EP1K10FC256-1 - 10K Gates ACEX-1K FPGA, 256-BGA | Intel
MPN： EP1K10FC256-1 ✗ 停產EP1K10FC256-1 概覽
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnect. FPGAs sit at the top of the programmable logic hierarchy below ASICs and above simple PLDs/CPLDs, enabling designers to implement custom digital logic, glue logic, state machines, bus interfaces, DSP pipelines, and even soft-processor cores after PCB assembly. Unlike an ASIC, an FPGA is reconfigurable in the field, which shortens design cycles and supports design iteration. The ACEX-1K family is Altera's mid-density, low-cost CPLD/FPGA crossover family from the early 2000s, designed for glue-logic and low-density glue / bus-interface applications.
Key features of the EP1K10FC256-1 include 576 logic elements (12 LEs per LAB array), 12 kbit embedded SRAM (EAB blocks), 136 maximum user I/Os, 3.3 V/2.5 V LVTTL/LVCMOS-compatible I/O with multi-voltage support, and an embedded array block (EAB) for memory or product-term logic. Its SRAM-based configuration requires a boot PROM (typically EPC2) or JTAG download. The 256-ball FineLine BGA (1.0 mm pitch) enables high I/O count in a compact footprint.
Typical applications include glue logic replacement, bus-interface bridging (e.g., PCI-to-local bus), low-density DSP preprocessing, parallel I/O expansion, and industrial control interface cards. The 136 user I/Os make it well suited to interfacing with parallel SRAM, FIFOs, and legacy microcontrollers. The 2.5 V core is compatible with 3.3 V I/O banks, allowing mixed-voltage system integration.
A critical design consideration is that ACEX-1K is now NRND/last-time-buy; new designs should consider Cyclone series. The SRAM configuration must be reloaded on every power-up. The 256-BGA requires X-ray or rework-grade assembly for prototyping. Decoupling per Altera ACEX-1K handbook recommended 0.1 µF per VCC pin and bulk 33 µF tantalum.
直接替換替代品，適用於 EP1K10FC256-1 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1K10FC256-1 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Process Technology, Speed Grade, Typical Gates.
EP1K10FC256-1N
✅ 直接替換📋 參考替代品（不在目錄中）
EP1K10FC256-2
✅ 直接替換聯絡詢價
查看資料表 →EP1K10FC256-2N
✅ 直接替換聯絡詢價
查看資料表 →EP1K10FC256-3
✅ 直接替換聯絡詢價
查看資料表 →EP1K10FC256-3N
✅ 直接替換聯絡詢價
查看資料表 →EP1K30FC256-1
✅ 直接替換聯絡詢價
查看資料表 →EP1K100FC256-1
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1K10FC256-1 最大額定值與電氣特性
| Family | ACEX-1K |
| Logic Elements | 576 |
| Typical Gates | 10,000 |
| Maximum User I/Os | 136 |
| Embedded Memory (EAB RAM) | 12,288 bits |
| Number of EABs | 3 (each 4 kbit) |
| Core Voltage | 2.5 V |
| I/O Voltage Tolerance | 3.3 V / 2.5 V LVTTL/LVCMOS compatible |
| Process Technology | 0.22 µm CMOS, SRAM-based |
| Internal Operating Frequency | Up to 250 MHz |
| 封裝 | 256-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Pin/Ball Count | 256 |
| 工作溫度 | 0°C to +85°C (Commercial) |
| Configuration Method | JTAG (IEEE 1149.1) / EPC series boot PROM |
| Speed Grade | -1 |
| RoHS 狀態 | Compliant |
EP1K10FC256-1 256-ball fbga (fineline bga), 1.0 mm pitch 腳位配置指南
EP1K10FC256-1（256-ball fbga (fineline bga), 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1K10FC256-1.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1K10FC256-1 適用於 7 應用s: Industrial Glue Logic Replacement, PCI/Local Bus Bridge, Custom Peripheral Expansion for Microcontrollers, Parallel SRAM / FIFO Controller, Low-Density DSP / Pre-Processing Front-End, Legacy Test & Measurement Equipment Interface, Aerospace / Defense Legacy Avionics Bus.
