EP1S40F1020C5AA - Stratix 41K LE FPGA, 1020-FBGA, 130nm | Intel
MPN： EP1S40F1020C5AA ✗ 停產EP1S40F1020C5AA 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers. Within the broader taxonomy, FPGAs sit alongside microcontrollers and ASICs in the programmable logic segment of digital ICs, bridging software-defined flexibility with near-ASIC throughput. Stratix devices in particular occupy the high-performance tier of the Intel FPGA portfolio, competing with Xilinx Virtex-4/-5 and later Kintex families for bandwidth-critical designs.
Key features of the EP1S40F1020C5AA include 14 embedded DSP blocks for hardware-accelerated multiplication-accumulation, 4 phase-locked loops (PLLs) for multi-domain clock synthesis, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and FCRAM. The device supports I/O standards such as LVDS, LVTTL, LVCMOS, SSTL, and HSTL through 773 user I/O pins, enabling direct interfacing to DDR memories, parallel buses, and high-speed serial links. Per-pin slew-rate and drive-strength controls allow fine-grained signal-integrity tuning.
The EP1S40F1020C5AA leverages a 1.5 V core supply with 130 nm CMOS technology, delivering a balance of logic density and power efficiency for its generation. The "C5" speed grade designates a commercial temperature rating (0 °C to +85 °C) and a specific timing closure tier, while the trailing "AA" suffix denotes a specific customer/programming variant. Designers use the Quartus II design suite for synthesis, place-and-route, timing analysis, and bitstream generation.
Typical applications include high-speed data acquisition front-ends, software-defined radio (SDR) baseband processing, video broadcasting and image processing pipelines, network packet inspection engines, and ASIC prototyping. The combination of 41,250 LEs and 3.4 Mbit block RAM makes it well suited to multi-channel DSP designs where parallel filter banks or FFT engines must run concurrently.
When designing with the EP1S40F1020C5AA, allocate sufficient PCB layers for the 1020-ball FBGA break-out, maintain continuous reference planes for the 1.5 V core and I/O voltage rails, and follow Intel's decoupling and power-sequencing guidelines to avoid in-rush events. Always validate timing closure in Quartus II for the target speed grade.
This page synthesizes verified distributor inventory, parametric specifications, package documentation, and same-family alternative MPNs not consolidated on a single manufacturer page, giving engineers a one-stop reference for sourcing and second-sourcing this legacy Stratix device.
直接替換替代品，適用於 EP1S40F1020C5AA — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1S40F1020C5AA （相同外形與佔位） — 差異在於 Package, DSP Blocks, Embedded Memory, Mounting Type, Process Technology.
EP1S40F1020C5
✅ 直接替換聯絡詢價
查看資料表 →EP1S40F1020C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1S40F1020C6
✅ 直接替換聯絡詢價
查看資料表 →EP1S40F1020C7
✅ 直接替換聯絡詢價
查看資料表 →EP1S40F1020I6
✅ 直接替換聯絡詢價
查看資料表 →EP1S30F1020C5
✅ 直接替換聯絡詢價
查看資料表 →EP1S40F1020C5AA 最大額定值與電氣特性
| Family | Stratix |
| Logic Elements | 41,250 |
| Embedded Memory | 3,423 Kbit |
| Maximum User I/O | 773 |
| DSP Blocks | 14 |
| PLLs | 4 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| 封裝 | 1020-ball FC-FBGA |
| 工作溫度 | 0 °C to +85 °C (Commercial) |
| Speed Grade | C5 |
| 安裝類型 | Surface Mount (BGA) |
| Configuration Memory | SRAM-based (volatile, requires external configuration device) |
EP1S40F1020C5AA 1020-ball fc-fbga 腳位配置指南
EP1S40F1020C5AA（1020-ball fc-fbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1S40F1020C5AA.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1S40F1020C5AA 適用於 6 應用s: Software-Defined Radio (SDR) Baseband Processing, High-Speed Data Acquisition Front-End, Video Broadcast and Image Processing Pipelines, ASIC Prototyping and Emulation, Network Packet Inspection Engine, Industrial Motor Control and Drive Systems.
