EP1M350F780I7 - Mercury PLD 350K Gates FPGA | Altera (Intel)
MPN： EP1M350F780I7 ⚠ 最後購買機會EP1M350F780I7 概覽
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic circuits after PCB fabrication. The EP1M350 belongs to the Mercury family, which extends the standard PLD hierarchy (PLD → CPLD → FPGA → programmable logic device family) with embedded multi-gigabit transceivers. Each FPGA consists of configurable logic blocks (LUTs), embedded memory, and programmable interconnect, sitting between standard logic ICs and full-custom ASICs in cost and flexibility.
Key features of the EP1M350F780I7 include 8 channels at 1.25 Gbps serial I/O, additional channels up to 1.0 Gbps, embedded memory blocks, and LVDS-compatible I/O. The Mercury architecture supports up to 18 high-speed serial channels, allowing any 8 to run at the full 1.25 Gbps rate. Industrial temperature grade (-40 °C to +100 °C) makes the part suitable for telecom outdoor equipment, factory automation controllers, and ruggedized embedded systems.
The device uses SRAM-based configuration memory, requiring an external configuration device (typically an EPC series PROM) at power-up to load the bitstream. According to the Mercury family datasheet, the architecture integrates PLLs, clock networks, and double-data-rate I/O for memory interfaces. The Mercury family is widely deployed in synchronous optical network (SONET/SDH) line cards, gigabit Ethernet switches, and custom protocol bridging ASICs.
Typical applications include high-speed serial backplane bridging, telecom line-card glue logic, custom protocol converters, and ASIC prototyping. When designing with this FPGA, plan for configuration bitstream storage (typically 4–8 Mbit external PROM) and verify thermal dissipation at maximum toggle rate.
直接替換替代品，適用於 EP1M350F780I7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1M350F780I7 （相同外形與佔位） — 差異在於 Family, Operating Temperature, Speed Grade, Package, Process Technology.
EP1M350F780I6N
✅ 直接替換聯絡詢價
查看資料表 →EP1M350F780I6AA
✅ 直接替換聯絡詢價
查看資料表 →EP1M350F780I6
✅ 直接替換聯絡詢價
查看資料表 →EP1M350F780C7
✅ 直接替換聯絡詢價
查看資料表 →EP1M350F780C8
✅ 直接替換聯絡詢價
查看資料表 →EP1M350F780C7N
✅ 直接替換聯絡詢價
查看資料表 →EP1M350F780I7 最大額定值與電氣特性
| Family | Mercury PLD |
| System Gates | 350,000 |
| High-Speed Serial Channels | 18 (up to 8 channels at 1.25 Gbps) |
| Maximum Serial Data Rate | 1.25 Gbps |
| Process Technology | 0.15 µm CMOS |
| Configuration Memory | SRAM-based (requires external configuration device) |
| 封裝 | 780-pin FineLine BGA (F780) |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40 °C to +100 °C (Industrial) |
| Speed Grade | I7 |
| MSL 等級 | 3 (168 hours) |
EP1M350F780I7 780-pin fineline bga (f780) 腳位配置指南
EP1M350F780I7（780-pin fineline bga (f780) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1M350F780I7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1M350F780I7 適用於 6 應用s: SONET/SDH Telecom Line-Card Glue Logic, Gigabit Ethernet Switch Backplane Bridging, Custom Protocol Converter / Bridge ASIC Prototyping, Industrial Factory Automation Controller, High-Speed Test & Measurement Equipment, Aerospace & Defense Ruggedized Embedded System.
SONET/SDH Telecom Line-Card Glue Logic
The EP1M350F780I7 Mercury PLD is well suited for SONET/SDH telecom line-card glue-logic applications where 350K system gates and 1.25 Gbps multi-gigabit transceivers provide the integration density and serial bandwidth required for framer-to-mapper interfaces. Eight channels at full 1.25 Gbps enable redundant protection switching and multi-rate payload mapping without external SERDES ICs, reducing BOM cost and board area. Industrial temperature grade (-40 °C to +100 °C) supports central-office and outdoor-cabinet deployment, while the 780-pin BGA allows high pin-count fan-out for parallel telecom buses and LVDS interconnect to companion framers.
推薦
Gigabit Ethernet Switch Backplane Bridging
For gigabit Ethernet switch backplane bridging, the EP1M350F780I7 provides chip-to-chip SERDES at 1.25 Gbps, directly compatible with gigabit Ethernet PHY interfaces and backplane serial standards. Its 350K gates absorb bridging logic, MAC address tables, and protocol conversion between switch ASICs without an external processor. Industrial-grade silicon ensures reliable operation in enterprise and industrial Ethernet switches mounted in temperature-controlled but vibration-prone enclosures, while the FineLine BGA package enables controlled-impedance routing essential for 1.25 Gbps signal integrity.
推薦
Custom Protocol Converter / Bridge ASIC Prototyping
The EP1M350F780I7 Mercury FPGA serves as a high-fidelity ASIC prototyping platform for custom protocol-converter ASICs, since 350K gates approximate mid-range ASIC complexity and the built-in multi-gigabit transceivers model the SERDES blocks of the target ASIC. Engineers can validate custom bus protocols, custom serial framing, and proprietary backplane standards in real silicon before committing to NRE mask charges. The 780-pin BGA exposes enough I/O to replicate wide ASIC pad rings, while SRAM-based configuration allows rapid design iteration via JTAG reconfiguration during development.
