EP1SGX25DF1020I7 - Stratix GX FPGA 25,660 Cells 1020-BGA | Intel
MPN： EP1SGX25DF1020I7 ✗ 停產EP1SGX25DF1020I7 概覽
A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit that combines configurable logic blocks, programmable interconnect, and dedicated I/O and memory resources. In the system design hierarchy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism, deterministic latency, and post-production reconfigurability. The Stratix GX family was Intel's first generation of FPGAs with embedded multi-gigabit transceivers, enabling protocol-agnostic serial connectivity for telecom, storage, and defense designs.
Key features of the EP1SGX25DF1020I7 include dedicated high-speed transceiver channels supporting data rates up to 3.125 Gbps, embedded TriMatrix memory blocks for efficient on-chip buffering, and an enhanced routing architecture optimized for timing closure. The 1020-ball FC-FBGA package provides high signal and power pin density while supporting controlled-impedance differential pairs, which is essential for multi-gigabit serial links. Industrial temperature grade ensures operation across extended thermal ranges without derating logic performance.
The device is engineered for high-bandwidth serial I/O applications including backplane interfaces, telecommunications line cards, and high-end test equipment. The high logic cell count supports complex state machines, soft processor cores, and parallel data-path processing that would be impractical in a fixed-function ASIC during prototyping. The transceiver-rich architecture lets designers implement protocols such as Serial RapidIO, PCI Express Gen 1, Gigabit Ethernet, and XAUI directly in the fabric without external PHY components.
Typical applications include high-speed data acquisition systems, software-defined radio (SDR) baseband processing, optical transport network (OTN) line cards, and military/aerospace signal processing. The high pin count accommodates hundreds of LVDS, LVTTL, and SSTL I/O, which is valuable for parallel ADC/DAC interfaces.
When designing with this part, pay careful attention to PCB layout for the FC-FBGA footprint: use microvia stack-ups and matched-length differential routing for transceiver channels. Decoupling must follow Intel's Stratix GX power distribution network guidelines, with both bulk and high-frequency ceramic capacitors placed within 100 mils of each supply pin. The I7 industrial temperature grade also requires thermal modeling to ensure junction temperature stays within datasheet limits at maximum toggle rates.
This page synthesizes distributor pricing, drop-in same-family alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP1SGX25DF1020I7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX25DF1020I7 （相同外形與佔位） — 差異在於 Operating Temperature, Package, Package Dimensions, Package Type, RoHS Status.
EP1SGX25DF1020I6N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020I5N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020I5
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020C7N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020C7ES
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020C7
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020I7 最大額定值與電氣特性
| Family | Stratix GX |
| Logic Cells | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Maximum Operating Frequency | 4,385.97 MHz |
| Combinatorial CLB Delay | 9.48 ns |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 封裝 | 1020-ball FC-FBGA |
| Speed Grade | I7 (industrial) |
| 工作溫度 | -40C to +100C (industrial) |
| 腳位數 | 1020 |
| Package Code | BGA |
| Package Shape | Square |
| Form of Terminal | Ball |
| Transceiver Support | Embedded multi-gigabit transceivers (Stratix GX family) |
EP1SGX25DF1020I7 square 腳位配置指南
EP1SGX25DF1020I7（square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX25DF1020I7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX25DF1020I7 適用於 6 應用s: Telecom Backplane Interface Card, Software-Defined Radio (SDR) Baseband, High-Speed Data Acquisition System, Optical Transport Network (OTN) Line Card, Military / Aerospace Signal Processing, Test & Measurement Instrumentation.
Telecom Backplane Interface Card
The EP1SGX25DF1020I7 is a strong fit for telecom backplane line cards because its 1020-ball FC-FBGA package exposes embedded multi-gigabit transceivers capable of up to 3.125 Gbps per channel - the rate needed for XAUI, Serial RapidIO, and PCI Express Gen 1 backplanes. The 25,660 logic cells accommodate protocol state machines, framing logic, and FIFO buffering for multiple ports without external glue logic. Designers typically instantiate 4-8 transceiver channels plus 8b/10b encoders and a soft Nios CPU for management plane control. The I7 industrial speed grade also ensures timing closure across the -40C to +100C operating range demanded by central-office equipment.
推薦
Software-Defined Radio (SDR) Baseband
In SDR baseband processing the EP1SGX25DF1020I7 supplies the parallel compute density needed to implement multi-channel digital down-conversion (DDC), finite impulse response (FIR) filtering, and FFT engines for radar and wireless-infrastructure applications. The 25,660 logic cells and 2,566 CLBs sustain 16-32 parallel DSP slices while the embedded transceivers stream digitized IF samples from front-end ADCs at multi-gigabit rates. The I7 industrial temperature grade suits outdoor base-station and tactical-radio deployments. Bitstream portability with the broader Stratix GX family means existing firmware IP can be reused across multiple boards.
