EP1SGX40GF1020C6NG - Stratix GX 41,250 LEs FPGA, FBGA-1020 | Intel
MPN： EP1SGX40GF1020C6NG ✗ 停產EP1SGX40GF1020C6NG 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, dedicated DSP slices, block RAM, and high-speed I/O. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA) and offer the highest logic density and the highest I/O count of any programmable device. They are used wherever an application requires hardware-level parallelism, deterministic latency, or a logic density that exceeds the capability of microcontrollers and DSPs.
Key features of the EP1SGX40GF1020C6NG include 624 maximum user I/O pins, embedded high-speed transceivers for multi-gigabit serial links, dedicated multiplier blocks supporting DSP workloads, and TriMatrix embedded memory with true dual-port RAM configurations. The device also exposes four phase-locked loops (PLLs) for clock synthesis and supports in-system programmability via the standard Altera (now Intel) Quartus II design flow.
The architecture is built around the Stratix GX Logic Array Block (LAB), composed of 10 Logic Elements (LEs) per LAB, with each LE containing a 4-input look-up table (LUT), a programmable register, and a carry chain. The embedded transceivers support industry-standard serial protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. This combination of dense logic, on-chip memory, and hardened serial I/O enables the device to act as a complete system-on-chip (SoC) for protocol bridging, line-card aggregation, and baseband processing.
Typical applications include high-speed serial interface bridging, telecom line cards, test and measurement equipment, broadcast video processing, and defense/aerospace signal processing. Designers also use the Stratix GX family to prototype ASICs and to deploy low-volume custom silicon with a faster time-to-market than mask-programmed alternatives.
When designing with this device, ensure the Quartus II fitter report confirms timing closure at the target clock frequency, and validate signal-integrity on the 1 mm pitch FBGA escape routing with a controlled-impedance PCB stack-up. Pair the device with the dedicated Intel configuration memory (EPCS or EPCQ) for in-field updates.
This page synthesizes verified distributor pricing, drop-in alternatives drawn from the Stratix GX family, and practical design notes not aggregated on any single manufacturer page, giving procurement and engineering teams a single decision point.
直接替換替代品，適用於 EP1SGX40GF1020C6NG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX40GF1020C6NG （相同外形與佔位） — 差異在於 Package, Operating Temperature, Mounting Type, Logic Family, Core Supply Voltage.
EP1SGX40GF1020C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40GF1020C6
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40GF1020C6L
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40GF1020C6ES
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40GF1020C6BN
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40GF1020C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40FF1020C6
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40GF1020C6NG 最大額定值與電氣特性
| Series | Stratix GX |
| Logic Elements | 41,250 |
| Embedded Memory | 3,423,744 bits |
| Embedded DSP Blocks | 20 (typical value; see _validation_note) |
| Maximum User I/O Pins | 624 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 封裝 | FBGA-1020 (33 x 33 mm, 1 mm pitch) |
| 工作溫度 | 0 C to 85 C (Commercial) |
| Speed Grade | C6 |
| Transceivers | Embedded high-speed serial transceivers (GX family) |
| PLL Count | 4 (typical value; see _validation_note) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | unknown |
| Logic Family | CMOS |
EP1SGX40GF1020C6NG fbga-1020 (33 x 33 mm, 1 mm pitch) 腳位配置指南
EP1SGX40GF1020C6NG（fbga-1020 (33 x 33 mm, 1 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX40GF1020C6NG.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX40GF1020C6NG 適用於 6 應用s: Telecom Line-Card Aggregation, High-Speed Serial Interface Bridging, Broadcast Video Processing, Test and Measurement Equipment, ASIC Prototyping and Emulation, Defense and Aerospace Signal Processing.
Telecom Line-Card Aggregation
The EP1SGX40GF1020C6NG is well suited to telecom line-card aggregation because it combines 41,250 logic elements with embedded multi-gigabit serial transceivers that natively support protocols such as Gigabit Ethernet, XAUI, Serial RapidIO, and PCI Express. In a typical line card, the device acts as a protocol-bridging framer and mapper, aggregating lower-rate client signals onto a higher-rate uplink while the 3.4 Mbits of block RAM provides elasticity buffers and the 624 user I/Os expose backplane interfaces. Designers rely on its hardened transceivers to avoid external PHY ICs and on its Quartus II timing closure to hit carrier-grade jitter budgets.
推薦
High-Speed Serial Interface Bridging
For bridging PCIe to Serial RapidIO, SATA to Fibre Channel, or custom LVDS links, the EP1SGX40GF1020C6NG delivers the protocol-agnostic flexibility of an FPGA together with the deterministic latency of its hardened transceiver channels. The 41,250 LEs accommodate full link-layer state machines, while the 20 DSP blocks handle CRC, scrambling, and 8b/10b encoding/decoding. The 1.5 V core and 0-85 C commercial temperature range suit central-office equipment, and the 1020-ball FBGA escape is compatible with standard high-speed PCB stack-ups.
