EP1C20F400I7 - Cyclone FPGA 20K LE FBGA-400 | Intel
MPN： EP1C20F400I7 ✗ 停產EP1C20F400I7 概覽
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows hardware designers to implement custom digital circuits after PCB fabrication. The hierarchy places FPGAs above CPLDs (smaller, non-volatile logic devices) and below ASICs (fixed-function Application-Specific Integrated Circuits) within the broader digital semiconductor category. Cyclone FPGAs target cost-sensitive, high-volume applications by trimming unused silicon (no transceivers, no hardware multipliers in the base Cyclone), keeping die area and unit price low compared to higher-tier Stratix parts.
Key features of the EP1C20F400I7 include 20,060 logic elements, 64 embedded 18x18 multipliers (M4K blocks repurposed), a dedicated Double Data Rate (DDR) SDRAM interface supporting up to 133 MHz, and a Phase-Locked Loop (PLL) array for clock synthesis. The device is configured via active serial (AS), passive serial (PS), or JTAG modes using the dedicated configuration pins.
The architecture is built around a four-input LUT (Look-Up Table) based logic element fabric with embedded M4K memory blocks (4 Kbit each, total 60 blocks). Distributed RAM and shift-register logic can be inferred from the LUTs themselves, providing flexible on-chip storage. Two PLLs and global clock networks handle clock distribution and frequency synthesis across the die.
Typical applications for the EP1C20F400I7 include industrial control boards, video processing front-ends, low-end networking line cards, glue logic replacement, and DSP co-processing. The large logic capacity allows the device to host soft processor cores such as the Nios II, enabling full system-on-chip designs on a single programmable device.
When designing with this device, ensure proper decoupling (0.1 µF per power pin plus bulk capacitors), follow Intel's configuration pin recommendations, and select the I7 speed grade carefully — it is the slowest industrial variant, so timing closure on 100 MHz+ designs may require extra pipelining.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP1C20F400I7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1C20F400I7 （相同外形與佔位） — 差異在於 Process Technology, Speed Grade, Package, Family, PLLs.
EP1C20F400I6
✅ 直接替換聯絡詢價
查看資料表 →EP1C20F400I-6
✅ 直接替換聯絡詢價
查看資料表 →EP1C20F400
✅ 直接替換聯絡詢價
查看資料表 →EP1C20F400C8N
✅ 直接替換聯絡詢價
查看資料表 →EP1C20F400C8
✅ 直接替換聯絡詢價
查看資料表 →EP1C20F400C7N
✅ 直接替換聯絡詢價
查看資料表 →EP1C20F400C7
✅ 直接替換✗ 缺貨
$48.9 / 單位
查看資料表 →EP1C20F400C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1C20F400I7 最大額定值與電氣特性
| Series | Cyclone |
| Logic Elements | 20,060 |
| Embedded Memory (bits) | 294,912 |
| M4K Memory Blocks | 60 (4 Kbit each) |
| Maximum User I/O | 301 |
| PLLs | 2 |
| Process Technology | 0.13 µm CMOS |
| 封裝 | 400-ball FBGA (FineLine BGA), 21 x 21 mm, 1.0 mm pitch |
| Speed Grade | I7 (industrial, slowest) |
| 工作溫度範圍 | -40C to +100C (industrial, junction) |
| Core Voltage | 1.5 V |
| Configuration Modes | AS, PS, JTAG |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| 生命週期狀態 | Obsolete (Cyclone generation discontinued) |
EP1C20F400I7 400-ball fbga (fineline bga), 21 x 21 mm, 1.0 mm pitch 腳位配置指南
EP1C20F400I7（400-ball fbga (fineline bga), 21 x 21 mm, 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1C20F400I7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1C20F400I7 適用於 6 應用s: Industrial Motor Control, Video Processing Front-End, Low-End Networking Line Card, Test and Measurement Instrumentation, DSP Co-Processor / Soft Processor Host, Aerospace Avionics Databus Interface.
