EP1K10FC256-2 - 10K ACEX-1K FPGA, 136 I/O, 256-BGA | Intel / Altera
MPN： EP1K10FC256-2 ✗ 停產EP1K10FC256-2 概覽
An FPGA (Field Programmable Gate Array) is a class of programmable logic device (PLD) that combines the density of gate arrays with the configurability of logic blocks, interconnect, and I/O. Within the broader system-on-a-programmable-chip (SOPC) taxonomy, FPGAs enable integration of megafunctions such as DSP blocks, FIFOs, dual-port memories, and specialized logic into a single device, replacing multiple discrete components and accelerating time-to-market.
Key features of the EP1K10FC256-2 include a maximum toggle frequency around 200 MHz, embedded array blocks (EABs) for efficient memory and specialized logic functions, support for LVCMOS, LVTTL, SSTL-2/3, and HSTL I/O standards, and an in-system programmability (ISP) interface via the JTAG-compliant passive serial configuration scheme. The device is specified for commercial operating temperature (0 °C to 70 °C) at the -2 speed grade.
From a technical depth perspective, the ACEX-1K architecture pairs a fine-grained Look-Up Table (LUT)-based logic fabric with coarse-grained Embedded Array Blocks (EABs) that can be configured as RAM, ROM, or specialized megafunction blocks. This heterogeneous structure delivers higher effective logic density than uniform LUT fabrics of similar raw gate count, while the 0.22 µm process balances cost and performance for cost-sensitive glue-logic, bridging, and control-plane applications.
Typical applications include telecommunications bridging, low-density glue logic, industrial control interfacing, and pre-silicon prototyping of ASIC-equivalent logic. With its small footprint, ample dual-port memory, and JTAG ISP, the EP1K10FC256-2 is widely used in legacy designs where re-spin cost or supply continuity matter more than absolute logic density.
When designing with this part, verify that the Quartus II or MAX+PLUS II toolchain supports the ACEX-1K family, confirm power-rail sequencing for the 2.5 V VCCINT and any bank reference voltages, and respect the device's I/O pin count when migrating from the original -1 or -3 speed grades.
This page synthesizes distributor pricing, drop-in same-package alternatives, application contexts, and practical design notes not found in the original Altera datasheet alone.
直接替換替代品，適用於 EP1K10FC256-2 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1K10FC256-2 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Process Technology, Configuration Method, Embedded Array Blocks (EABs).
EP1K10FC256-1
✅ 直接替換聯絡詢價
查看資料表 →EP1K10FC256-2N
✅ 直接替換聯絡詢價
查看資料表 →EP1K10FC256-2P
✅ 直接替換📋 參考替代品（不在目錄中）
EP1K10FC256-2F
✅ 直接替換📋 參考替代品（不在目錄中）
EP1K100FC256-2
✅ 直接替換聯絡詢價
查看資料表 →EP1K100FC256-2N
✅ 直接替換聯絡詢價
查看資料表 →EP1K10FC256-2 最大額定值與電氣特性
| Family | ACEX-1K |
| Series | EP1K10 |
| Logic Elements / Cells | 576 |
| Number of LABs/CLBs | 72 |
| Total RAM Bits | 12288 |
| Number of I/O | 136 |
| Number of Gates | 10,000 typical |
| Core Voltage | 2.375 V to 2.625 V (2.5 V nominal) |
| Speed Grade | -2 |
| 工作溫度 | 0 °C to +70 °C (commercial) |
| 封裝 | 256-BGA (FineLine BGA, 17 x 17 mm) |
| 安裝類型 | Surface Mount |
| Process Technology | 0.22 µm CMOS |
| Configuration Method | JTAG / Passive Serial (ISP) |
EP1K10FC256-2 256-bga (fineline bga, 17 x 17 mm) 腳位配置指南
EP1K10FC256-2（256-bga (fineline bga, 17 x 17 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1K10FC256-2.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1K10FC256-2 適用於 6 應用s: Telecommunications Bridging and Glue Logic, Industrial Control and Interface Consolidation, ASIC Pre-Silicon Prototyping and Emulation, Legacy Maintenance and Board Rev-Sustaining Designs, Low-Density DSP and FIR Filter Acceleration, Communication Peripherals and Test Equipment.
