, DMA engine, and application logic for host-bus adapters and instrumentation cards. The 1.2 V core keeps power within PCIe CEM slot budgets.
推薦
Gigabit Ethernet Bridge and Switch Fabric
Arria GX transceivers support 1.25 Gbps Gigabit Ethernet (1000BASE-X) and XAUI (4×3.125 Gbps) interfaces, making the EP1AGX50DF780C6N ideal for protocol-conversion bridges between Ethernet and proprietary backplanes. The 350 user I/Os of the 780-BGA package provide ample GMII/RGMII or SGMII pins for multi-port switches, while 2,475 Kbit embedded RAM buffers packet data. Quartus II IP cores include MAC and PCS functions.
推薦
Serial RapidIO Baseband Cards
Wireless baseband and DSP accelerator cards benefit from Serial RapidIO (sRIO) at 1.25/2.5/3.125 Gbps per lane, a protocol natively supported by the Arria GX hard transceivers. The EP1AGX50DF780C6N's 50K LE and dedicated DSP blocks implement turbo decoders, FFT engines, and matrix multipliers for LTE/HSPA+ baseband processing. Four transceivers enable x4 sRIO links for low-latency DSP-to-DSP connectivity.
推薦
Broadcast Video SDI/HD-SDI Converters
The Arria GX transceiver meets SMPTE 259M (SD-SDI at 270 Mbps) and SMPTE 292M (HD-SDI at 1.485 Gbps) bit-rate requirements, enabling the EP1AGX50DF780C6N to serve as a low-cost broadcast video converter between SDI and HDMI/DVI. Embedded RAM acts as a frame buffer for up/down/cross-conversion, while 350 user I/Os handle parallel video buses and audio embedding. The commercial temperature grade suits indoor studio racks.
推薦
ASIC Prototyping Platforms
Engineers prototyping ASIC designs in the 200K-500K gate range find the EP1AGX50DF780C6N a cost-effective platform: 50,160 logic elements plus dedicated DSP blocks map cleanly to common ASIC RTL. The 780-BGA provides abundant user I/O for DUT-to-platform interconnects and test header pins. Quartus II supports ASIC prototyping flow with multi-FPGA partitioning and chip-select logic.
推薦
Industrial Motor Control and Servo Drives
Although the EP1AGX50DF780C6N is commercial-grade (0°C to 85°C), it remains viable for industrial motor controllers when housed in temperature-controlled enclosures. Its DSP blocks accelerate Park/Clark transforms and SVPWM generation for 3-phase motor drives. The 4 transceivers support EnDat 2.2, BiSS, or HIPERFACE DSL absolute encoder feedback over RS-485/SerDes, while 350 I/Os drive power-stage gate drivers.
推薦
推薦產品摘要
工程參考資料，適用於 EP1AGX50DF780C6N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1AGX60DF780C6N | EP1AGX35DF780C6N | EP1AGX50DF780C6 |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 780-pin FC-FBGA (DF780) | 780-pin FC-FBGA (DF780) - same | 780-pin FC-FBGA (DF780) - same | 780-pin FC-FBGA (DF780) - same |
| Logic Elements | 50,160 | 60,000 | 35,000 | 50,160 |
| Number of LABs | 2,508 | 2,992 | 1,750 | 2,508 |
| User I/O Count | 350 | 350 | 350 | 350 |
| Number of Transceivers | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) |
| Embedded RAM (bits) | 2,475,072 | 2,475,072 | 1,728,000 | 2,475,072 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -6 | -6 | -6 | -6 |
| Lifecycle Status | NRND | NRND | NRND | NRND |
主要差異化特點
- Highest density in the Arria GX DF780 family (對比EP1AGX35DF780C6N)
- Drop-in compatible with EP1AGX60DF780C6N for upgrade path (對比EP1AGX60DF780C6N)
- 4 integrated 3.125 Gbps transceivers eliminate external SERDES (對比Cyclone III EP3C40/80 (no transceivers))
設計說明
The 780-pin FC-FBGA package uses 1.0 mm ball pitch on a 29×29 mm body. Implement a 6-layer stack-up with dedicated ground and power planes beneath the device; place 0402-size 0.1 µF decoupling capacitors on every power pin pair within 200 mils of the BGA ball. Use microvia or via-in-pad technology if possible to reduce inductance for the 1.2 V core rail, which may draw 2-4 A under full logic utilization.
Differential transceiver channels require 100-ohm ±10% differential impedance with matched trace lengths (5 mil tolerance within a pair). Reference Intel Application Note AN508 for Arria GX PCB layout — it specifies 8-15 mil trace width and 4-8 mil spacing for the 3.125 Gbps channels. Use AC-coupling capacitors (0.01 µF) at each transmit pin and ensure receiver common-mode voltage meets 0.4-1.4 V swing range.
The Arria GX family requires at least three supply rails: VCCINT (1.2 V core), VCCIO (3.3 V / 2.5 V / 1.8 V for I/O banks), and VCCA (2.5 V PLL analog). Bulk capacitance of 220 µF low-ESR polymer or tantalum per rail plus high-frequency ceramic decoupling prevents voltage droop during sudden logic switching. Enable the in-rush current limiter IC to avoid triggering distribution breakers at configuration time.
Never design a new board around the Arria GX family — it is NRND and not recommended for new designs; use Arria II GX (EP2AGX50) for new projects. Configuration mode pins MSEL[3:0] must be set correctly: 0000 = AS, 0010 = PS, 0100 = JTAG-only. Failing to configure MSEL causes 'configuration failure' with no further debug output. Use a JTAG header on every board for recovery.
合規資訊
RoHS compliance verified from the Heisener/Electronicount listings which describe the part as 'COMPLIANT IC, GX FPGA EP1AGX50D, FBGA 780 PINS'. AEC-Q100 is not applicable (FPGA does not target automotive-grade qualification directly). REACH, halogen-free, and conflict-mineral statements are not present in the verified web data.