推薦
Broadcast Video Processing
In broadcast video processing - SDI routers, format converters, and frame synchronizers - the EP1SGX40GF1020C6NG provides the parallel arithmetic density needed for real-time chroma resampling, deinterlacing, and frame-rate conversion. The 3,423,744 bits of embedded memory double-buffer full HD frames, the 624 I/Os expose parallel video buses plus multiple SDI links, and the DSP blocks perform 10-tap polyphase filtering without off-chip multipliers. Quartus II reference designs shorten development time for SMPTE 259M/292M/424M serial digital interfaces.
推薦
Test and Measurement Equipment
Test and measurement platforms - protocol analyzers, BERT testers, and oscilloscope front-ends - benefit from the EP1SGX40GF1020C6NG's combination of fast transceivers, deep block RAM, and reconfigurable logic. Engineers implement custom trigger sequencers in the LEs, store captured waveforms in the 3.4 Mbit memory, and drive high-speed ADC/DAC data paths through the 624 user I/Os. The 1 mm pitch FBGA escape supports fine-pitch controlled-impedance routing required for multi-GHz analog front-ends, and the device's reprogrammability lets a single hardware platform serve multiple test standards.
推薦
ASIC Prototyping and Emulation
Designers use the EP1SGX40GF1020C6NG to prototype and emulate mask-programmed ASICs before committing to silicon. The 41,250 LEs map to RTL blocks at roughly 1:1 gate density for many designs, while the embedded transceivers and 624 I/Os reproduce the pin map of the eventual ASIC. Quartus II's TimeQuest timing analyzer provides ASIC-grade timing closure, and the on-chip block RAM models embedded SRAM macros. Operating at 1.5 V core with a 130 nm process, the device gives representative dynamic power data ahead of tape-out, reducing respin risk.
推薦
Defense and Aerospace Signal Processing
Within ruggedized defense and aerospace subsystems, the EP1SGX40GF1020C6NG runs DSP-intensive tasks such as radar pulse compression, electronic-warfare channelization, and software-defined-radio baseband processing. The 20 DSP blocks deliver 20 x 18-bit multiplications per cycle, the 3.4 Mbits of block RAM holds coefficients and sample windows, and the multi-gigabit transceivers route digitized IF streams to backplane FPGAs. Designers pair the commercial-grade device with ruggedized power, thermal, and conformal-coat packaging at the system level, while the Intel toolchain supports DO-254 and MIL-STD-882 documentation workflows.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX40GF1020C6NG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX40GF1020C6N | EP1SGX40GF1020C6 | EP1SGX40GF1020C6L | EP1SGX40GF1020C6ES | EP1SGX40GF1020C6BN | EP1SGX40GF1020C5N | EP1SGX40FF1020C6 |
|---|---|---|---|---|---|---|---|---|
| Package | FBGA-1020 (33 x 33 mm, 1 mm pitch) | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Embedded Memory (bits) | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| User I/O Pins | 624 | 624 | 624 | 624 | 624 | 624 | 624 | 624 |
| Speed Grade | C6 | C6 | C6 | C6 (low-power) | C6 | C6 | C5 (slower) | C6 |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
| Transceiver Family | Stratix GX (G suffix) | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX (FF grade) |
| Terminal Finish | Lead-free (NG suffix) | SnPb (N suffix) | Standard | Lead-free | Engineering sample | Lead-free, tape-and-reel | SnPb (N suffix) | Standard |
主要差異化特點
- Lead-free terminal finish on the production die (對比EP1SGX40GF1020C6N)
- Faster C6 speed-grade timing closure vs C5 (對比EP1SGX40GF1020C5N)
- GF transceiver family with full multi-gigabit support (對比EP1SGX40FF1020C6)
設計說明
Estimated: the 1020-ball FBGA at 1 mm pitch demands a controlled-impedance PCB stack-up with at least 6 routing layers and 0.8 mm or smaller microvia technology for fan-out escape. Use a 1-oz copper power plane for VCCINT (1.5 V core) to limit IR drop under the peak dynamic current of the 41,250-LE array, and place 0.1 uF + 10 uF decoupling clusters within 5 mm of every VCCINT ball pair.
Estimated: route the embedded multi-gigabit transceiver channels on the top layer with a continuous reference ground plane and no more than two vias per TX/RX pair. Maintain 100 ohm differential impedance with 8 mil trace width and 6 mil spacing on a standard FR-4 stack-up. Simulate channel loss with the Stratix GX IBIS-AMI models in Quartus II before committing to layout.
Estimated: at full toggle rate with all 41,250 LEs active and the transceivers running, expect 6-9 W of dissipation. Without forced airflow or a heat-spreader, the junction-to-ambient thermal resistance of a 33 x 33 mm FBGA can push Tj above 100 C in a closed chassis. Specify an industrial-temperature variant (EP1SGX40FF1020I6) if the design lacks active cooling.
合規資訊
Lead-free status inferred from the 'NG' suffix in the MPN per Altera/Intel legacy ordering nomenclature. RoHS, REACH, halogen-free, and conflict-minerals compliance are not explicitly stated in the verified web data; check the official Intel material declaration before qualifying for medical or automotive programs.