EP1S80F1020C7 - Stratix 79,040 Logic Element FPGA | Intel (Altera)
MPN： EP1S80F1020C7 ✗ 停產EP1S80F1020C7 概覽
An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as block RAM, DSP multipliers, PLLs, and high-speed transceivers. Within the broader semiconductor taxonomy, FPGAs sit alongside CPUs, GPUs, and ASICs as a programmable hardware platform, and are commonly categorized under logic ICs / programmable logic. The Stratix family was Altera's first-generation high-performance FPGA family, later succeeded by Stratix II, III, IV, and V. The EP1S80 sits at the top of the Stratix density ladder, providing 7,427,520 typical gates which is the maximum logic density available in the family.
Key specifications include 79,040 logic elements organized into 7,904 logic array blocks (LABs), 773 user I/O pins supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X), embedded TriMatrix memory blocks, dedicated DSP blocks for high-speed multiplication and accumulation, up to 12 PLLs for clock management, and configuration via passive serial (PS), fast passive parallel (FPP), or JTAG modes. The 1020-ball FBGA package uses a 1 mm pitch and measures 33 x 33 mm on the PCB, requiring multi-layer PCB design with controlled-impedance traces and matched-length routing for the high-speed LVDS pairs.
Typical applications include high-throughput digital signal processing (software-defined radio, radar, video processing), telecom line cards and protocol bridging, high-speed serial protocol bridging, ASIC prototyping and emulation, test and measurement equipment, and military/aerospace signal processing platforms where large logic density and embedded DSP resources are required. The integrated PLLs and dedicated clock networks also make it suitable as a glue-logic aggregation device between multiple processors and peripherals.
When designing with the EP1S80F1020C7, attention must be paid to power architecture: a multi-rail supply (VCCINT, VCCIO banks, VCCPD, VCCA_PLL, VCCBAT) is required, with multiple decoupling capacitors placed close to the BGA balls. The Quartus II design suite (Altera/Intel) is the required toolchain for synthesis, place-and-route, and bitstream generation. The 33 x 33 mm FBGA package requires a high-layer-count PCB (typically 8 to 12 layers) with via-in-pad or dog-bone fanout for reliable BGA assembly.
This page synthesizes distributor pricing, drop-in Stratix family alternatives, and practical design notes (BGA fanout, multi-rail decoupling, configuration mode selection) not consolidated in the manufacturer datasheet, helping engineers compare density, speed grade, and I/O count when selecting a Stratix device.
直接替換替代品，適用於 EP1S80F1020C7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1S80F1020C7 （相同外形與佔位） — 差異在於 Operating Temperature, Package, RoHS Status, Speed Grade, Mounting Type.
EP1S80F1020C6
✅ 直接替換聯絡詢價
查看資料表 →EP1S80F1020C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1S80F1020C5
✅ 直接替換聯絡詢價
查看資料表 →EP1S80F1020C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1S80F1020I7
✅ 直接替換📋 參考替代品（不在目錄中）
EP1S80F1020C7 最大額定值與電氣特性
| Series | Stratix |
| Logic Elements | 79,040 |
| System Gates (typical) | 7,427,520 |
| Logic Array Blocks (LABs) | 7,904 |
| User I/O Pins | 773 |
| Total Package Pins | 1020 (ball) |
| Package Type | FBGA-1020 (33 x 33 mm, 1 mm pitch) |
| Core Supply Voltage (VCCINT) | 1.425 V to 1.575 V |
| 工作溫度 | 0 C to 85 C (Commercial) |
| Logic Family | CMOS, SRAM-based configuration |
| Process Technology | 1.5 V, 0.13 um CMOS |
| Configuration Modes | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |
| PLLs | 12 (per datasheet family) |
| Memory | TriMatrix embedded SRAM blocks |
| DSP Blocks | Dedicated hardware multipliers/accumulators |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant (lead-free FBGA) |
EP1S80F1020C7 fbga-1020 (33 x 33 mm, 1 mm pitch) 腳位配置指南
EP1S80F1020C7（fbga-1020 (33 x 33 mm, 1 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1S80F1020C7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1S80F1020C7 適用於 6 應用s: Software-Defined Radio (SDR) Baseband Processing, Telecom Line Card and Protocol Bridging, ASIC Prototyping and Emulation, High-Speed Video and Image Processing, Test and Measurement Instrumentation, Industrial Control and High-Speed Glue Logic.