Software-Defined Radio (SDR) Baseband Processing
The EP1S40F1020C5AA fits SDR baseband designs because its 41,250 logic elements plus 14 dedicated DSP blocks deliver the parallel multiply-accumulate throughput needed for multi-channel FFT and channelization filters. With 3,423 Kbit of embedded block RAM, designers can stage large FFT windows on-chip without external memory round-trips, reducing latency in real-time demodulation chains. Its 773 user I/Os accommodate parallel ADC/DAC data buses plus QDR/DDR sample buffers. The four PLLs synthesize independent sample-rate domains for ADC, FPGA fabric, and backplane interfaces. Compared with a DSP processor, the parallel fabric executes baseband at sample rates that would otherwise demand multiple fixed-function ASICs.
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High-Speed Data Acquisition Front-End
In data acquisition systems, the EP1S40F1020C5AA's 773 user I/Os and LVDS support let it aggregate multiple parallel ADC lanes at hundreds of MSPS each, performing decimation and triggering in fabric. The 14 DSP blocks provide hardware-accelerated FIR filters that compress data rates before downstream storage. With 3,423 Kbit of block RAM, designers implement deep FIFO buffers to absorb burst captures. The 1.5 V core and 130 nm process deliver the deterministic latency required by phased-array and radar front-ends. Quartus II's TimeQuest timing analyzer closes multi-channel paths across the same die.
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Video Broadcast and Image Processing Pipelines
The EP1S40F1020C5AA handles HD-SDI and DVB-ASI video processing pipelines because its fabric sustains multi-format scaling, de-interlacing, and color-space conversion at real-time rates. The 773 I/Os interface directly to BT.656, BT.1120, and HD-SDI serializers without external bridge logic, while 3,423 Kbit of block RAM store line and frame buffers for scaling engines. The 14 DSP blocks accelerate 2D filter kernels for noise reduction and sharpening. Designers use the Quartus II SOPC Builder to integrate Nios II soft processors for system control alongside the video datapath.
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ASIC Prototyping and Emulation
ASIC prototyping benefits from the EP1S40F1020C5AA's 41,250 logic elements and abundant block RAM, which let designers partition large SoC designs across multiple Stratix devices in a multi-FPGA emulation farm. The 773 user I/Os support high-pin-count ASIC-to-FPGA partitioning with LVDS and HSTL signaling to external connectors. SRAM-based configuration enables rapid design iteration - re-program in seconds via JTAG without pulling the board. The Quartus II LogicLock feature lets engineers create repeatable, timing-closed blocks across builds, accelerating verification of RTL and gate-level netlists.
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Network Packet Inspection Engine
Network equipment uses the EP1S40F1020C5AA to accelerate deep packet inspection at wire speed because its 41,250 LEs run hundreds of parallel pattern-match engines simultaneously. The 3,423 Kbit of block RAM stores compiled regex state machines and TCAM emulations, while the 14 DSP blocks accelerate hash computations for flow tables. The 773 I/Os interface to multiple SPI-4.2 or SGMII links without external bridge ASICs. The four PLLs generate the multiple clock domains needed for ingress, fabric, and egress paths, all within the same Stratix die.
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Industrial Motor Control and Drive Systems
The EP1S40F1020C5AA suits high-end industrial motor drives because its parallel fabric executes field-oriented control (FOC) algorithms, space-vector PWM, and encoder decoding in single-digit microsecond loop times. The 14 DSP blocks accelerate Park/Clarke transforms and PI controllers, while the 3,423 Kbit block RAM stores sine/cosine lookup tables and current-loop state. The 773 I/Os interface to resolver-to-digital converters, gate drivers, and brake chopper logic without external glue. Designers implement safety logic and fault handling alongside the control loop, all on one die.
