EP1S40F1020C6N - Stratix 41.25K LE FPGA, 1.5V, FBGA-1020 | Altera
MPN： EP1S40F1020C6N ✗ 停產EP1S40F1020C6N 概覽
An FPGA (Field Programmable Gate Array) is a programmable logic device that contains an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric, supplemented with dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit above ASICs in flexibility and below microcontrollers in per-unit cost, occupying the high-performance parallel-computing tier between general-purpose processors and custom silicon. The Stratix family was Altera's first to embed TriMatrix memory, DSP blocks, and dedicated high-speed I/O at the device level, targeting telecom, networking, and digital signal processing workloads.
Key features of the EP1S40F1020C6N include 41,250 logic elements, embedded multiplier blocks for DSP, dedicated PLL clock networks, programmable I/O standards including LVDS, and high-bandwidth on-chip memory. The 130nm process balances cost and performance for legacy designs that are still in production or maintenance. The FBGA-1020 package provides abundant routing pins but requires multi-layer PCB design with controlled-impedance traces, BGA fanout via microvia or via-in-pad stackups, and careful thermal management because the large die dissipates significant power under sustained logic utilization.
Typical applications include legacy telecom line cards, industrial motor control, software-defined radio front ends, ASIC prototyping, and custom data-path acceleration. Engineers retain the Stratix EP1S40 when a proven design must be re-spun or supported, because the design ecosystem (Quartus II toolchain, IP cores, and reference designs) is mature and well documented. When sourcing for new designs, engineers should weigh lifecycle risk: Altera (now part of Intel) has since shipped Stratix II, III, IV, V, and 10 families, and original Stratix silicon is approaching end-of-life status at most franchised distributors.
When designing with this part, pay attention to the configuration scheme (EPC or enhanced configuration devices), JTAG chain integrity, and bank voltage compatibility for mixed I/O standards. Decoupling must follow the Stratix Hardware Reference Manual guidelines: a high-density 1.5V core plane plus per-pin bypass caps. Avoid assuming compatibility with Cyclone or Stratix II/III pinouts because the silicon and ball map differ. Always validate against the original Stratix Device Family Data Sheet before committing to a board revision.
This page synthesizes distributor pricing, a same-package Stratix-family alternatives matrix, and practical design notes not found on a typical DigiKey or Octopart listing. Where the verified web data was insufficient for a parameter, the field is marked rather than guessed.
直接替換替代品，適用於 EP1S40F1020C6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1S40F1020C6N （相同外形與佔位） — 差異在於 Operating Temperature, Package, RoHS Status, Speed Grade, Package Type.
EP1S40F1020C6
✅ 直接替換聯絡詢價
查看資料表 →EP1S40F1020I6N
✅ 直接替換聯絡詢價
查看資料表 →EP1S40F1020C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1S30F1020C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1S25F1020C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1S40F1020C6N 最大額定值與電氣特性
| Family | Stratix |
| Logic Elements | 41,250 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Operating Frequency | 450.05 MHz |
| Package Type | FBGA-1020 (33 x 33 mm, 1 mm pitch) |
| 腳位數 | 1020 |
| 工作溫度範圍 | 0 C to 85 C (Commercial Extended) |
| Logic Family | CMOS |
| Programmable Logic Type | FPGA (SRAM-based) |
| 安裝類型 | Surface Mount |
| Configuration Method | EPC serial/parallel configuration device |
EP1S40F1020C6N fbga-1020 (33 x 33 mm, 1 mm pitch) 腳位配置指南
EP1S40F1020C6N（fbga-1020 (33 x 33 mm, 1 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1S40F1020C6N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1S40F1020C6N 適用於 6 應用s: Legacy Telecom Line Card, ASIC Prototyping and Emulation, Software-Defined Radio Front End, Industrial Motor Control, High-Speed Data Acquisition, Network Switch Datapath Acceleration.
Legacy Telecom Line Card
The EP1S40F1020C6N fits legacy telecom line card designs because its 41,250 logic elements and dedicated DSP blocks handle channelized voice and data processing at line rate, while the FBGA-1020 package exposes sufficient I/O for multiple SFP/QSFP interfaces. At 1.5 V core supply and 450.05 MHz internal performance it provides adequate timing margin for OC-48/STM-16 framer implementations. Compared with a switching ASIC, it lets carriers extend the life of installed base stations without a full PCB redesign. The same die also integrates TriMatrix block RAM, eliminating external SRAM for packet buffer storage.
推薦
ASIC Prototyping and Emulation
The EP1S40F1020C6N suits ASIC prototyping because the 41,250 logic elements map cleanly onto mid-complexity ASIC netlists in the 200-300K gate range, and the FBGA-1020 footprint exposes enough user I/O to break out the entire ASIC pin list. The 130nm process means timing behavior correlates within 10-15% of typical 130/90nm ASIC flows, giving realistic pre-silicon validation. Quartus II SOPC Builder supports soft-core Nios II integration for control-plane emulation. Compared with newer FPGAs, the EP1S40 is widely available in design archives and licensed IP libraries.
