EP1SGX40DF1020C6N - Stratix GX FPGA, 41,250 LEs, 1020-FBGA | Intel
MPN： EP1SGX40DF1020C6N ✗ 停產EP1SGX40DF1020C6N 概覽
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, allowing engineers to implement arbitrary digital logic, signal processing, and memory functions in silicon without a custom ASIC tape-out. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA) and are widely used for prototyping, low-volume production, and applications where post-silicon logic updates are required. The Stratix GX family specifically targets high-speed serial I/O and embedded transceiver applications such as communications infrastructure, broadcast video, and defense signal processing.
Key features include 3,423,744 embedded RAM bits, integrated high-speed transceivers supporting multi-gigabit serial protocols, and a commercial operating temperature range of 0 °C to 85 °C. The DF1020C6N speed grade designates a 1020-ball FBGA package with the device identifier indicating the 40K logic-element density tier. The Stratix GX device family is built on 130 nm CMOS technology and provides dedicated hardware multipliers, embedded memory blocks, and digital signal processing (DSP) blocks alongside the general-purpose logic fabric.
Typical applications for the EP1SGX40DF1020C6N include telecom line cards with SERDES backplanes, software-defined radio (SDR) front ends, video broadcast encoders/decoders, military secure communications, and high-performance ASIC prototyping. The combination of high logic density, multi-gigabit transceivers, and substantial on-chip memory makes it well suited to designs that previously required multiple discrete ASSPs or custom ASICs.
When designing with this device, plan for the 33 x 33 mm 1020-ball BGA land pattern, multi-layer PCB stack-up with controlled-impedance SERDES traces, and thermal management via the exposed die / heat-spreader interface. Reference designs from the Altera Stratix GX handbook and the Quartus II development toolchain should be consulted for transceiver channel configuration, PLL setup, and pinout assignment before PCB layout.
This page synthesizes distributor pricing, drop-in replacement parts from the same Stratix GX family, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP1SGX40DF1020C6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX40DF1020C6N （相同外形與佔位） — 差異在於 Operating Temperature, Speed Grade, Package, Package Type, Family.
EP1SGX40GF1020C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40GF1020C7N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C6ES
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C6BN
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C6N 最大額定值與電氣特性
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Number of LABs/CLBs | 4125 LABs / 4697 CLBs |
| Total RAM Bits | 3,423,744 |
| Number of I/O | 624 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Internal Frequency | 5000 MHz |
| 工作溫度 | 0 C to 85 C |
| Package Type | 1020-FBGA (33 x 33 mm, 1 mm pitch) |
| 安裝類型 | Surface Mount |
| Logic Family | CMOS |
| Speed Grade | C6 |
EP1SGX40DF1020C6N 1020-fbga (33 x 33 mm, 1 mm pitch) 腳位配置指南
EP1SGX40DF1020C6N（1020-fbga (33 x 33 mm, 1 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX40DF1020C6N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX40DF1020C6N 適用於 6 應用s: Telecom Line Cards and SERDES Backplanes, Software Defined Radio (SDR) Baseband Processing, Broadcast Video Encoding and Processing, High-Performance ASIC Prototyping, Military and Secure Communications, Industrial Test and Measurement Instrumentation.
Telecom Line Cards and SERDES Backplanes
The EP1SGX40DF1020C6N fits telecom line-card designs because its integrated multi-gigabit transceivers and 624 user I/Os directly support SERDES-based backplane interconnect at OC-192 / 10G rates. With 41,250 logic elements and 3.4 Mbits of embedded RAM, it handles packet classification, framing, and forwarding logic without external ASSPs. The 1020-FBGA package exposes enough SERDES channels and parallel I/O for multi-port line cards. Placed on a multi-layer PCB with controlled-impedance traces, the device replaces what would otherwise be a discrete SERDES chip plus glue logic. Designers should follow the Stratix GX handbook's reference design for transceiver channel placement to minimize jitter.
推薦
Software Defined Radio (SDR) Baseband Processing
The EP1SGX40DF1020C6N suits SDR baseband designs because its 41,250 logic elements, 3.4 Mbit embedded RAM, and dedicated DSP blocks deliver sufficient processing throughput for wideband digital down-conversion, channelization, and demodulation. The 5000 MHz internal clock supports multi-stage FIR filtering and FFT pipelines in a single device. Combined with the integrated high-speed transceivers, the FPGA streams digitized RF data directly into the fabric for real-time processing. The 1020-FBGA exposed-die package enables heatsink attachment for sustained DSP workloads. Reference designs from the Altera DSP Builder flow accelerate development of SDR baseband IP cores.
推薦
Broadcast Video Encoding and Processing
The EP1SGX40DF1020C6N fits broadcast video encoder/decoder applications because its 41,250 logic elements and 3.4 Mbit embedded RAM enable real-time SD/HD video processing, compression, and overlay composition in a single device. The 624 user I/Os handle multiple video streams, audio interfaces, and control channels simultaneously. The integrated transceivers support SDI (Serial Digital Interface) at 270 Mbps / 1.485 Gbps / 2.97 Gbps rates standard in broadcast studios. Compared with ASSP encoders, the FPGA offers post-deployment codec upgrades. Designers should use the Quartus II video IP suite and consult broadcast reference designs for SDI physical-layer implementation.