推薦
High-Speed Data Acquisition System
The EP1SGX25DF1020I7 fits high-speed data acquisition systems where hundreds of LVDS or SSTL parallel I/O lines interface to multi-channel ADCs and DACs. The 1020-ball FC-FBGA exposes sufficient I/O banks to support 16-bit wide LVDS data buses plus dedicated clock, frame, and sync pins, with 25,660 logic cells providing on-chip memory buffering and reduction logic. The I7 industrial grade lets the design sit next to high-power analog front ends without thermal derating. The fabric's deterministic latency is critical for time-correlated multi-channel capture in physics instrumentation and radar receivers.
推薦
Optical Transport Network (OTN) Line Card
The EP1SGX25DF1020I7's combination of 3.125 Gbps multi-gigabit transceivers and 25,660 logic cells directly maps to OTN line-card requirements: 4x transceiver lanes for OTU2/OTU2e, forward-error-correction (FEC) encoders, framing and de-framing, plus GFP mapping logic. The industrial temperature grade (I7) is required for central-office and outside-plant environments. The 1020-ball package's high pin density accommodates the multiple clock domains and synchronization buses typical of OTN designs. The device can be paired with a small microcontroller for OTN overhead processing, allowing most of the FPGA fabric to focus on high-speed data path functions.
推薦
Military / Aerospace Signal Processing
Defense and aerospace signal processing systems such as electronic-warfare (EW) receivers, radar front ends, and secure-communication modems benefit from the EP1SGX25DF1020I7's combination of high logic density, embedded transceivers, and the I7 industrial temperature grade. The 25,660 logic cells and 2,566 CLBs support pulse compression, MTI filtering, and adaptive-beamforming DSP. The 1020-ball FC-FBGA is ruggedized through underfill and lid options for vibration and thermal-shock compliance. Designers also value bitstream compatibility with the rest of the Stratix GX family, allowing single firmware IP reuse across multiple platform variants.
推薦
Test & Measurement Instrumentation
High-end test-and-measurement instruments such as protocol analyzers, BERT testers, and high-speed digitizers use the EP1SGX25DF1020I7 as the central pattern-generation and data-acquisition engine. The transceivers connect to the device under test at multi-gigabit rates while the 25,660 logic cells implement pattern generators, error counters, and protocol-aware decoding. The industrial temperature grade supports bench and lab environments without thermal-throttling concerns. Deterministic fabric timing is essential for triggering accuracy and timing-correlation measurements required by compliance test platforms.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX25DF1020I7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX25DF1020I6N | EP1SGX25DF1020I5N | EP1SGX25DF1020I5 | EP1SGX25DF1020C7N | EP1SGX25DF1020C7 |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Speed Grade | I7 (industrial) | I6 | I5 | I5 | C7 | C7 |
| Temperature Range | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Logic Cells | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
主要差異化特點
- Pin-compatible speed-grade flexibility within the Stratix GX family (對比EP1SGX25CF672I7)
- Higher transceiver count vs smaller Stratix GX siblings (對比EP1SGX10DF672I6N)
- Industrial temperature grade vs commercial-only Stratix GX variants (對比EP1SGX25DF1020C7)
設計說明
The 1020-ball FC-FBGA package requires a high-density PCB stack-up with laser-drilled microvias and via-in-pad technology to break out the fine-pitch BGA balls. Use a 4-6 layer stack-up with continuous ground planes adjacent to signal layers; place 0.1 uF high-frequency ceramic decoupling capacitors within 100 mils of every VCCINT and VCCIO pin, plus bulk 10-100 uF tantalum or polymer capacitors near the FPGA power pins. Matched-length differential routing (within 5 mil tolerance) is mandatory for the multi-gigabit transceiver channels. Reference the Stratix GX Device Family Data Sheet for the full pinout and pin-type tables.
The 1020-ball FC-FBGA package's thermal performance is highly dependent on the PCB copper area connected to the central ground pad and the optional heat-spreader attach. Estimate worst-case junction temperature using theta_JA from the datasheet (typically 12-15 C/W for the 1020-ball FC-FBGA on a 1-oz 4-layer JEDEC test board) plus the I7 industrial 100C limit. At 2-3 W typical and 5 W worst-case design power, the device may need a heat spreader or forced airflow to stay under the junction limit. Run a thermal simulation with the actual board copper geometry to confirm.
Three pitfalls are most common in legacy Stratix GX designs: (1) using the wrong bitstream format between the I7 industrial and C7 commercial variants - they are NOT bitstream-compatible and require different SOF files from Quartus; (2) confusing the I7 industrial speed grade with the I7 military temperature grade - the I7 industrial range is -40C to +100C, not the full military -55C to +125C; (3) sourcing counterfeit or remarked devices from the open market - always require a C-of-C and third-party authentication report (ERAI, SiliconExpert) for obsolete FPGAs. The EP1SGX25DF1020I7 is a high-value target for counterfeiters because of its $200+ typical aftermarket price.
合規資訊
Stratix GX family compliance status not in verified web data. The N suffix typically indicates lead-free and RoHS-compliant; without N suffix, status is unknown. Always request the latest C-of-C from the distributor.