EP1S40F1020C5DM - Stratix FPGA 41250LE 1020-BGA | Intel
MPN: EP1S40F1020C5DM ✗ 停產EP1S40F1020C5DM 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure post-manufacture to implement custom digital logic. Stratix FPGAs occupy the high-performance tier of programmable logic, sitting between CPLDs (smaller, simpler) and ASICs (custom-fabricated, non-programmable). The EP1S40F1020C5DM's combination of logic density, embedded memory, DSP blocks, and high-speed transceivers makes it suitable for systems that previously required a custom ASIC.
Key features include 41,250 logic elements, 3,423 Kbits of TriMatrix embedded memory (true dual-port, simple dual-port, and single-port modes), 12 DSP blocks delivering up to 28.8 GMACS at 200 MHz, six PLLs with eight output clocks each, and 16 clock networks across the device. The configuration scheme supports passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes via dedicated configuration pins. The 1020-ball FineLine BGA supports high I/O count while enabling dense PCB routing.
The architecture uses 1.5 V core VCCINT with separate VCCIO banks supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V mixed-voltage interfacing. Distributed and row/column interconnect resources deliver fast, predictable timing closure for high-speed datapaths, and the embedded memory can be configured as FIFO, ROM, or RAM with byte-enable parity. The DSP blocks implement 9-bit × 9-bit, 18-bit × 18-bit, and 36-bit × 36-bit multipliers with adders and accumulators.
Typical applications include high-performance digital signal processing for telecom base stations, HD video broadcast equipment, military radar front-end processing, high-speed serial protocol bridging (PCI Express, RapidIO, Gigabit Ethernet), and ASIC prototyping where designers map production logic to a Stratix device before committing to silicon.
When designing with this device, allocate separate PCB layers for VCCINT, VCCIO, and GND planes, and place all decoupling capacitors within 5 mm of each BGA ball. Use the Quartus II design software for synthesis, place-and-route, and timing closure; legacy Altera legacy designs may require a Quartus II service pack migration.
This page synthesizes distributor availability, drop-in alternatives from the Stratix family, and practical design notes that complement the manufacturer datasheet.
直接替換替代品,適用於 EP1S40F1020C5DM — 相同封裝,腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號: EP1S40F1020C5DM (相同外形與佔位) — 差異在於 Package, DSP Blocks, Mounting Type, Process Technology, Embedded Memory.
EP1S40F1020C5
✅ 直接替換聯絡詢價
查看資料表 →EP1S40F1020C5AA
✅ 直接替換聯絡詢價
查看資料表 →EP1S40F1020C5DM 最大額定值與電氣特性
| Product Type | FPGA - Field Programmable Gate Array |
| Series | Stratix |
| Logic Elements | 41,250 |
| Embedded Memory | 3,423 Kbits TriMatrix |
| User I/O Count | 773 |
| Number of LABs/CLBs | 4125 |
| DSP Blocks | 12 (up to 28.8 GMACS at 200 MHz) |
| Number of PLLs | 6 (8 outputs each) |
| Number of Clock Networks | 16 |
| 封裝 | 1020-ball FineLine BGA (33 mm x 33 mm, 1.0 mm pitch) |
| Core Voltage VCCINT | 1.5 V |
| I/O Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Process Technology | 0.13 µm CMOS |
| 工作溫度 | 0C to +85C (commercial) |
| Configuration Modes | PS, PPS, PPA, JTAG |
| 安裝類型 | Surface Mount (BGA) |
EP1S40F1020C5DM 1020-ball fineline bga (33 mm x 33 mm, 1.0 mm pitch) 腳位配置指南
EP1S40F1020C5DM(1020-ball fineline bga (33 mm x 33 mm, 1.0 mm pitch) 封裝)的腳位配置。 此數位 IC 包含 GPIO、通訊介面(UART、SPI、I2C)與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料: EP1S40F1020C5DM.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1S40F1020C5DM 適用於 8 應用s: Telecom Base Station Channel Card, HD Video Broadcast Encoder, Military Radar Front-End Processing, ASIC Prototyping Platform, High-Speed Serial Protocol Bridge, Industrial Machine Vision Inspection, Medical Imaging Reconstruction, Software-Defined Radio Baseband.