Software-Defined Radio (SDR) Baseband Processing
The EP1S80F1020C7's 79,040 logic elements and dedicated DSP blocks (with hardware multipliers and accumulators) make it well-suited for SDR baseband processing where multiple parallel FIR filters, FFT pipelines, and channelizers must be implemented in real time. With 12 PLLs and 773 user I/Os, the device can simultaneously clock ADC/DAC sample domains, the FPGA fabric, and external DSP coprocessors. The 1.5 V Stratix core is fast enough to implement 100+ MSPS DDC/DUC chains. Compared to a DSP-only processor, the parallel fabric delivers deterministic latency for protocol stacks, and the 1020-ball FBGA supports the high I/O count needed for parallel ADC interfaces.
推薦
Telecom Line Card and Protocol Bridging
Telecom line cards aggregate multiple E1/T1, E3/DS3, or SONET/SDH channels and bridge them across fabrics such as POS-PHY, Utopia, or Serial RapidIO. The EP1S80F1020C7's 773 user I/Os and multiple I/O standards (LVDS, LVTTL, HSTL, SSTL) directly support these multi-protocol bridging functions without external glue logic. Its TriMatrix memory blocks implement the cell/packet buffers required for backpressure, and the 12 PLLs derive all the required line-clock domains from a single system reference. The commercial temperature grade (0 C to 85 C) and FBGA-1020 footprint suit central-office (CO) equipment.
推薦
ASIC Prototyping and Emulation
ASIC prototyping and emulation require maximum logic density per package to map multi-million-gate ASICs onto a small number of FPGAs. The EP1S80F1020C7, with 7,427,520 system gates and 79,040 logic elements, can host approximately 3-4 million gates of synthesized ASIC logic plus memory and IP cores. Multiple EP1S80F1020C7 devices can be paralleled on a multi-FPGA prototyping board to emulate ASICs in the 10-20M gate class. The 1020-ball FBGA exposes enough high-speed I/Os for chip-to-chip time-domain-multiplexed partitioning.
推薦
High-Speed Video and Image Processing
Real-time video processing pipelines (HD-SDI capture, MPEG-2/H.264 encode assist, multi-channel image warping) demand large memory bandwidth, parallel DSP, and high I/O counts. The EP1S80F1020C7's embedded TriMatrix memory (M512, M4K, M-RAM blocks) implements line buffers, frame buffers, and DCT/IDCT lookup tables on-chip without off-chip SDRAM round-trips. The 773 I/Os can directly interface to HD-SDI deserializers, DDR SDRAM controllers, and PCI-X bridges. The 1.5 V core delivers the Fmax needed for real-time SDI pixel-rate processing at 148.5 MHz.
推薦
Test and Measurement Instrumentation
Test and measurement instruments (logic analyzers, protocol analyzers, arbitrary waveform generators) require deep acquisition memory, parallel signal processing, and fast pattern recognition. The EP1S80F1020C7's 79,040 logic elements can implement multi-channel state machines, pattern generators, and triggering logic; its 12 PLLs derive multiple sample-clock domains from a single TCXO reference. The FBGA-1020 footprint supports 16+ high-speed LVDS probe channels at 1 Gbps. Commercial temperature grade and Quartus II design flow make it a strong fit for benchtop and rack-mount instrument designs.
推薦
Industrial Control and High-Speed Glue Logic
When a microcontroller or DSP needs a high-density programmable companion, the EP1S80F1020C7 functions as a glue-logic aggregation device: parallel I/O expansion, motor-control PWM generation, custom peripheral bridges, and high-speed interfaces (PCI, PCI-X, I2C, SPI) that the host CPU does not support natively. Its 773 I/Os aggregate dozens of sensor inputs, encoder interfaces, and actuator drive signals. The commercial temperature grade suits factory-floor and process-control enclosures with air cooling. The 1020-ball FBGA requires careful thermal design for high-utilization designs.