Industrial Glue Logic Replacement
The EP1K10FC256-1's 576 logic elements and 136 user I/Os make it well suited for replacing multiple discrete 74-series TTL/CMOS glue-logic ICs on legacy industrial control boards. The 256-FBGA footprint concentrates the equivalent of 8-15 TTL packages into one chip, reducing PCB area by 60-70% in retrofit designs. Its 2.5 V core with 3.3 V-tolerant I/O allows direct interface to legacy 3.3 V microcontrollers and 5 V-tolerant peripherals through series resistors. The 12 kbit of EAB memory supports small lookup-table-based state machines and CRC engines. Designers should note the NRND status - new industrial designs should target Cyclone IV EP4CE6 instead.
推薦
PCI/Local Bus Bridge
The 250 MHz internal performance of the EP1K10FC256-1 (-1 speed grade) and its 136 user I/Os enable bridging between 32-bit PCI and local processor buses at 33 MHz. The 12 kbit of EAB memory supports PCI configuration space (256 bytes), and the remaining LEs implement target/master state machines. The 256-FBGA footprint provides sufficient I/Os for full 32-bit data plus 4-bit BE#, FRAME#, IRDY#, TRDY#, DEVSEL#, and arbitration signals. Industrial / embedded PCI designs benefit from ACEX-1K's deterministic timing. New designs should use Cyclone IV with PCIe hard IP.
推薦
Custom Peripheral Expansion for Microcontrollers
The EP1K10FC256-1 can be paired with low-end microcontrollers (8051, AVR, PIC, ARM Cortex-M0) to add custom peripherals without requiring a more expensive MCU. The 576 LEs are sufficient for UART/SPI/I2C bridges, PWM generators, quadrature decoders, and small custom state machines. The 256-FBGA and 136 user I/Os allow direct parallel interface to 8/16/32-bit MCU buses. The 2.5 V core coexists with 3.3 V MCUs. Quartus II software with ACEX-1K support enables rapid design iteration. Designers should target EP1C12Q240 for higher LE-count expansions.
推薦
Parallel SRAM / FIFO Controller
The EP1K10FC256-1's 136 user I/Os and 12 kbit EAB memory are ideal for implementing custom parallel SRAM, FIFO, and dual-port memory controllers. The 250 MHz internal Fmax supports 100 MHz+ memory buses, and the 256-FBGA provides enough pins for 32-bit data + 24-bit address + control signals. The EAB blocks can implement small FIFO buffers directly, reducing external logic. The 2.5 V core coexists with 3.3 V SRAMs. New designs should consider Cyclone IV with dedicated memory interfaces.
推薦
Low-Density DSP / Pre-Processing Front-End
The EP1K10FC256-1's 576 LEs can implement FIR filters, simple FFT engines, and data-packing pre-processors for downstream DSP processors. With -1 speed grade delivering 250 MHz internal, the EP1K10FC256-1 sustains FIR filter throughput of up to 250 MSPS for small kernel sizes (8-16 taps). The 256-FBGA and 136 I/Os accept parallel ADC data and deliver pre-processed results to a host DSP. The 2.5 V core supports 3.3 V ADC interfaces. For new designs targeting audio DSP, consider Cyclone IV EP4CE6 with DSP blocks.
推薦
Legacy Test & Measurement Equipment Interface
Test and measurement instruments often require custom parallel interfaces, timing generators, and protocol decoders - all tasks that the EP1K10FC256-1 handles well. The 136 I/Os support 8-16 channel logic analyzers or protocol analyzers. The 250 MHz internal Fmax enables timing resolution down to 4 ns. The 256-FBGA footprint keeps board density high for portable instruments. The 12 kbit EAB memory holds captured trace data. The NRND status is acceptable for medical/industrial test equipment with 10-15 year lifecycles where redesign is undesirable.
推薦
Aerospace / Defense Legacy Avionics Bus
The EP1K10FC256-1 (commercial 0-85°C grade) can interface MIL-STD-1553, ARINC 429, and similar legacy avionics buses when paired with transceivers. The 576 LEs are sufficient for full MIL-STD-1553 BC/MT/RT terminal logic, and the 136 I/Os accept parallel transceivers. The 256-FBGA's 1.0 mm pitch is suitable for ruggedized avionics PCBs. Note: aerospace/military programs may require EP1K10QI256 (industrial -40 to +100°C) or full MIL-PRF-38535 sourcing. New defense programs should use Microsemi/ProASIC3 or Xilinx radiation-hardened FPGAs.