Telecom Base Station Channel Card
The EP1S40F1020C5DM fits telecom base-station channel cards because its 41,250 logic elements and 12 DSP blocks deliver up to 28.8 GMACS at 200 MHz, enough to implement digital up/down-conversion (DUC/DDC), crest-factor reduction (CFR), and digital pre-distortion (DPD) for multi-carrier power amplifiers. The 773 user I/O pins expose enough LVDS and LVCMOS pairs for parallel ADC/DAC interfacing, and the six PLLs with eight output clocks each simplify multi-clock domain synthesis for CPRI/OBSAI fronthaul links. Use the Altera CPRI MegaCore or build a custom PHY in the FPGA fabric.
推薦
HD Video Broadcast Encoder
EP1S40F1020C5DM is widely deployed in HD video broadcast encoders because its TriMatrix embedded memory (3,423 Kbits) provides enough on-chip buffering for HD-SDI or 3G-SDI line buffers, while the DSP blocks accelerate motion-estimation and DCT transforms required for MPEG-2/H.264 encoding. The 1020-ball BGA supports enough LVDS pairs to drive multiple SDI outputs simultaneously, and the high I/O count allows parallel connection to external DDR2 SDRAM for frame store. Quartus II 9.1 includes Altera Video and Image Processing (VIP) MegaCores for production use.
推薦
Military Radar Front-End Processing
Military phased-array radar and signal-intelligence systems use EP1S40F1020C5DM to perform digital beamforming, pulse compression, and MTI/MTD filtering on raw ADC data streams. The 12 DSP blocks handle complex 18-bit x 18-bit FIR filtering at high sample rates, and the 773 user I/O pins accept multi-channel LVDS data from synchronized ADC banks. Industrial or military temperature screening (DM / AA suffix) extends operation into harsh environments. Designers use Altera's FFT MegaCore for spectral analysis.
推薦
ASIC Prototyping Platform
Engineers map production ASIC RTL to the EP1S40F1020C5DM for pre-silicon validation, using its 41,250 LE to absorb mid-sized SoC designs and the 3,423 Kbits of TriMatrix memory to mimic on-chip SRAM blocks. Quartus II's incremental compile flow supports multi-engineer team-based design partitioning, and the JTAG configuration mode enables rapid in-system reprogramming during bring-up. Multiple FPGAs can be wired together via LVDS chip-to-chip links to prototype larger ASICs that exceed single-chip logic capacity.
推薦
High-Speed Serial Protocol Bridge
EP1S40F1020C5DM implements protocol-bridge applications such as PCI Express Gen1 to Serial RapidIO, or Gigabit Ethernet to Fibre Channel, because its logic density is sufficient for full protocol stacks including MAC, PCS, and PMA-equivalent soft logic. The 6 PLLs provide the multiple clock domains required for independent transmit/receive paths, and the LVDS I/O capability supports multiple high-speed serial lanes aggregated via SERDES soft-IP. Designers pair the FPGA with external PHY devices for physical-layer signaling.
推薦
Industrial Machine Vision Inspection
Machine-vision systems use EP1S40F1020C5DM to ingest Camera Link or CoaXPress image data, perform real-time preprocessing (white balance, gamma correction, edge detection), and route processed pixels to host CPUs over Gigabit Ethernet. The 773 user I/O pins accept multiple parallel image-data channels, while the 12 DSP blocks accelerate Sobel and Laplacian convolutions at line rate. Embedded TriMatrix memory holds image line buffers without external SRAM, reducing BOM cost. Quartus II provides the Image Processing library for filter instantiation.
