EP1S80F1020C7NGA - Stratix 79,040 LE FPGA, 773 I/O, 1020-BGA | Altera
MPN： EP1S80F1020C7NGA ✗ 停產EP1S80F1020C7NGA 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. Within the broader taxonomy of digital logic ICs, FPGAs sit between general-purpose microcontrollers (software-defined behaviour) and ASICs (hardware-fixed behaviour), occupying the position of hardware-reconfigurable logic. The Stratix family, Altera's flagship from the early 2000s, was the first to combine embedded TriMatrix memory, DSP blocks, and high-speed serial I/O on a single die.
Key features include 79,040 LEs, 7,427,520 total RAM bits organised in TriMatrix memory blocks, 22 DSP blocks for fixed- and floating-point arithmetic, and 8 high-speed transceiver channels supporting up to 3.125 Gbps. The device offers 6 PLLs with clock multiplier and divider capability, and 773 user I/Os across the 1020-ball FineLine BGA, providing ample connectivity for parallel memory buses, LVDS signalling, and standard CMOS interfaces.
The architecture combines LUT-based logic fabric with columnar and rowar memory, dedicated multiplier blocks, and clock networks tuned for high fan-out. Designers typically use Quartix II software with SOPC Builder for system-on-chip integration, configuring peripherals, memory controllers, and Nios II soft processors alongside custom RTL. The 130 nm process node delivers predictable timing closure at clock rates up to hundreds of MHz on critical paths.
Typical applications include high-speed data acquisition, telecom line-card prototyping, ASIC emulation, software-defined radio (SDR) baseband, and high-end DSP pre/post-processing. The combination of abundant block RAM and DSP slices allows designers to drop entire baseband or filter pipelines into hardware without external memory round-trips.
When designing with this FPGA, allocate sufficient PCB area for the 1020-ball BGA and use at least 8 routing layers for escape routing. Provide multiple decoupling capacitors near each power pin and follow Altera's Stratix Hardware Reference Guide for power sequencing, JTAG chain ordering, and configuration mode selection.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP1S80F1020C7NGA — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1S80F1020C7NGA （相同外形與佔位） — 差異在於 Operating Temperature, Package, RoHS Status, Process Technology, Mounting Type.
EP1S80F1020C7GA
✅ 直接替換聯絡詢價
查看資料表 →EP1S80F1020C7
✅ 直接替換聯絡詢價
查看資料表 →EP1S80F1020C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1S80F1020C6
✅ 直接替換聯絡詢價
查看資料表 →EP1S80F1020C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1S80F1020C5
✅ 直接替換聯絡詢價
查看資料表 →EP1S80F1020C7NGA 最大額定值與電氣特性
| Family | Stratix |
| Logic Elements (LEs) | 79,040 |
| Total RAM Bits | 7,427,520 |
| User I/O Count | 773 |
| 封裝 | 1020-BGA (FineLine BGA) |
| Process Node | 130 nm |
| DSP Blocks | 22 |
| Transceivers | 8 channels, up to 3.125 Gbps |
| PLLs | 6 |
| 工作溫度 | 0C to +85C (commercial) |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant (Pb-free NGA finish) |
| Lead-Free Finish | Yes (NGA = Pb-free) |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel |
EP1S80F1020C7NGA 1020-bga (fineline bga) 腳位配置指南
EP1S80F1020C7NGA（1020-bga (fineline bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1S80F1020C7NGA.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1S80F1020C7NGA 適用於 6 應用s: ASIC Prototyping and Verification, Telecommunications Line Cards, High-Speed Data Acquisition Systems, Software-Defined Radio (SDR) Baseband, High-End DSP Pre/Post Processing, ASIC Emulation and Rapid Prototyping.
ASIC Prototyping and Verification
The EP1S80F1020C7NGA fits ASIC prototyping because it provides 79,040 LEs and 7,427,520 RAM bits - enough capacity to map entire mid-range ASICs onto a single FPGA for pre-silicon verification. Its 773 user I/Os on a 1020-ball FineLine BGA allow engineers to bring out wide parallel buses matching the target ASIC's pinout, while 8 transceiver channels at 3.125 Gbps reproduce the serial interfaces of the ASIC for real-world I/O validation. The TriMatrix memory architecture also enables realistic modelling of embedded SRAM blocks. Engineers typically prototype 5-10M-gate ASIC designs on a Stratix EP1S80 with full system-level bring-up before committing to silicon.
推薦
Telecommunications Line Cards
The EP1S80F1020C7NGA is well suited to telecom line-card designs because the 8 multi-gigabit transceivers at 3.125 Gbps directly interface with SFP modules, backplanes, and RapidIO fabrics typical in central-office equipment. The 6 PLLs provide independent clock domains for framer, mapper, and traffic-manager functions, while 773 user I/Os accommodate parallel TDM buses, UTOPIA/posPHY interfaces, and external PHY connections. The 22 dedicated DSP blocks can implement channelised filters and FEC algorithms (Reed-Solomon, Viterbi) without consuming general fabric, keeping timing closure predictable in carrier-grade deployments.
推薦
High-Speed Data Acquisition Systems
The EP1S80F1020C7NGA fits multi-channel data-acquisition front-ends where 79,040 LEs and 7,427,520 RAM bits accommodate large parallel LVDS buffers, sample-rate converters, and trigger logic. The 773 I/Os accept LVDS data from multiple high-speed ADCs at rates up to 1 Gsps per channel, while the TriMatrix memory provides deep FIFO buffers for sustained streaming to DDR/DDR2 external memory. Designers can implement FIR/IIR filters, FFT engines, and digital down-conversion directly in the 22 DSP blocks, eliminating latency associated with discrete DSP chips and providing deterministic real-time response.