Industrial Motor Control
The EP1C20F400I7's 20,060 logic elements and 301 user I/O pins make it well suited for multi-axis motor control boards. Designers instantiate soft PWM generators, encoder quadrature decoders, and current-control loops in the LE fabric, using the 60 M4K memory blocks as lookup tables for sinusoidal commutation. The I7 industrial temperature grade supports factory-floor ambient up to +70C with margin, while the 0.13 µm CMOS design tolerates the electrical noise typical of variable-frequency drive cabinets. Compared to a microcontroller-only solution, the EP1C20F400I7 runs four simultaneous current-control loops at 50 kHz each with deterministic latency, and the LVDS-capable I/Os interface directly to 26LS31/32 differential line drivers for encoder feedback.
推薦
Video Processing Front-End
For broadcast and surveillance front-ends, the EP1C20F400I7 ingests ITU-R BT.656 or Camera Link streams and performs color-space conversion, gamma correction, and scaling in real time. Each M4K block provides a 36-bit-wide single-port RAM that doubles as a line buffer, allowing progressive-to-interlaced conversion or field-rate conversion without external SDRAM for small image sizes. With 301 LVTTL/LVCMOS I/Os, the FPGA can simultaneously capture 8-bit parallel video from three sensors and drive a 24-bit RGB LCD interface. The 1.5 V core reduces dynamic power versus earlier 2.5 V Cyclone predecessors, enabling fanless operation in sealed video-wall enclosures.
推薦
Low-End Networking Line Card
The EP1C20F400I7 implements 100-Mbps Ethernet MACs with on-chip FIFO buffers, POS-PHY Level 2 system-side interfaces, or 16-channel HDLC framers typical of access-network line cards. The DDR SDRAM interface port supports up to 133 MHz, providing 17 Gbps of external memory bandwidth for packet buffering in dedicated SSRAM or DDR SDRAM chips. Designers commonly instantiate a Nios II/s soft processor to handle management-plane SNMP and CLI parsing while keeping the data plane in pure hardware for deterministic line-rate throughput. The I7 industrial temperature grade suits outdoor DSLAM cabinets and street-side aggregation enclosures.
推薦
Test and Measurement Instrumentation
Bench-top instruments such as logic analyzers, protocol exercisers, and pattern generators leverage the EP1C20F400I7's combination of 301 I/Os and 20 K LEs to implement multi-channel capture logic. Each M4K block serves as a 4-Kbit deep state buffer, while the four-input LUTs encode custom JTAG, I2C, SPI, or proprietary serial protocol state machines. The I7 industrial temperature range supports lab-to-factory temperature sweeps, and the JTAG-based configuration allows rapid in-system reprogramming during protocol bring-up. Compared to discrete 74-series logic, one EP1C20F400I7 replaces thousands of TTL gates while consuming a fraction of the board area.
推薦
DSP Co-Processor / Soft Processor Host
Embedded systems designers instantiate a Nios II/f or Nios II/s soft processor in the EP1C20F400I7, gaining a fully customisable on-chip CPU with selectable multiplier, branch prediction, and cache depth. The 60 M4K blocks become tightly-coupled instruction/data memories, allowing deterministic zero-wait-state access at speeds above 100 MHz in the I6/I7 speed grade. The remaining logic budget accommodates custom peripherals such as Sigma-Delta ADC interfaces, PWM banks, or hardware crypto accelerators. This single-chip CPU+FPGA approach eliminates an external host processor, saving both BOM cost and PCB area in industrial IoT edge nodes.
推薦
Aerospace Avionics Databus Interface
Avionics integrators have historically used the EP1C20F400I7 to implement ARINC 429, MIL-STD-1553, or AFDX line receivers and transmitters on commercial-off-the-shelf cards. The 20 K LE fabric hosts multiple dual-redundant 1553 channels with each bus monitored independently, while the 301 LVTTL/LVDS I/Os bridge to external transceivers such as the Holt HI-1565 or Data Device Corporation BU-61741. The I7 industrial temperature range supports -40C cold-soak scenarios and high-altitude convection cooling. Long-term supply risk now drives many aerospace programs to migrate to Cyclone IV GX or Microsemi ProASIC3 equivalents qualified to DO-254.