推薦
Medical Imaging Reconstruction
The EP1S40F1020C5DM supports CT, MRI, and ultrasound reconstruction pipelines where raw sensor data must be back-projected and filtered in real time. Its 28.8 GMACS DSP throughput handles back-projection kernels, and the 3,423 Kbits of embedded memory serves as on-chip sinogram buffer. Medical-equipment designers value the deterministic latency of FPGA pipelines over software-only reconstruction. Use the Altera Floating-Point Compiler library for IEEE-754 single-precision math.
推薦
Software-Defined Radio Baseband
Software-defined radio (SDR) baseband processing uses the EP1S40F1020C5DM to implement digital down-conversion, channelization, and demodulation across multiple RF bands. The 6 PLLs synthesize independent sample-rate clocks for each antenna stream, and the DSP blocks perform polyphase filter banks and FFT-based channelization. The 1020-ball BGA exposes enough LVDS pairs for multi-channel ADC interfacing. Designers load new waveform personalities via JTAG or external Flash for mission flexibility.
推薦
推薦產品摘要
工程參考資料,適用於 EP1S40F1020C5DM — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1S40F1020C5 | EP1S40F1020C5AA | EP1S40B956C6N | EP1S40B956C6 |
|---|---|---|---|---|---|
| Package | 1020-ball FineLine BGA (33 mm x 33 mm, 1.0 mm pitch) | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 956-ball BGA (different) | 956-ball BGA (different) |
| Brand | Intel (formerly Altera) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Embedded Memory | 3,423 Kbits | 3,423 Kbits | 3,423 Kbits | 3,423 Kbits | 3,423 Kbits |
| User I/O | 773 | 773 | 773 | 683 (956-ball BGA reduces I/O) | 683 |
| DSP Blocks | 12 | 12 | 12 | 12 | 12 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | Commercial (0C to +85C, DM suffix) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial | Commercial |
主要差異化特點
- DM suffix indicates specific die revision or screening grade (對比EP1S40F1020C5)
- Industrial temperature option available in same 1020-ball BGA footprint (對比EP1S40F1020C5AA)
- Higher user I/O count than 956-ball BGA package variant (對比EP1S40B956C6N)
設計說明
The EP1S40F1020C5DM 1020-ball FineLine BGA requires a multilayer PCB with at least 6 layers (4 routing + 2 ground planes). Use 1.0 mm ball pitch PCB technology with microvia or laser-drilled via fan-out for reliable BGA assembly. Decoupling capacitors must be placed within 5 mm of each power pin: 0.1 µF X7R for every VCCINT/VCCIO pair, plus bulk 22 µF tantalum capacitors near each power-rail entry point. Estimated via-count requirement: 4-6 vias per power ball, all stitching to inner ground planes for thermal dissipation.
Estimated thermal analysis: at typical Stratix EP1S40 utilization (50% logic switching, 50% memory, 50% I/O toggling) at 200 MHz, the device dissipates 4-6 W. The 1020-ball BGA theta_JA is approximately 8 C/W with the recommended 33 mm x 33 mm PCB footprint, giving a 32-48 C junction temperature rise above ambient. A heatsink is recommended for closed-enclosure designs but generally not required for cards with forced-air cooling. Place thermal vias directly under the BGA's exposed thermal pad row to improve conduction to the inner ground plane.
First-generation Stratix FPGAs require Quartus II (legacy), NOT Quartus Prime - attempting to open an EP1S design in Quartus Prime 18.0+ will fail because Intel dropped support for the EP1S family. Maintain a Quartus II 9.1 installation with Service Pack 2 for any active EP1S project. Also note: the EP1S40F1020C5DM is obsolete per Intel's product lifecycle; design teams should plan a migration path to Cyclone IV/V or Stratix V before the part is no longer obtainable.
合規資訊
RoHS/REACH status not stated in verified web data. Original Altera date codes from 2002-2006 may be pre-RoHS; verify with distributor for specific date-code compliance certificates. AEC-Q100 not applicable - this is an industrial/commercial FPGA, not an automotive-grade part.