推薦
High-Performance ASIC Prototyping
The EP1SGX40DF1020C6N is well-suited to ASIC prototyping because its 41,250 logic elements, 3.4 Mbit embedded RAM, and 624 I/Os provide enough capacity to map mid-complexity ASIC designs at production clock rates. Multi-FPGA partitioning is possible via the high-speed transceivers for prototyping ASICs too large for one device. The 1020-FBGA package exposes wide buses for bridging to memory and external test equipment. Designers benefit from the Quartus II synthesis flow supporting direct migration of synthesizable ASIC RTL. Use the Stratix GX handbook's ASIC prototyping reference flow for clock-domain crossing and I/O mapping.
推薦
Military and Secure Communications
The EP1SGX40DF1020C6N fits military secure-communications equipment where its 41,250 logic elements, integrated transceivers, and 1020-FBGA package support cryptographic processing, signal conditioning, and multi-channel data aggregation. The extended-temperature variant EP1SGX40DF1020C6ES supports ruggedized deployment in temperature-stressed environments. The FPGA's reconfigurability allows post-deployment cryptographic algorithm updates critical for lifecycle management. Designers should consult the Altera industrial/military temperature datasheet supplement for derating guidance. The Quartus II development flow includes IP cores for AES, SHA, and public-key acceleration common in secure-radio designs.
推薦
Industrial Test and Measurement Instrumentation
The EP1SGX40DF1020C6N fits high-end test and measurement instruments because its 41,250 logic elements, 3.4 Mbit embedded RAM, and 624 user I/Os enable real-time DSP, parallel ADC/DAC interfacing, and complex triggering logic in a single chip. The integrated transceivers handle high-speed serial protocols such as PCIe, Serial RapidIO, and 10G Ethernet used in modern ATE platforms. The 1020-FBGA package supports the dense ball-out required for parallel LVDS ADC interfaces. Designers can leverage Altera's DSP Builder and IP library for FFT, FIR, and arbitrary waveform generation, reducing time-to-market for new instruments.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX40DF1020C6N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX40GF1020C6N | EP1SGX40GF1020C7N | EP1SGX40DF1020C6ES | EP1SGX40DF1020C6BN | EP1SGX40DF1020C5N | EP1SGX40DF1020C |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-FBGA (33 x 33 mm, 1 mm pitch) | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Transceiver Variant | DF (Differential SERDES) | GF (Giga-bit Fibre) | GF (Giga-bit Fibre) | DF (Differential SERDES) | DF (Differential SERDES) | DF (Differential SERDES) | DF (Differential SERDES) |
| Speed Grade | C6 | C6 | C7 (faster) | C6 | C6 | C5 (slower) | Unsuffixed |
| Number of I/O | 624 | 624 | 624 | 624 | 624 | 624 | 624 |
| Total RAM Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
主要差異化特點
- Drop-in compatible with multiple Stratix GX 40K variants on the same 1020-FBGA PCB (對比EP1SGX40GF1020C6N)
- Mid-density tier of Stratix GX family with high logic and RAM balance (對比EP1S40F1020C6N (Stratix non-GX))
- Speed grade flexibility across C5/C6/C7 with same die (對比EP1SGX40DF1020C5N (C5 speed grade))
設計說明
The 1020-ball FC-FBGA package at 1 mm ball pitch requires a multi-layer PCB stack-up with laser-drilled microvias in the top layer and conventional through-vias in inner layers. Per the Altera Stratix GX handbook, the 33 x 33 mm footprint demands at least 4-6 PCB layers to fan out the BGA and route controlled-impedance SERDES traces. Use the manufacturer's land-pattern and via-in-pad recommendations verbatim; deviations cause solder joint defects and SERDES signal-integrity loss at multi-gigabit rates.
Estimated: at maximum toggle activity across all 41,250 logic elements running at 5000 MHz with the 1.5 V core, the device can dissipate 10-15 W. The 1020-FBGA package exposes the silicon die for direct heat-sink attachment; without a heat-spreader, junction temperature can exceed 100 C in still air. Designers should attach a thermal interface material (TIM) plus heat sink or use a PCB copper pour with thermal vias per the Stratix GX thermal design guide. Industrial variants (C6ES) extend the operating range for harsh environments.
Do not migrate a Quartus II design targeting EP1SGX40DF1020C6N to a different speed grade (e.g., C5, C7) without re-running timing analysis. Speed-grade transitions change setup/hold margins for internal paths and SERDES channels, and may require I/O standard or PLL reassignment. Also verify that the chosen transceiver variant (DF vs GF) supports the protocol you need; mixing DF and GF parts on a previously-qualified PCB layout will pass pinout but fail link training at the SERDES level.
合規資訊
RoHS / REACH / lead-free status not in verified web data - set to unknown; consult Altera/Intel product page for the specific EP1SGX40DF1020C6N ordering code. AEC-Q100 not applicable for FPGAs in automotive; consult AEC-Q100-qualified automotive-grade parts if required.
