EP1SGX40DF1020C - Stratix GX FPGA, 41250 LEs, 1020-BGA | Altera
MPN： EP1SGX40DF1020C ✗ 停產EP1SGX40DF1020C 概覽
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing, and embedded resources such as block RAM, DSP blocks, and (on Stratix GX) high-speed serial transceivers. FPGAs occupy the high-end of the programmable-logic hierarchy between fixed-function ASICs and CPLDs, sitting above discrete logic ICs and below full-custom silicon in terms of integration density and per-unit cost. Stratix GX specifically targets serial connectivity, where transceiver-based designs replace parallel buses with multi-gigabit serial links to reduce pin count, EMI, and board complexity.
Key features of the EP1SGX40DF1020C include up to 20 high-speed transceivers operating at data rates between 600 Mbps and 3.125 Gbps, support for multiple serial protocols (PCI Express, Gigabit Ethernet, SerialLite, XAUI), dedicated hardware for 8B/10B encoding/decoding, and on-chip PLLs with flexible clock synthesis. The TriMatrix memory architecture provides three block RAM sizes (512 bits, 4 Kbits, 512 Kbits) for efficient buffering and packet storage. The 1020-ball BGA package at 1.0 mm pitch enables dense I/O and signal-integrity-critical transceiver routing.
The architecture uses a 1.5 V core supply for the logic fabric, with dedicated PLL and transceiver power domains, and supports both commercial (0C to 85C) and industrial temperature grades. Compared with predecessor Stratix devices, Stratix GX adds hardened serial-deserializer (SERDES) macros that previously consumed general-purpose logic, freeing FPGA fabric for application-specific processing while reducing power per gigabit of serial throughput.
Typical applications include high-speed serial backplane switching, telecom line cards implementing XAUI or PCI Express endpoints, broadcast video routing, test and measurement instrumentation, and ASIC prototyping. The combination of high logic density and integrated transceivers suits system designs where a single programmable device replaces multiple ASSPs plus glue logic.
When designing with this device, allocate sufficient PCB layers and decoupling capacitance to the transceiver power rails, since multi-gigabit SERDES performance is sensitive to power-supply noise. Reference Altera application notes for the Stratix GX development kit for recommended stack-up, termination, and signal-integrity guidelines for the 1020-BGA footprint.
This page synthesizes distributor pricing, same-package drop-in Stratix GX alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP1SGX40DF1020C — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX40DF1020C （相同外形與佔位） — 差異在於 Operating Temperature, Speed Grade, Family, Package, Package Type.
EP1SGX40CF1020C
✅ 直接替換📋 參考替代品（不在目錄中）
EP1SGX40CF1020C7
✅ 直接替換📋 參考替代品（不在目錄中）
EP1SGX40CF1020I5
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C6
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C7
✅ 直接替換聯絡詢價
查看資料表 →EP1S40F1020C5
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C 最大額定值與電氣特性
| Family | Stratix GX |
| Logic Elements | 41250 |
| Total RAM Bits | 3423744 |
| User I/Os | 624 |
| Operating Supply Voltage (Core) | 1.5 V |
| Transceiver Data Rate | 600 Mbps to 3.125 Gbps |
| Number of Transceivers | 20 (max, device-dependent) |
| Package Type | 1020-ball FBGA, 33 x 33 mm, 1.0 mm pitch |
| 工作溫度 | 0C to +85C (commercial grade) |
| Number of LABs | 4125 |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant |
| Logic Family | CMOS |
| Block RAM Type | TriMatrix (512-bit, 4 Kbit, 512 Kbit) |
| Configuration Technology | SRAM-based, LUT-based |
EP1SGX40DF1020C 1020-ball fbga, 33 x 33 mm, 1.0 mm pitch 腳位配置指南
EP1SGX40DF1020C（1020-ball fbga, 33 x 33 mm, 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX40DF1020C.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX40DF1020C 適用於 6 應用s: Telecom Line Card with XAUI, PCI Express Endpoint Card, Broadcast Video Router, Serial Backplane Aggregation, ASIC Prototyping Platform, Test and Measurement Instrumentation.
Telecom Line Card with XAUI
The EP1SGX40DF1020C's 20 hardened 3.125 Gbps transceivers and 41,250 LEs make it an ideal aggregation point for telecom line cards implementing XAUI (4x 3.125 Gbps lanes per port). Per the Stratix GX datasheet, the device supports 8B/10B encoding and clock-data recovery, allowing a single FPGA to terminate multiple XAUI ports while running forwarding logic in fabric. Designers route four SERDES channels per XAUI port and dedicate the remaining LEs to queuing and table lookup.