推薦
推薦產品摘要
工程參考資料，適用於 EP1K10FC256-1 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1K10FC256-1N | EP1K10FC256-2 | EP1K30FC256-1 | EP1K100FC256-1 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-FBGA (FineLine BGA, 1.0 mm pitch) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Logic Elements | 576 | 576 | 576 | 1,728 | 4,992 |
| Embedded Memory (bits) | 12,288 | 12,288 | 12,288 | 24,576 | 49,152 |
| Maximum User I/Os | 136 | 136 | 136 | 171 | 186 |
| Speed Grade | -1 (slowest) | -1 (slowest) | -2 (medium) | -1 (slowest) | -1 (slowest) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lead-Free (Pb-Free) | No (SnPb ball) | Yes (Pb-free) | No (SnPb ball) | No (SnPb ball) | No (SnPb ball) |
| Unit Price (qty 1) | $37.70 | $40-$45 (estimated) | $45-$55 (estimated) | $55-$70 (estimated) | $90-$120 (estimated) |
主要差異化特點
- Lowest-cost drop-in within the ACEX-1K family (對比EP1K30FC256-1)
- Compatible with both SnPb and Pb-free assembly (via -N suffix) (對比EP1K10FC256-1N)
- Path to higher density via pin-compatible upgrade (對比EP1K100FC256-1)
設計說明
Estimated: At 250 MHz with 50% LE utilization and full I/O toggling, the EP1K10FC256-1 core draws roughly 200-300 mA from VCCINT (2.5 V) plus another 50-100 mA from VCCIO (3.3 V). Total power dissipation is typically 0.5-1.0 W. Per Altera ACEX-1K handbook, place one 0.1 µF ceramic decoupling capacitor per VCCINT and VCCIO pin, plus a single 33 µF tantalum bulk capacitor near the device. Multiple GND balls must be soldered for thermal dissipation - 256-BGA packages depend on the PCB for heat sinking.
The 256-ball FineLine BGA uses a 1.0 mm ball pitch, which requires 0.5 mm-diameter NSMD (non-solder-mask-defined) pads with 0.4 mm solder-mask openings. PCB stack-up must specify controlled-impedance traces (50 Ω single-ended, 100 Ω differential) for high-speed I/O. Four to eight PCB layers are recommended for signal integrity. Escape routing from inner BGA rows requires microvia or staggered via-in-pad technology. Use ENIG (Electroless Nickel Immersion Gold) surface finish for reliable BGA assembly; HASL is not recommended for fine-pitch BGA.
Critical pitfalls: (1) The EP1K10FC256-1 is NRND - production supply is from Rochester Electronics only; do not design into new high-volume consumer products. (2) ACEX-1K is SRAM-based - the FPGA loses configuration on every power-down and requires a boot PROM (EPC2) or JTAG downloader; do not omit the boot PROM in standalone designs. (3) All GND balls must be soldered; missing GND balls cause unstable behavior and JTAG failures. (4) The 2.5 V core does NOT support 5 V tolerance - use external level shifters or resistor dividers when interfacing to 5 V logic. (5) Cyclone migration is NOT pin-compatible; the 256-BGA pinout is different between ACEX-1K and Cyclone IV.
For clock inputs, route the clock trace as a 50 Ω controlled-impedance microstrip or stripline, keep the trace shorter than 1/10 of the clock wavelength (4 ns / 10 = 400 mil at 250 MHz), and place a series 33 Ω damping resistor near the driver. For multi-clock designs, the EP1K10FC256-1 has 6 dedicated clock input pins - place these on the same BGA row to simplify clock tree synthesis. SSO (Simultaneous Switching Output) noise can corrupt the 2.5 V core; limit simultaneous switching outputs to 16 per bank and use staggered SSN mitigation.
Place the EPC2 boot PROM within 50 mm of the EP1K10FC256-1 DATA pin to minimize trace inductance. The configuration JTAG chain (TCK, TMS, TDI, TDO) should be daisy-chained with no stubs, and the 10 kΩ pull-up on TCK/TMS/TDI and pull-down on TDO must be present. Add a 1 kΩ series resistor on each JTAG signal for EMI suppression. nCONFIG and nSTATUS must each have a 4.7 kΩ pull-up to VCCIO. nCE must be tied LOW for normal operation. Leave JTAG test points accessible for production programming.
合規資訊
Base EP1K10FC256-1 uses SnPb BGA balls (non-RoHS). For RoHS-compliant assembly, choose the EP1K10FC256-1N (Pb-free SAC305 balls). The -N suffix variant is RoHS-compliant while retaining identical silicon.
