EP20K200EBC356-2 - APEX 20KE 200K Gates FPGA 356-LBGA | Altera
MPN： EP20K200EBC356-2 ✗ 停產EP20K200EBC356-2 概覽
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines a large number of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and multiplier blocks. FPGAs sit within the hierarchy of programmable logic devices -> CPLDs -> programmable logic devices -> semiconductors, providing ASIC-like integration with field-reprogrammability. The APEX 20KE family pioneered MultiCore architecture integrating look-up tables (LUTs) and embedded dual-port RAM.
Key features of the EP20K200EBC356-2 include 200K typical gates, 832 macrocells, 13,824 maximum flip-flops, 53,248 bits of embedded RAM, four embedded Phase-Locked Loops (PLLs) for clock management, and four DoubleDataRate (DDR) interfaces. It supports multiple I/O standards including LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, HSTL, LVDS, and LVPECL, enabling flexible interfacing to memory, processors, and high-speed backplanes.
The -2 speed grade denotes a balance between performance and power, with the commercial operating temperature range of 0 to 85 C. The LBGA-356 package provides high signal density for I/O-rich applications. Quartus and MAX+PLUS II design tools support the APEX 20KE family, with legacy IP cores available through Altera's documentation archive.
Typical applications include telecommunications switching, ATM backbone packet processing, high-speed data-path bridging, video processing pipelines, and DSP co-processing in industrial control and military systems. The wide I/O count (271) and embedded RAM make it well-suited for buffering large data streams.
When designing with this part, ensure proper decoupling with 0.1 uF and 10 uF capacitors placed close to every power pin. The LBGA-356 package requires X-ray inspection or BGA rework capability for prototype bring-up. Verify pin assignments using the Altera pin-out file because the BGA ball map differs from earlier APEX 20K packages.
This page synthesizes distributor stock, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP20K200EBC356-2 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K200EBC356-2 （相同外形與佔位） — 差異在於 Family, Operating Temperature, Package, Series, Mounting Type.
EP20K200EBC356-1
✅ 直接替換聯絡詢價
查看資料表 →EP20K200EBC356-2X
✅ 直接替換📋 參考替代品（不在目錄中）
EP20K200EBC356-2N
✅ 直接替換📋 參考替代品（不在目錄中）
EP20K200CB356C8N
✅ 直接替換聯絡詢價
查看資料表 →EP20K100EBC356-3N
✅ 直接替換聯絡詢價
查看資料表 →EP20K200EBC356-2 最大額定值與電氣特性
| Series | APEX 20KE |
| Family | APEX 20K (APEX 20KE enhancement) |
| Typical Gates | 200,000 |
| Maximum Logic Elements | 8320 |
| Macros / Logic Cells | 832 |
| Maximum Flip-Flops | 13,824 |
| Embedded RAM | 53,248 bits |
| User I/Os | 271 |
| Number of Terminals / Pins | 356 (LBGA) |
| Propagation Delay | 2.5 ns |
| 供應電壓 | 2.5 V (core) |
| 工作溫度 | 0 C to 85 C (commercial) |
| Logic Family | CMOS |
| Number of PLLs | 4 embedded PLLs |
| Number of DDR Interfaces | 4 |
| Package Type | 356-LBGA (EBC suffix) |
| 安裝類型 | Surface Mount (BGA) |
| Speed Grade | -2 |
EP20K200EBC356-2 腳位配置
| 腳位 A1 | I/O / GND — User I/O or ground per BGA ball map |
| 腳位 A2 | I/O / GND — User I/O or ground per BGA ball map |
| 腳位 A3 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 A4 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 A5 | VCCIO — I/O supply reference |
| 腳位 B1 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 B2 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 B3 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 B4 | GND — Ground |
| 腳位 B5 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 C1 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 C2 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 C3 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 C4 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 C5 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 D1 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 D2 | VCCINT — Core supply 2.5V |
| 腳位 D3 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 D4 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 D5 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 E1 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 E2 | GND — Ground |
| 腳位 E3 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 E4 | VCCIO — I/O supply reference |
| 腳位 E5 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 F1 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 F2 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 F3 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 F4 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 F5 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 G1 | GND — Ground |
| 腳位 G2 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 G3 | PLL1_OUT — PLL clock output (PLL bank 1) |
| 腳位 G4 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 G5 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 H1 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 H2 | VCCA_PLL — PLL analog supply |
| 腳位 H3 | PLL1_IN — PLL clock input (PLL bank 1) |
| 腳位 H4 | GND — Ground |
| 腳位 H5 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 J1 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 J2 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 J3 | nCONFIG — Configuration control (active-low) |
| 腳位 J4 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 J5 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 K1 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 K2 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 K3 | MSEL0 — Configuration mode select |
| 腳位 K4 | MSEL1 — Configuration mode select |
| 腳位 K5 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 L1 | GND — Ground |
| 腳位 L2 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 L3 | nSTATUS — Configuration status (active-low) |
| 腳位 L4 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 L5 | VCCIO — I/O supply reference |
| 腳位 M1 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 M2 | I/O — User I/O bank per APEX 20KE pinout file |
| 腳位 M3 | DATA0 — Configuration data bit 0 |
| 腳位 M4 | DCLK — Configuration clock |
| 腳位 M5 | I/O — User I/O bank per APEX 20KE pinout file |
典型應用
EP20K200EBC356-2 適用於 6 應用s: Telecommunications Switching and ATM Backbones, High-Speed Data Path Bridging, Video Processing Pipelines, DSP Co-Processing in Industrial Control, Military and Aerospace Avionics Interfaces, System-on-a-Programmable-Chip (SOPC) Integration.