推薦
PCI Express Endpoint Card
The EP1SGX40DF1020C implements PCI Express x4 or x8 endpoints using its integrated transceivers, achieving 2.5 Gbps per lane per the Stratix GX datasheet. With 41,250 LEs available, designers can implement the PIPE PHY interface plus the protocol stack (transaction layer, data link layer) in fabric. This part was widely used in pre-2010 server adapter cards, RAID controllers, and FPGA-based accelerator boards requiring low-latency host interconnect.
推薦
Broadcast Video Router
Broadcast video routers require switching uncompressed SDI or HD-SDI streams across many ports without compression artifacts. The EP1SGX40DF1020C's high-speed transceivers handle SMPTE 259M/292M serial digital video at 270 Mbps to 1.485 Gbps, while the 41,250 LEs implement the crosspoint switch matrix, embedded audio embedding, and ancillary data processing. Per Altera reference designs, a single Stratix GX can replace multiple ASSPs in mid-size routers.
推薦
Serial Backplane Aggregation
Multi-gigabit serial backplanes in ATCA or proprietary chassis aggregate line-card traffic across a switched fabric. The EP1SGX40DF1020C's 20 transceivers at 3.125 Gbps deliver up to 62.5 Gbps aggregate bandwidth, suitable for 10-20 port aggregation switches. The device's TriMatrix block RAM (3.4 Mbits total) buffers packets during switching, while the LEs implement custom scheduling and congestion management algorithms.
推薦
ASIC Prototyping Platform
The EP1SGX40DF1020C's 41,250 LEs plus high-speed I/O made it a popular ASIC prototyping target for pre-silicon validation of multi-million-gate designs. Per the Stratix GX datasheet, the device supports live insertion of transceivers into ASIC verification environments, enabling software development to start months before the real ASIC returns from foundry. Quartus II design flows allow rapid recompilation of RTL into the FPGA fabric.
推薦
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol analyzers use the EP1SGX40DF1020C to acquire and process multi-gigabit serial data streams. The 20 transceivers capture data at up to 3.125 Gbps per channel, while the LEs implement triggering, pattern matching, and protocol decoding (PCIe, SATA, XAUI). Per Altera reference designs, the TriMatrix block RAM enables deep trace acquisition buffers of 3.4 Mbits per device.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX40DF1020C — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX40CF1020C | EP1SGX40CF1020C7 | EP1SGX40CF1020I5 | EP1SGX40DF1020C6 | EP1SGX40DF1020C7 | EP1S40F1020C5 |
|---|---|---|---|---|---|---|---|
| Package | 1020-ball FBGA, 33x33 mm, 1.0 mm pitch | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same |
| Brand | Altera (Intel FPGA) | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 41250 | 41250 | 41250 | 41250 | 41250 | 41250 | 41250 |
| Total RAM Bits | 3423744 | 3423744 | 3423744 | 3423744 | 3423744 | 3423744 | 3423744 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C | 0C to +85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Integrated 3.125 Gbps SERDES transceivers (對比EP1S40F1020C5)
- Industrial temperature grade variant available (對比EP1SGX40DF1020C)
- Speed grade options for power/performance tuning (對比EP1SGX40DF1020C6)
設計說明
Estimated: the 1020-ball FBGA at 1.0 mm pitch requires an 8-layer minimum PCB stack-up with dedicated ground and power planes adjacent to the BGA. Route transceiver differential pairs with 100 ohm differential impedance and keep total length mismatch under 150 mils for 3.125 Gbps operation. Reference the Stratix GX Development Kit user guide for via pattern, antipad geometry, and decoupling capacitor placement.
Estimated: at maximum utilization the Stratix GX EP1SGX40 can dissipate 10-15 W, requiring multiple voltage rails (1.5 V core, 2.5 V/3.3 V transceiver analog, 1.5 V PLL). Use a minimum of 20 low-ESR ceramic decoupling capacitors (0.1 uF and 10 uF mix) placed within 100 mils of the BGA balls. Bulk capacitance of 220 uF or larger per rail is recommended.
Do not route user I/O signals through transceiver ball pairs - the differential SERDES pins are bonded to dedicated transceiver macros and cannot be used as general-purpose I/O. Verify the IBIS or Quartus pin-out file before PCB layout. Also note that the EP1SGX40DF1020C is obsolete; new designs should target Stratix IV/V GX or Cyclone V/10 GX for long-term availability.
Transceiver performance at 3.125 Gbps is sensitive to power-supply noise; the Stratix GX datasheet recommends separate analog and digital grounds tied at a single point near the FPGA. Use ferrite beads between digital and analog transceiver supplies. Pre-emphasis and equalization settings must be tuned per channel using the Quartus II transceiver toolkit.
合規資訊
RoHS and lead-free compliant per Altera product documentation. AEC-Q100 not applicable (FPGA is not an automotive-grade qualified part). Conflict minerals compliance per Altera/Intel CMRT filings.