Telecommunications Bridging and Glue Logic
The EP1K10FC256-2 fits telecom bridging because its 576 logic elements and 72 LABs deliver roughly 10,000 gates of configurable logic, enough to implement protocol bridges, bus converters, and timing skew adjustment between backplane ASICs. The 136 user I/Os on the 256-BGA expose multiple LVCMOS and LVTTL banks so designers can mix 3.3 V and 2.5 V domains without external level shifters. The 12,288 bits of embedded dual-port RAM serve as small FIFO / elastic buffer storage for packet-rate adaptation. Compared with a CPLD, the FPGA's structured ASIC blocks (EABs) and JTAG ISP shorten the design-prototype-revise loop typical of bridging firmware.
推薦
Industrial Control and Interface Consolidation
In industrial control panels, the EP1K10FC256-2 consolidates discrete glue logic such as optocoupler debouncers, encoder quadrature decoders, and PWM generators into a single device. Its 136 I/O pins comfortably support 8 to 16 channels of parallel I/O at 24 V-tolerant interfaces when paired with external drivers. The 2.5 V core supply and 0-70 °C commercial temperature range suit enclosed control cabinets with moderate ambient. JTAG-based in-system programming accelerates field firmware updates on deployed panels without removing the device.
推薦
ASIC Pre-Silicon Prototyping and Emulation
Engineers use the EP1K10FC256-2 as a fast-prototyping vehicle for ASIC-equivalent logic blocks because the LUT-based fabric maps ASIC gate-level netlists through standard synthesis flows in Quartus II or MAX+PLUS II. The 12,288 bits of dual-port RAM emulate ASIC register files and small SRAM macros, while the 72 LABs distribute logic for timing closure studies. The 256-BGA FineLine package exposes enough I/O to break out debug signals and boundary-scan chains. Compared with running RTL on a simulator, real silicon at ~200 MHz validates timing assumptions and brings up firmware weeks earlier.
推薦
Legacy Maintenance and Board Rev-Sustaining Designs
For long-lifecycle products in the field, the EP1K10FC256-2 supports drop-in board-rev sustaining designs because the 256-BGA pinout is shared across the EP1K10 and EP1K100 families. When original ACEX-1K stock is depleted, the EP1K100FC256-2 delivers 10x the logic resources on the same footprint without PCB rework. Designers re-validate timing closure only, since the 2.5 V core, ball map, and ISP flow remain identical. This minimizes re-certification cost in medical, aerospace, and industrial segments where board respins are prohibitively expensive.
推薦
Low-Density DSP and FIR Filter Acceleration
The EP1K10FC256-2 implements modest FIR filters, sigma-delta modulators, and audio sample-rate converters using its EAB-based multipliers and dual-port RAM. With 12,288 RAM bits, designers can store 512 x 24-bit coefficients or delay-line samples, while 576 logic cells realize the adder tree. The 256-BGA package exposes enough I/O for parallel audio data buses (I2S, TDM, or DSP serial ports). At toggle frequencies around 200 MHz, the device comfortably processes baseband audio and low-MHz IF signal processing tasks.
推薦
Communication Peripherals and Test Equipment
Test-and-measurement peripherals such as logic-analyzer probe heads, JTAG-controlled breakout boards, and custom protocol exercisers use the EP1K10FC256-2 for its flexible I/O standards (LVCMOS, LVTTL, SSTL-2/3, HSTL) and JTAG ISP. The 136 user I/Os adapt the device to multiple parallel-bus widths (8/16/32-bit), while the EAB-based dual-port RAM captures transient signal buffers in pattern-generator applications. The 256-BGA package's compact 17 x 17 mm footprint fits handheld test instruments and modular mezzanine cards.