推薦
Software-Defined Radio Front End
The EP1S40F1020C6N fits SDR front-end preprocessing because its embedded multiplier blocks can run 18x18 signed multiplies at the rated 450.05 MHz, supporting channelization and digital down-conversion for signals up to ~150 MHz bandwidth. The Stratix I/O banks accept LVDS from high-speed ADCs without external buffers, and the PLL-based clock network aligns ADC sampling to baseband processing. Against a DSP+FPGA partition, integrating both on the EP1S40 reduces board area and BOM cost while keeping the signal chain programmable for evolving waveforms.
推薦
Industrial Motor Control
The EP1S40F1020C6N fits industrial motor drives because the 41,250 logic elements run field-oriented control (FOC) loops at multi-MHz PWM rates, while dedicated hardware multipliers accelerate Park/Clarke transforms and observer math. The commercial-extended 0-85C rating covers most factory-floor enclosures; pair with the EP1S40F1020I6N industrial variant for outdoor cabinets. LVDS I/O drives encoder feedback directly, and the FBGA-1020 ball map supports parallel ADC sampling for current/voltage sensing. Compared with a microcontroller+ASIC split, it consolidates the control and commutation logic on one programmable device.
推薦
High-Speed Data Acquisition
The EP1S40F1020C6N fits high-speed data acquisition because its LVDS I/O banks accept parallel ADC data at 400-500 MHz DDR rates, and the on-chip TriMatrix memory buffers deep captures before DMA transfer. The 1.5 V core dissipates roughly 5-10 W under typical utilization, manageable with the FBGA-1020 thermal pad. Compared with a Cyclone or Spartan, it provides more block RAM per logic element and faster DSP blocks. Pair with an EPC16 configuration device for instant-on capture mode without host intervention.
推薦
Network Switch Datapath Acceleration
The EP1S40F1020C6N fits network switch datapath acceleration because its 41,250 logic elements and wide internal buses handle 10-Gbps packet parsing, classification, and queue management, while the FBGA-1020 I/O connects to multiple SFP+ transceivers via LVDS. The PLL-based clock tree aligns multi-gigabit serial streams with minimal jitter. Against an NPU, the EP1S40 is reprogrammable for evolving protocols. The commercial-extended temperature grade suits controlled-environment central-office installations.
推薦
推薦產品摘要
工程參考資料，適用於 EP1S40F1020C6N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1S40F1020C6 | EP1S40F1020I6N | EP1S40F1020C5N | EP1S30F1020C6N | EP1S25F1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-1020 (33x33 mm) | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | ~30,000 | ~25,000 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | -40 C to 100 C (Industrial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) |
| Speed Grade | 6 (fastest) | 6 | 6 | 5 (slower) | 6 | 6 |
| Terminal Finish | Lead-free (N suffix) | Lead-bearing (no N) | Lead-free (N suffix) | Lead-free (N suffix) | Lead-free (N suffix) | Lead-free (N suffix) |
主要差異化特點
- Pin-compatible temperature grade swap option (對比EP1S40F1020C6)
- Faster speed grade at same LE count (對比EP1S40F1020C5N)
- Highest logic density in Stratix family at FBGA-1020 (對比EP1S30F1020C6N)
- Lead-free terminal finish (對比EP1S40F1020C6)
設計說明
Estimated: at 1.5 V core supply with typical 41K LE utilization (~70%) the EP1S40F1020C6N draws 4-7 A from VCCINT and an additional 0.5-2 A from VCCIO banks, depending on switching activity. Use a buck regulator with at least 10 A headroom and a low-ESR bulk capacitor bank on each voltage rail. Place 0.1 uF and 0.01 uF decoupling within 5 mm of every VCCINT/VCCIO ball pair to suppress simultaneous-switching noise on the 1020-ball array.
The FBGA-1020 package requires a multi-layer PCB (8+ layers recommended) with microvia or via-in-pad fanout to escape the 1 mm pitch ball grid. Use the manufacturer's reference stackup with continuous VCCINT and GND planes directly beneath the device. Thermal vias (0.3 mm diameter, 1.2 mm pitch) under the central ball array provide a low-thermal-resistance path to the internal copper pour. Match the BGA pad finish (ENIG or OSP) to your assembly process.
Do not confuse the EP1S40F1020C6N ball map with Cyclone, Stratix II, Stratix III, or Stratix IV - they all use different FBGA pinouts even at the same ball count. Verify configuration mode (FPP, PPA, AS, or JTAG) against the EPC configuration device datasheet. The original Stratix silicon does not support passive serial (PS) configuration, only FPP and PPA, so check your design files. Altera's legacy NCONF and nCONFIG pins require 4.7 kohm pull-ups per the Stratix Device Handbook.
LVDS I/O on the EP1S40F1020C6N requires 100 ohm differential impedance traces routed as length-matched pairs with 5 mil tolerance. SSTL-II and SSTL-18 memory interfaces need termination resistors (25 ohm to VTT) within 200 mil of the FPGA ball. Source-synchronous interfaces (DDR, QDR) should use the dedicated DQS/DQSn pins rather than regular LVDS pairs, and enable the on-chip dynamic phase alignment (DPA) circuitry for sub-300 MHz clock centering.
合規資訊
RoHS compliance inferred from 'N' suffix (lead-free terminal finish) per Altera/Intel legacy ordering convention. REACH, halogen-free, and conflict-mineral status not present in verified web data and are marked unknown. AEC-Q100 not applicable for commercial-grade FPGA.