推薦
推薦產品摘要
工程參考資料，適用於 EP1C20F400I7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1C20F400I6 | EP1C20F400I-6 | EP1C20F400 | EP1C20F400C8N | EP1C20F400C7N |
|---|---|---|---|---|---|---|
| Package | 400-ball FBGA (21x21 mm, 1.0 mm pitch) | 400-ball FBGA (21x21 mm, 1.0 mm pitch) - same | 400-ball FBGA (21x21 mm, 1.0 mm pitch) - same | 400-ball FBGA (21x21 mm, 1.0 mm pitch) - same | 400-ball FBGA (21x21 mm, 1.0 mm pitch) - same | 400-ball FBGA (21x21 mm, 1.0 mm pitch) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 20,060 | 20,060 - same | 20,060 - same | 20,060 - same | 20,060 - same | 20,060 - same |
| Embedded Memory (bits) | 294,912 | 294,912 - same | 294,912 - same | 294,912 - same | 294,912 - same | 294,912 - same |
| Maximum User I/O | 301 | 301 - same | 301 - same | 301 - same | 301 - same | 301 - same |
| Speed Grade | I7 (slowest industrial) | I6 (faster industrial) | I6 (faster industrial) | unspecified (typically C7/C8) | C8 (commercial, faster than I7) | C7 (commercial, faster than I7) |
| Operating Temperature Range | -40C to +100C (industrial, junction) | -40C to +100C - same | -40C to +100C - same | 0C to +85C (commercial) typically | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage | 1.5 V | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Slowest industrial speed grade maximizes timing margin (對比EP1C20F400I6)
- Industrial temperature qualification for harsh environments (對比EP1C20F400C8N)
- Same die as other Cyclone I variants ensures soft-binary compatibility (對比EP1C12Q240I7)
設計說明
Estimated: at 100 MHz operation with moderate logic utilization (~50% of 20,060 LEs switching), the EP1C20F400I7 typically draws 0.5-1.0 A from a 1.5 V core rail. Provide at least 2 x 100 µF bulk tantalum capacitors plus one 0.1 µF ceramic per VCCINT pin and one 0.1 µF per VCCIO pin. Estimated input decoupling based on standard FPGA power integrity guidelines; refer to the Cyclone Device Handbook for actual measured quiescent and dynamic current curves. Power sequencing must follow Intel's VCCINT-then-VCCIO requirement to avoid latch-up.
The I7 speed grade is qualified to +100C junction, but actual junction temperature in a 21x21 mm FBGA depends heavily on PCB copper area and airflow. Provide at least 4 inner-layer copper pour areas of 1 oz copper under the FBGA footprint connected by 0.3 mm thermal via arrays (8-12 vias per cm^2). Without a heatsink or significant airflow, expect 15-25C junction-to-ambient thermal resistance (theta_JA), per Altera package thermal characterization. For sealed industrial enclosures, derate junction by 20C or consider Cyclone IV devices that offer lower power at equivalent LE counts.
The 400-ball FineLine BGA uses a 1.0 mm pitch, which is routable on standard 4-layer FR-4 with 0.2 mm/8 mil traces between balls using microvia-in-pad (preferred) or dog-bone fan-out. Maintain 0.4 mm clearance between BGA balls and any inner copper pour to avoid solder bridging. Reference the Altera Cyclone Device Handbook Package Information chapter for exact land pattern dimensions. JTAG header (TCK, TMS, TDI, TDO, TRST) must be present on every PCB for in-system programming and boundary-scan test.
Do not confuse the EP1C20F400I7 (Cyclone I, 0.13 µm, 1.5 V) with EP2C20F256 (Cyclone II, 90 nm, 1.2 V) or EP3C20F256 (Cyclone III, 65 nm, 1.2 V). The configuration bitstream is NOT compatible across Cyclone generations, so Quartus II must target the correct family. The configuration memory (EPCS4/EPCS16/EPCS64) must also be from the Cyclone-era family list. Mixing Cyclone I bitstreams into a Cyclone III configuration device will fail programming without warning.
合規資訊
RoHS compliance per Intel/Altera product page. First-generation Cyclone parts are not AEC-Q100 qualified; for automotive applications use automotive-grade Cyclone IV or later families. Halogen-free status not explicitly published - default unknown.