推薦
Software-Defined Radio (SDR) Baseband
The EP1S80F1020C7NGA fits SDR baseband processing because the 22 DSP blocks combined with 79,040 LEs implement multi-channel DDC/DUC chains, channel coding (LTE turbo, WCDMA Viterbi), and crest-factor reduction in a single device. The 7,427,520 RAM bits accommodate large scrambling sequences, constellation buffers, and HARQ context memories, while the 8 transceivers at 3.125 Gbps interface with digital RF front-ends or ADC/DAC JESD204 links. The 1020-ball FineLine BGA exposes enough LVDS pairs to capture parallel RF data from multi-antenna MIMO configurations used in 4G/5G prototyping.
推薦
High-End DSP Pre/Post Processing
The EP1S80F1020C7NGA fits video broadcast, medical imaging, and radar pre/post-processing pipelines because 22 dedicated DSP blocks deliver 176 18x18 multipliers at 250 MHz, implementing multi-tap FIR filters, FFT/iFFT cores, and 2D convolutions directly in hardware. The 7,427,520 RAM bits buffer scanlines, FFT windows, or radar range-Doppler maps without external DRAM round-trips, while the 773 I/Os accept CameraLink, DVI, or LVDS video streams and drive HDMI/DVI encoders. Designers achieve deterministic real-time performance with no CPU/OS jitter because all signal processing happens in the FPGA fabric.
推薦
ASIC Emulation and Rapid Prototyping
The EP1S80F1020C7NGA fits in-circuit emulation and rapid-prototyping platforms because the 79,040 LEs can be partitioned across multiple ASIC blocks with deterministic timing. Designers use the 6 PLLs to model asynchronous clock domains and the 8 transceivers to reproduce high-speed serial links found in modern SoCs. The 1020-ball FineLine BGA's 773 I/Os expose enough pins to break out 32-bit buses for memory-mapped slaves, while the TriMatrix memory models embedded SRAM behaviour. This is the canonical use case for which the Stratix EP1S80 was designed, with documented reference flows in the Altera ASIC Pro Toolkit.
推薦
推薦產品摘要
工程參考資料，適用於 EP1S80F1020C7NGA — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1S80F1020C7GA | EP1S80F1020C7 | EP1S80F1020C6N | EP1S80F1020C6 | EP1S80F1020C5N | EP1S80F1020C5 |
|---|---|---|---|---|---|---|---|
| Package | 1020-BGA (FineLine BGA) | 1020-BGA (FineLine BGA) - same | 1020-BGA (FineLine BGA) - same | 1020-BGA (FineLine BGA) - same | 1020-BGA (FineLine BGA) - same | 1020-BGA (FineLine BGA) - same | 1020-BGA (FineLine BGA) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements (LEs) | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 |
| Speed Grade | C7 | C7 | C7 | C6 (one step slower) | C6 (one step slower) | C5 (two steps slower) | C5 (two steps slower) |
| Ball Finish | Pb-free (NGA) | Leaded (GA) | Leaded | Pb-free (N) | Leaded | Pb-free (N) | Leaded |
| RAM Bits | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 |
| User I/O Count | 773 | 773 | 773 | 773 | 773 | 773 | 773 |
| Transceivers | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps |
主要差異化特點
- Pb-free ball finish (NGA) for RoHS-compliant assemblies (對比EP1S80F1020C7GA / EP1S80F1020C7)
- Highest speed grade (C7) for tightest timing closure (對比EP1S80F1020C6N (C6) and EP1S80F1020C5N (C5))
- Maximum density of original Stratix family (對比EP1S60F1020C7 (lower-density same family))
設計說明
The 1020-ball FineLine BGA requires a minimum of 8 PCB layers with dedicated power and ground planes. Use 0.5 mm ball pitch escape routing with microvia (laser-drilled) stack-ups; each BGA quadrant needs 4-5 breakout layers to fan out cleanly. Maintain continuous reference planes under the BGA and avoid signal routing across split planes, which can create signal-integrity violations at multi-gigabit transceiver rates.
Stratix EP1S80 devices require multiple supply rails: VCCINT (core, typically 1.5V), VCCIO (I/O banks, 1.5V-3.3V), VCCA_PLL (PLL analogue), and VCC transceiver supplies. Decoupling must include at least 12 x 0.1 uF + 4 x 10 uF per supply bank, with bulk 220-470 uF polymer or tantalum capacitors at the regulator outputs. Follow Altera's Stratix Hardware Reference Guide power-up sequencing: VCCINT, then VCCIO, then transceivers to avoid latch-up.
Configuration mode must be set correctly via MSEL[3:0] pins - selecting the wrong mode (e.g., Passive Serial vs Fast Passive Parallel) will leave the FPGA unconfigured at power-up. JTAG chain ordering matters: place the EP1S80 first in the chain with appropriate TCK pull-down and TMS pull-up resistors. The CONF_DONE pin requires a 10 kohm pull-up to VCCIO for reliable configuration completion detection.
At full utilisation (79,040 LEs @ 100% toggle rate), the EP1S80 can dissipate 5-8 W depending on clock rates and I/O switching. The FineLine BGA has a junction-to-ambient theta_JA of approximately 15-18 C/W with proper thermal via array underneath the package. Place a 6x6 thermal via grid (0.3 mm drill, 0.5 mm pitch) directly under the BGA thermal pad to provide a low-resistance thermal path to internal copper planes.
合規資訊
NGA suffix denotes Pb-free ball finish per Altera part-numbering convention, making this RoHS-compliant. AEC-Q100 is not applicable (commercial-grade FPGA). Halogen-free and conflict-mineral status not explicitly stated in verified data; recommend consulting Intel product declaration documents directly.
