EP1SGX40GF1020C6NG - Stratix GX 41,250 LEs FPGA, FBGA-1020 | Intel
MPN: EP1SGX40GF1020C6NG ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $449.57 | $449.57 |
| 10 | $425 | $4,250.00 |
| 100 | $395 | $39,500.00 |
| 500 | $360 | $180,000.00 |
| 1,000 | $335 | $335,000.00 |
Drop-in alternatives for EP1SGX40GF1020C6NG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX40GF1020C6N
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View Datasheet →EP1SGX40GF1020C6NG Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Logic Elements | 41,250 |
| Embedded Memory | 3,423,744 bits |
| Embedded DSP Blocks | 20 (typical value; see _validation_note) |
| Maximum User I/O Pins | 624 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Package | FBGA-1020 (33 x 33 mm, 1 mm pitch) |
| Operating Temperature | 0 C to 85 C (Commercial) |
| Speed Grade | C6 |
| Transceivers | Embedded high-speed serial transceivers (GX family) |
| PLL Count | 4 (typical value; see _validation_note) |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
| Logic Family | CMOS |
EP1SGX40GF1020C6NG fbga-1020 (33 x 33 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1SGX40GF1020C6NG (fbga-1020 (33 x 33 mm, 1 mm pitch) package) with 624 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40GF1020C6NG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 624 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020C6NG is suitable for 6 applications: Telecom Line-Card Aggregation, High-Speed Serial Interface Bridging, Broadcast Video Processing, Test and Measurement Equipment, ASIC Prototyping and Emulation, Defense and Aerospace Signal Processing.
Telecom Line-Card Aggregation
The EP1SGX40GF1020C6NG is well suited to telecom line-card aggregation because it combines 41,250 logic elements with embedded multi-gigabit serial transceivers that natively support protocols such as Gigabit Ethernet, XAUI, Serial RapidIO, and PCI Express. In a typical line card, the device acts as a protocol-bridging framer and mapper, aggregating lower-rate client signals onto a higher-rate uplink while the 3.4 Mbits of block RAM provides elasticity buffers and the 624 user I/Os expose backplane interfaces. Designers rely on its hardened transceivers to avoid external PHY ICs and on its Quartus II timing closure to hit carrier-grade jitter budgets.
Recommended
High-Speed Serial Interface Bridging
For bridging PCIe to Serial RapidIO, SATA to Fibre Channel, or custom LVDS links, the EP1SGX40GF1020C6NG delivers the protocol-agnostic flexibility of an FPGA together with the deterministic latency of its hardened transceiver channels. The 41,250 LEs accommodate full link-layer state machines, while the 20 DSP blocks handle CRC, scrambling, and 8b/10b encoding/decoding. The 1.5 V core and 0-85 C commercial temperature range suit central-office equipment, and the 1020-ball FBGA escape is compatible with standard high-speed PCB stack-ups.
Recommended
Broadcast Video Processing
In broadcast video processing - SDI routers, format converters, and frame synchronizers - the EP1SGX40GF1020C6NG provides the parallel arithmetic density needed for real-time chroma resampling, deinterlacing, and frame-rate conversion. The 3,423,744 bits of embedded memory double-buffer full HD frames, the 624 I/Os expose parallel video buses plus multiple SDI links, and the DSP blocks perform 10-tap polyphase filtering without off-chip multipliers. Quartus II reference designs shorten development time for SMPTE 259M/292M/424M serial digital interfaces.
Recommended
Test and Measurement Equipment
Test and measurement platforms - protocol analyzers, BERT testers, and oscilloscope front-ends - benefit from the EP1SGX40GF1020C6NG's combination of fast transceivers, deep block RAM, and reconfigurable logic. Engineers implement custom trigger sequencers in the LEs, store captured waveforms in the 3.4 Mbit memory, and drive high-speed ADC/DAC data paths through the 624 user I/Os. The 1 mm pitch FBGA escape supports fine-pitch controlled-impedance routing required for multi-GHz analog front-ends, and the device's reprogrammability lets a single hardware platform serve multiple test standards.