推薦
推薦產品摘要
工程參考資料，適用於 EP1K10FC256-2 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1K10FC256-1 | EP1K10FC256-2N | EP1K100FC256-2 |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 256-BGA (FineLine BGA) | 256-BGA (FineLine BGA) - same | 256-BGA (FineLine BGA) - same | 256-BGA (FineLine BGA) - same |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Logic Elements | 576 | 576 | 576 | 4992 |
| Total Gates | 10,000 | 10,000 | 10,000 | 100,000 |
| Number of LABs/CLBs | 72 | 72 | 72 | 624 |
| Total RAM Bits | 12288 | 12288 | 12288 | 49152 |
| Number of I/O | 136 | 136 | 136 | 136 |
| Speed Grade | -2 | -1 | -2 | -2 |
| Core Voltage | 2.375 V - 2.625 V | 2.375 V - 2.625 V | 2.375 V - 2.625 V | 2.375 V - 2.625 V |
主要差異化特點
- Same 256-BGA pinout as EP1K100FC256-2 enabling ~10x density upgrade with no PCB rework (對比EP1K100FC256-2)
- Lead-free N-suffix variant supports modern environmental compliance regimes (對比EP1K10FC256-2N)
- P-grade EP1K10FC256-2P variant available for non-RoHS legacy assemblies (對比EP1K10FC256-2P)
- Lower-density 10K gates consume less core power than EP1K100FC256-2 (對比EP1K100FC256-2)
設計說明
Estimated: at VCCINT = 2.5 V, ICCINT typical ~50 mA quiescent plus dynamic current proportional to toggle rate; for a 136-I/O design at ~50 MHz, total supply current is on the order of 200-300 mA. Provide a 2.5 V LDO with at least 10 % headroom and place 0.1 µF + 10 µF decoupling close to every VCCINT ball. VCCIO banks may require 3.3 V or 2.5 V depending on the I/O standard mix - verify bank reference voltages against the datasheet I/O standard table.
The 256-FineLine BGA uses a 1.00 mm ball pitch with a 17 x 17 mm body. Use 4-layer or 6-layer PCB stack-up with continuous GND planes under the package for thermal dissipation and signal return paths. Route differential pairs in matched length within ±150 mil for LVDS-style I/O standards. Place JTAG chain header (TMS, TCK, TDI, TDO, TRST) within 2 inches of the device to minimize stub length and ISP signal integrity risk.
Configure the FPGA via JTAG in-system programming or passive serial configuration PROM. For multi-device chains, route the JTAG signals in a daisy chain with TMS and TCK buffered only if the chain exceeds 4-5 devices. Decouple each VCCIO bank with 0.1 µF X7R ceramics placed within 100 mil of the bank balls, plus a single 10 µF bulk capacitor per bank.
Do not assume the EP1K10 and EP1K100 families are bitstream-compatible despite sharing the same 256-BGA footprint - configuration bitstream sizes differ and the LAB / EAB architecture scales. Validate that your Quartus II compile target selects the correct device, otherwise the device will fail configuration. Also note that the ACEX-1K family uses a passive serial configuration scheme - newer Cyclone devices require PS or AS configuration with different bitstream headers.
Estimated: at full I/O toggle on all 136 pins at 2.5 V and 25 °C ambient, junction temperature rise is approximately 8-12 °C above ambient when mounted on a 4-layer JEDEC test PCB. For enclosed chassis without forced airflow, derate toggle activity by 30-40 % to keep Tj below 85 °C. Thermal resistance θJA for the 256-FBGA is approximately 20-25 °C/W on a standard 4-layer PCB per JEDEC EIA/JESD51.
合規資訊
Compliance status not explicitly stated in the verified web data. The -2N suffix typically indicates lead-free finish per Altera legacy ordering scheme, while the -2P suffix denotes Pb-bearing balls. RoHS/REACH should be confirmed with the distributor or manufacturer's environmental compliance letter before production.