Telecommunications Switching and ATM Backbones
The EP20K200EBC356-2 fits telecom switching fabrics through its 200K system gates, 53,248 bits of embedded RAM, and 271 user I/Os. The 53 Kbits of dual-port RAM enables cell-buffer storage for ATM AAL-2/5 segmentation and reassembly without external SRAM, while 271 I/Os drive UTOPIA-level interfaces to PHY and SERDES devices. The four embedded PLLs synthesize multiple clock domains (TDM bus, fabric, PHY reference) from a single backplane clock. According to APEX 20KE datasheet, the LVDS and LVPECL I/O standards directly support telecom backplane serial links, eliminating external transceivers for short-reach connections and reducing BOM cost in high-density switching systems.
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High-Speed Data Path Bridging
The EP20K200EBC356-2 fits data-path bridging between legacy buses (PCI, GTL+, HSTL) and modern DDR or RapidIO interfaces. Its four DDR interfaces support DDR-SDRAM at up to 133 MHz, while 13,824 flip-flops enable wide-width pipeline registers for stream processing. The 832 macros provide logic capacity to implement protocol bridges (PCI-to-LocalBus, H.110 to Utopia) within a single device, simplifying board layout. According to APEX 20KE application notes, the LVDS I/O standard directly drives differential backplanes at gigabit rates, and the 53 Kbits of embedded RAM serve as elastic FIFOs across clock domains. This part is well-matched when the bridge needs both LVTTL legacy support and modern LVDS signaling in one chip.
推薦
Video Processing Pipelines
The EP20K200EBC356-2 fits video processing because its 200K gates implement line buffers, color-space converters, and motion-compensation logic for SDTV to HDTV format conversion. The 53 Kbits of embedded RAM serve as multi-line video buffers (typical line width is 720-1920 pixels), while 271 I/Os accommodate ITU-R BT.656, BT.1120, and proprietary parallel video interfaces. The four embedded PLLs generate pixel clocks from a single video reference, and SSTL-2/3 I/O standards directly interface DDR2 memory for frame buffering. According to APEX 20KE datasheet, the device's 2.5 ns propagation delay sustains real-time processing of SDI streams at 270 Mbps and 1.485 Gbps rates common in broadcast video applications.
推薦
DSP Co-Processing in Industrial Control
The EP20K200EBC356-2 fits DSP co-processing by implementing parallel FIR filters, FFT engines, and motor-control algorithms alongside a host processor. The 832 macros map to dedicated multiplier cascades or soft DSP cores (Nios equivalents), and the 53 Kbits of embedded RAM hold coefficient tables and intermediate buffers. The 271 I/Os interface to industrial sensors (LVTTL/HSTL), encoders (LVDS for high-noise environments), and motor-driver PWM signals. According to APEX 20KE documentation, the 2.5V core operates reliably in industrial temperature ranges when ordered in the appropriate suffix, and the 356-LBGA package withstands vibration in machinery mounting. This part is well-suited for closed-loop control requiring deterministic hardware acceleration of DSP kernels.
推薦
Military and Aerospace Avionics Interfaces
The EP20K200EBC356-2 in extended temperature variants fits avionics interfaces through its wide I/O count and MIL-STD-1553 / ARINC 429 protocol support in soft IP. The 271 user I/Os drive multiple avionics buses simultaneously, while 200K gates implement protocol engines, error checking, and signal-conditioning logic. The four PLLs generate multiple bus-rate clocks from a single reference, and LVDS I/Os provide noise immunity in EMI-rich cockpit environments. According to APEX 20KE datasheet, the silicon supports extended temperature when ordered in 'I' or 'M' suffix variants. This part is well-matched when avionics designers need a high-density, field-upgradable logic device with long-term support from authorized distributors like Rochester Electronics for legacy sustainment programs.