推薦
推薦產品摘要
工程參考資料，適用於 EP1S80F1020C7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1S80F1020C6 | EP1S80F1020C6N | EP1S80F1020C5 | EP1S80F1020C5N | EP1S80F1020I7 |
|---|---|---|---|---|---|---|
| Package | FBGA-1020 (33x33 mm, 1 mm pitch) | FBGA-1020 (33x33 mm, 1 mm pitch) - same | FBGA-1020 (33x33 mm, 1 mm pitch) - same | FBGA-1020 (33x33 mm, 1 mm pitch) - same | FBGA-1020 (33x33 mm, 1 mm pitch) - same | FBGA-1020 (33x33 mm, 1 mm pitch) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 |
| System Gates | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 |
| User I/O Pins | 773 | 773 | 773 | 773 | 773 | 773 |
| Speed Grade | 7 (commercial, slower) | 6 (faster) | 6 (faster) | 5 (fastest in family) | 5 (fastest in family) | 7 (industrial temp) |
| Temperature Grade | Commercial (0 C to 85 C) | Commercial (0 C to 85 C) | Commercial (0 C to 85 C) | Commercial (0 C to 85 C) | Commercial (0 C to 85 C) | Industrial (-40 C to 100 C) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Highest density in the original Stratix family (7.4M system gates) (對比EP1S60F1020C7)
- Speed grade 6 upgrade path exists without PCB change (對比EP1S80F1020C6)
- Industrial-temperature variant available in same package (對比EP1S80F1020I7)
設計說明
The EP1S80F1020C7 requires a multi-rail power architecture: VCCINT (1.5 V core, up to several amps under full utilization), VCCIO (per I/O bank, configurable 1.5/1.8/2.5/3.3 V), VCCPD (3.3 V), VCCA_PLL (1.5 V for analog PLL supply), and VCCBAT (battery backup for configuration RAM). A multi-phase buck controller or point-of-load (POL) regulators are recommended; place decoupling capacitors (0.1 uF, 0.01 uF, 10 uF bulk) immediately adjacent to the BGA balls via microvia fanout. Insufficient decoupling on VCCA_PLL will manifest as PLL jitter and loss of lock.
The 33 x 33 mm FBGA-1020 with 1 mm ball pitch requires a high-layer-count PCB (typically 8 to 12 layers) with microvia or via-in-pad (VIP) technology. Layer stack-up should place solid GND planes adjacent to the BGA fanout layer to provide low-impedance current return paths. Use a matched-length tuning strategy (within 25 mil) for LVDS and DDR interfaces, and reserve dedicated power planes for the 1.5 V core to avoid IR drop across the 1 mm BGA pitch.
Configuration pinout is critical: nCONFIG (input, pull-up to VCCPD), nSTATUS (open-drain, pull-up), CONF_DONE (open-drain, pull-up), MSEL[3:0] (set the configuration mode: PS, FPP, AS, or JTAG), and TCK/TMS/TDO/TDI for JTAG. Tie the MSEL pins to the correct value for Passive Serial (MSEL=0000) or FPP (MSEL=0100) configuration. Add a dedicated JTAG header (2x5 0.1 inch or 2x10 ribbon) for programming and debug. For multi-FPGA boards, daisy-chain the JTAG TDO to TDI across devices.
Common pitfalls include: (1) using too-few decoupling capacitors on VCCA_PLL (add at least 0.1 uF + 10 uF directly per PLL supply pin); (2) failing to pull-up nSTATUS and CONF_DONE, causing the device to fail configuration; (3) mixing 1.5 V and 3.3 V I/O in the same bank without checking the VCCIO constraints; (4) omitting a battery on VCCBAT, causing configuration to be lost on power-down; (5) using Quartus Prime (modern) instead of Quartus II 13.0sp1 (legacy), which is the last version to support first-generation Stratix.
合規資訊
RoHS-compliant lead-free FBGA package per Altera product page. AEC-Q100 is not applicable to FPGAs of this density class. Halogen-free status not stated in the available data.