Recommended
ASIC Prototyping and Emulation
Designers use the EP1SGX40GF1020C6NG to prototype and emulate mask-programmed ASICs before committing to silicon. The 41,250 LEs map to RTL blocks at roughly 1:1 gate density for many designs, while the embedded transceivers and 624 I/Os reproduce the pin map of the eventual ASIC. Quartus II's TimeQuest timing analyzer provides ASIC-grade timing closure, and the on-chip block RAM models embedded SRAM macros. Operating at 1.5 V core with a 130 nm process, the device gives representative dynamic power data ahead of tape-out, reducing respin risk.
Recommended
Defense and Aerospace Signal Processing
Within ruggedized defense and aerospace subsystems, the EP1SGX40GF1020C6NG runs DSP-intensive tasks such as radar pulse compression, electronic-warfare channelization, and software-defined-radio baseband processing. The 20 DSP blocks deliver 20 x 18-bit multiplications per cycle, the 3.4 Mbits of block RAM holds coefficients and sample windows, and the multi-gigabit transceivers route digitized IF streams to backplane FPGAs. Designers pair the commercial-grade device with ruggedized power, thermal, and conformal-coat packaging at the system level, while the Intel toolchain supports DO-254 and MIL-STD-882 documentation workflows.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020C6NG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020C6N | EP1SGX40GF1020C6 | EP1SGX40GF1020C6L | EP1SGX40GF1020C6ES | EP1SGX40GF1020C6BN | EP1SGX40GF1020C5N | EP1SGX40FF1020C6 |
|---|---|---|---|---|---|---|---|---|
| Package | FBGA-1020 (33 x 33 mm, 1 mm pitch) | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Embedded Memory (bits) | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| User I/O Pins | 624 | 624 | 624 | 624 | 624 | 624 | 624 | 624 |
| Speed Grade | C6 | C6 | C6 | C6 (low-power) | C6 | C6 | C5 (slower) | C6 |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
| Transceiver Family | Stratix GX (G suffix) | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX (FF grade) |
| Terminal Finish | Lead-free (NG suffix) | SnPb (N suffix) | Standard | Lead-free | Engineering sample | Lead-free, tape-and-reel | SnPb (N suffix) | Standard |
Key Differentiators
- Lead-free terminal finish on the production die (vs EP1SGX40GF1020C6N)
- Faster C6 speed-grade timing closure vs C5 (vs EP1SGX40GF1020C5N)
- GF transceiver family with full multi-gigabit support (vs EP1SGX40FF1020C6)
Design Notes
Estimated: the 1020-ball FBGA at 1 mm pitch demands a controlled-impedance PCB stack-up with at least 6 routing layers and 0.8 mm or smaller microvia technology for fan-out escape. Use a 1-oz copper power plane for VCCINT (1.5 V core) to limit IR drop under the peak dynamic current of the 41,250-LE array, and place 0.1 uF + 10 uF decoupling clusters within 5 mm of every VCCINT ball pair.
Estimated: route the embedded multi-gigabit transceiver channels on the top layer with a continuous reference ground plane and no more than two vias per TX/RX pair. Maintain 100 ohm differential impedance with 8 mil trace width and 6 mil spacing on a standard FR-4 stack-up. Simulate channel loss with the Stratix GX IBIS-AMI models in Quartus II before committing to layout.
Estimated: at full toggle rate with all 41,250 LEs active and the transceivers running, expect 6-9 W of dissipation. Without forced airflow or a heat-spreader, the junction-to-ambient thermal resistance of a 33 x 33 mm FBGA can push Tj above 100 C in a closed chassis. Specify an industrial-temperature variant (EP1SGX40FF1020I6) if the design lacks active cooling.
Compliance Information
Lead-free status inferred from the 'NG' suffix in the MPN per Altera/Intel legacy ordering nomenclature. RoHS, REACH, halogen-free, and conflict-minerals compliance are not explicitly stated in the verified web data; check the official Intel material declaration before qualifying for medical or automotive programs.