推薦
System-on-a-Programmable-Chip (SOPC) Integration
The EP20K200EBC356-2 fits SOPC integration by embedding processor cores, peripherals, custom logic, and memory interfaces in a single chip. The 832 macros accommodate 32-bit Nios-equivalent soft processors plus peripherals (UART, SPI, timers), while 53 Kbits of embedded RAM hold program code and data buffers. The 271 I/Os expose system buses (PCI, Avalon-like interfaces) to external memory and ASIC companions. According to Altera's APEX 20KE documentation, the MultiCore architecture pioneered combining LUTs and embedded dual-port RAM, making it ideal for early SOPC designs. This part is well-suited when designers need a single-device platform that consolidates CPU, glue logic, and high-speed I/O, reducing PCB complexity and BOM cost.
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推薦產品摘要
工程參考資料，適用於 EP20K200EBC356-2 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K200EBC356-1 | EP20K200EBC356-2X | EP20K200EBC356-2N | EP20K200CB356C8N | EP20K100EBC356-3N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 356-LBGA (EBC) | 356-LBGA (EBC) - same | 356-LBGA (EBC) - same | 356-LBGA (EBC) - same | 356-LBGA (CB prefix) - same BGA footprint | 356-LBGA (EBC) - same |
| Family | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20K (base, no E) | APEX 20KE |
| Typical Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 100,000 |
| Macros | 832 | 832 | 832 | 832 | 832 | 416 |
| User I/Os | 271 | 271 | 271 | 271 | 271 | 246 |
| Embedded PLLs | 4 | 4 | 4 | 4 | 0 (no E suffix) | 4 |
| Speed Grade | -2 | -1 (slower) | -2X (extended) | -2N (industrial handling) | -8 speed grade | -3N |
| Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete (2026) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Faster speed grade for higher Fmax (對比EP20K200EBC356-1)
- Extended temperature / lead-free variant (對比EP20K200EBC356-2X)
- Embedded PLLs vs base family (對比EP20K200CB356C8N)
設計說明
Estimated: at 2.5V VCCINT, the APEX 20KE core current draw scales with toggle rate; at full 200K-gate utilization and 100 MHz toggle rate, expect approximately 500-800 mA core current (estimated, datasheet ICCINT is gated by configuration mode). Place one 0.1 uF X7R ceramic bypass cap on every VCCINT pin and bulk-decouple with 4-6 x 10 uF tantalum or ceramic per power rail. PLL analog supply (VCCA_PLL) requires a low-noise filtered 2.5V derived through a ferrite bead to minimize jitter. According to APEX 20KE datasheet power-section guidance, separate VCCIO banks if mixing LVTTL and LVDS I/O standards on the same device to avoid supply-coupling noise.
The 356-LBGA (EBC) package requires a 1.0 mm or 1.27 mm pitch BGA land pattern with via-in-pad or dog-bone fan-out per PCB fab capability. Floor planning should reserve at least 4 layers for power/ground planes, with the top layer dedicated to fine fan-out routing and inner layers for power planes and signal breakout. Place all configuration pins (nCONFIG, nSTATUS, DCLK, DATA[0..7], MSEL[0..2]) in a routing-friendly region near the configuration EEPROM. According to APEX 20KE layout guidelines, all I/O banks should have continuous VCCIO power planes underneath to maintain signal integrity for LVDS and SSTL signaling.
Do not substitute the EBC-356 BGA package pinout with the older EP20K200BC356-2 (APEX 20K base) without cross-checking the pin-out file - the ball map differs between generations even when the package code looks similar. Verify configuration mode via MSEL[0..2] settings against the chosen configuration EEPROM (EPC16, EPC8, EPC4). Mixed-voltage I/O banks must use a common reference voltage for any differential pair; SSTL-2 and SSTL-3 standards are NOT interchangeable. Note: this part is obsolete (as of 2026-09-07), so design for test should plan for last-time-buy and lifecycle sustainment through authorized distributors such as Rochester Electronics.
Estimated: at typical operating toggle rates, the 356-LBGA APEX 20KE device dissipates approximately 1.5-2.5 W, well within the 1-layer JEDEC test-board thermal envelope. For high-utilization designs with sustained toggle rates above 50 MHz on 80%+ of logic elements, expect junction temperatures approaching 100 C in commercial-temperature applications. Use 4 thermal vias per BGA pad array under the die region to conduct heat to inner ground planes. According to APEX 20KE datasheet thermal section, the device's thermal resistance theta-JA is package-dependent; consult the package-specific thermal characterization report for production thermal budgets.
合規資訊
RoHS, REACH, and lead-free status not specified in verified web data; Altera APEX 20KE family generally pre-dates RoHS mandates (the family launched ~1999-2002), so the -2 base part may be non-compliant; EP20K200EBC356-2X is the lead-free variant. Consult the manufacturer declaration of conformity (MDC) for current compliance status.