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推薦產品摘要
工程參考資料，適用於 EP1S40F1020C5AA — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1S40F1020C5 | EP1S40F1020C5N | EP1S40F1020C6 | EP1S40F1020C7 | EP1S30F1020C5 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) |
| Logic Elements | 41,250 | 41,250 (same) | 41,250 (same) | 41,250 (same) | 41,250 (same) | 32,470 (-21%) |
| Speed Grade | C5 | C5 (same) | C5 (same) | C6 (faster) | C7 (fastest) | C5 (same) |
| Operating Temperature | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) |
| Lead-Free (N suffix) | Unknown | Unknown | Yes (N suffix) | Unknown | Unknown | Unknown |
| Lifecycle Status (2026) | NRND | NRND | NRND | NRND | NRND | NRND |
主要差異化特點
- Drop-in compatibility with the entire Stratix EP1S40F1020 family (對比EP1S40F1020C5N)
- Higher Fmax available within same package for timing-critical designs (對比EP1S40F1020C7)
- Industrial temperature variant in the same footprint (對比EP1S40F1020I6)
設計說明
The 1020-ball FC-FBGA package requires a minimum of 8 PCB layers with dedicated ground and power planes. Use 0.4 mm ball pitch escape routing with micro-via stack-ups (laser-drilled 0.1 mm vias) to fan out from the BGA. Intel's AN 471 layout guideline recommends 1-oz copper on outer layers and continuous reference planes beneath the package to control impedance for LVDS pairs at 1 Gbps and above.
The EP1S40F1020C5AA requires multiple supply rails: VCCINT (1.5 V core), VCCIO (banked 1.5/1.8/2.5/3.3 V per I/O bank), VCCPD (3.3 V pre-drive), VCCA_PLL (1.5 V analog PLL), and VCCBAT (battery backup for configuration RAM). Intel recommends a power-on sequence with VCCINT before VCCIO; violation can trigger high in-rush current and latch-up. Place 100 nF X7R decoupling within 5 mm of every supply ball, plus bulk 220 µF polymer tantalum capacitors near each rail.
At typical 130 nm Stratix utilization (~70% LEs at 250 MHz), estimate core dissipation of 5-8 W. With a FC-FBGA theta-JA of approximately 12-15 °C/W on a JEDEC 8-layer test board, junction temperature rises 60-120 °C above ambient. For enclosed industrial enclosures, design for at least 600 LFM airflow or attach a heatsink via the thermal pad exposed on the package top surface. Always validate thermal performance in the final enclosure, not on the bench.
Avoid configuring the EP1S40F1020C5AA with a bitstream designed for a different speed grade - Quartus II generates timing-closed bitstreams per speed grade, and swapping C5/C6/C7 bitstreams may cause hold-time failures. Also, the device is SRAM-volatile: a power glitch without proper power-sequencing corrupts the configuration, requiring re-load from an external EPC or EPCQ configuration PROM via the JTAG or FPP (Fast Passive Parallel) port. Always include a watchdog supervisor on VCCINT to force reconfiguration on brown-out.
For LVDS pairs at 840 Mbps or above, maintain 100 Ω differential impedance with matched-length traces (within 20 mil). Use IBIS-AMI simulation in Quartus II's SignalTap or external tools like Mentor HyperLynx to validate eye-diagram margins before sign-off. SSTL-2/SSTL-18 class II outputs driving DDR memories require external 25-50 Ω series damping resistors placed within 6 mm of the FPGA pin to suppress ringing on long stub traces.
合規資訊
RoHS, REACH, and lead-free status not explicitly stated in the verified distributor listings for EP1S40F1020C5AA; the N-suffix variants (e.g. EP1S40F1020C5N) are explicitly lead-free. AEC-Q100 is not applicable - this is a high-density FPGA, not an automotive-grade qualified IC. Conflict minerals compliance not verified from distributor data; consult Intel's product content disclosure for authoritative answers.