推薦
Industrial Factory Automation Controller
For industrial factory automation controllers, the EP1M350F780I7 delivers 350K gates of deterministic logic with industrial temperature rating, suitable for real-time motion control, high-speed sensor aggregation, and fieldbus bridging. The multi-gigabit transceivers enable SERCOS, EtherCAT, or proprietary high-speed fieldbus links to remote I/O racks, while abundant logic implements custom safety and control algorithms. The Mercury family's SRAM configuration allows field firmware updates via JTAG, supporting long-life industrial installations where the FPGA may outlive its original controller firmware.
推薦
High-Speed Test & Measurement Equipment
The EP1M350F780I7 Mercury FPGA enables high-speed test and measurement instruments such as protocol analyzers, BERT testers, and high-speed data acquisition front-ends, where 1.25 Gbps SERDES capture and 350K gates of pattern-matching logic are required. The 780-pin BGA supports parallel LVDS connections to high-speed ADCs and DACs, while the multi-gigabit transceivers provide direct serial test access to 1 Gbps and below data streams. Industrial temperature grade supports benchtop and field-deployed test equipment.
推薦
Aerospace & Defense Ruggedized Embedded System
For aerospace and defense ruggedized embedded systems, the EP1M350F780I7 provides industrial-temperature-grade logic with multi-gigabit serial links suitable for mission computers, avionics databuses, and radar signal preprocessing. The 350K gate density supports complex DSP preprocessing, custom MIL-STD-1553 or ARINC 429 bridges, and high-speed serial links to RF front-ends. The Mercury family's robust 0.15 µm CMOS process and industrial temperature range are well matched to ruggedized enclosures, while SRAM configuration supports secure bitstream updates through approved channels.
推薦
推薦產品摘要
工程參考資料，適用於 EP1M350F780I7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1M350F780I6N | EP1M350F780I6AA | EP1M350F780I6 | EP1M350F780C7 | EP1M350F780C8 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-pin FineLine BGA (F780) | 780-pin FineLine BGA (F780) | 780-pin FineLine BGA (F780) | 780-pin FineLine BGA (F780) | 780-pin FineLine BGA (F780) | 780-pin FineLine BGA (F780) |
| Family | Mercury PLD | Mercury PLD | Mercury PLD | Mercury PLD | Mercury PLD | Mercury PLD |
| System Gates | 350,000 | 350,000 | 350,000 | 350,000 | 350,000 | 350,000 |
| Serial Channels (max 1.25 Gbps) | 8 channels at 1.25 Gbps + 10 at ≤1.0 Gbps | 8 channels at 1.25 Gbps + 10 at ≤1.0 Gbps | 8 channels at 1.25 Gbps + 10 at ≤1.0 Gbps | 8 channels at 1.25 Gbps + 10 at ≤1.0 Gbps | 8 channels at 1.25 Gbps + 10 at ≤1.0 Gbps | 8 channels at 1.25 Gbps + 10 at ≤1.0 Gbps |
| Temperature Grade | Industrial (-40 °C to +100 °C) | Industrial | Industrial | Industrial | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) |
| Speed Grade | I7 | I6N | I6AA | I6 | C7 | C8 |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
主要差異化特點
- Industrial temperature grade with same Mercury silicon as commercial variants (對比EP1M350F780C7)
- I7 speed grade (top-bin industrial) versus I6 speed-grade alternates (對比EP1M350F780I6N)
- Member of Mercury PLD family with built-in multi-gigabit transceivers (對比EP1K100FC484-2 (ACEX-1K))
設計說明
The Mercury EP1M350F780I7 requires multiple supply rails (VCCINT core, VCCIO I/O banks, VCCA_PLL PLL analog, and VTT for SERDES termination). Estimated: at full toggle rate with all 8 SERDES channels active at 1.25 Gbps, core current can exceed 1.5 A. Use a star-ground topology and separate regulator zones for PLL analog (VCCA_PLL) to minimize jitter; per the Mercury datasheet, VCCA_PLL must be filtered with a ferrite bead and 10 µF + 0.1 µF decoupling.
The 780-pin FineLine BGA requires a multilayer PCB with microvia stack-ups for breakout routing. Maintain 100 Ω differential impedance on SERDES lanes (1.25 Gbps) and 50 Ω single-ended on LVCMOS pairs. Estimated: trace-length matching within ±10 mil across all SERDES lanes is necessary for reliable multi-gigabit operation; the Mercury datasheet provides length-matching guidelines per differential pair.
Because the EP1M350F780I7 is SRAM-based, the device loses configuration on power-down and requires an external EPC configuration PROM (e.g., EPC16 or EPC8). A common pitfall is omitting the JTAG header for in-system reprogramming, which prevents field firmware updates. Per the Mercury datasheet, the nSTATUS, nCONFIG, and CONF_DONE pins must be pulled correctly per Altera reference design to ensure clean configuration.
Estimated: at industrial ambient (85 °C) with full SERDES activity, the EP1M350F780I7 BGA can dissipate 3–5 W; thermal management requires a 4-layer or higher PCB with continuous ground planes beneath the BGA to spread heat. For high-junction-temperature applications, attach a heatsink with thermal interface material to the package top, and ensure adequate airflow.
合規資訊
Detailed RoHS/REACH/lead-free status not present in verified web data; marked unknown. Mercury family predates many modern compliance declarations, so verify with authorized distributor documentation before placing new orders.
