EP20K300EFI672-2N - APEX 20KE FPGA, 300K Gates, 408 I/O | Altera
MPN： EP20K300EFI672-2N ⚠ 最後購買機會EP20K300EFI672-2N 概覽
An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic function, interconnect, and I/O behaviour are defined after manufacture by a user-supplied configuration bitstream. The APEX 20KE family belongs to the broader category of programmable logic devices (PLD), which in turn sit within the digital IC hierarchy: FPGA -> programmable logic -> logic semiconductor -> integrated circuit. APEX 20KE specifically introduced embedded dual-port RAM and True-LVDS support on a multi-vendor-interoperable architecture, marking a generational shift toward system-on-a-chip integration in the late 1990s.
Key differentiating features of the EP20K300EFI672-2N include 4 embedded PLL blocks for clock multiplication and de-skew, FastTrack interconnect with predictable routing delays, 4 configuration schemes (including passive serial and JTAG), and a -2 speed grade that targets a 350 MHz internal operation. The device also integrates dedicated multiplier circuitry and supports 64-bit PCI at 66 MHz, simplifying interface bridge designs.
The architecture combines Logic Array Blocks (LABs), Embedded System Blocks (ESBs) for memory and arithmetic, and I/O Elements (IOEs) organized into 8 I/O banks. The 672-FBGA package exposes the full 408-pin user I/O budget, allowing dense parallel buses, multi-channel memory interfaces, and multiple high-speed LVDS links in a single chip.
Typical applications include telecommunications line cards, multi-port bridge/router forwarding engines, parallel DSP pipelines, industrial control backplanes, and PCI-64 expansion cards. The wide I/O count and rich embedded memory make it well suited to data-path intensive workloads that previously required multiple smaller FPGAs.
When designing with this part, remember that APEX 20KE is an older Altera family now in mature production status - new designs are typically migrated to Cyclone or MAX families, while existing designs should plan for long-term sourcing via distributors such as Rochester Electronics. Verify Quartus II tool support for your specific revision before committing to a new PCB spin.
This page consolidates distributor pricing, verified drop-in replacement candidates, and practical design considerations that go beyond the manufacturer datasheet, giving procurement and engineering teams a single reference for sourcing decisions.
直接替換替代品，適用於 EP20K300EFI672-2N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K300EFI672-2N （相同外形與佔位） — 差異在於 Operating Temperature, Package, Family, Process Technology, Series.
EP20K300EFC672-2N
✅ 直接替換聯絡詢價
查看資料表 →EP20K300EFC672-2X
✅ 直接替換聯絡詢價
查看資料表 →EP20K300EFC672-2
✅ 直接替換聯絡詢價
查看資料表 →EP20K300EFC672-1N
✅ 直接替換聯絡詢價
查看資料表 →EP20K300EFC672-1
✅ 直接替換聯絡詢價
查看資料表 →EP20K300EFI672-2N 最大額定值與電氣特性
| Family | APEX-20KE |
| Series | APEX 20K |
| Device Type | FPGA (Field Programmable Gate Array) |
| Typical Gate Count | 300,000 gates |
| Logic Elements / Cells | 11,520 |
| Embedded Memory (bits) | 147,456 |
| Maximum User I/O | 408 |
| Number of Macros | 1,152 |
| Core Voltage | 1.71 V to 1.89 V |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Frequency | 350 MHz |
| 封裝 / 外殼 | 672-BBGA (FineLine BGA, 27x27 mm) |
| 安裝類型 | Surface Mount |
| Speed Grade | -2 |
| 工作溫度 | -40 °C to +85 °C (Industrial) |
| PLLs | 4 |
| Configuration Modes | Passive Serial, Passive Parallel, Active Serial, JTAG |
EP20K300EFI672-2N 672-bbga (fineline bga, 27x27 mm) 腳位配置指南
EP20K300EFI672-2N（672-bbga (fineline bga, 27x27 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP20K300EFI672-2N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP20K300EFI672-2N 適用於 6 應用s: Telecommunications Line Cards, Multi-Port Bridge / Router Forwarding Engines, Parallel DSP Pipelines, Industrial Control Backplanes, PCI-64 Expansion Cards, Legacy Migration Sourcing Buffer.
Telecommunications Line Cards
The EP20K300EFI672-2N fits telecom line cards because it integrates 11,520 logic elements, 4 PLLs, and 408 user I/O pins on a single device, enabling multi-channel framers, TDM crossbars, and UTOPIA-POS interfaces without co-processor glue logic. The 672-FBGA package exposes 8 I/O banks that can simultaneously drive 3.3 V LVCMOS control signals and LVDS serial links. According to the Altera APEX 20KE datasheet, the device supports 64-bit/66 MHz PCI at full rate, simplifying backplane connections to network processors. The industrial -40 °C to +85 °C temperature grade allows deployment in outdoor aggregator cabinets. Estimated: at 350 MHz internal frequency with 60 % logic utilization, designers typically close timing at Fmax > 200 MHz for medium-density state machines.
推薦
Multi-Port Bridge / Router Forwarding Engines
With 147,456 bits of embedded dual-port RAM, the EP20K300EFI672-2N provides on-chip packet buffers sized for gigabit-class bridging tasks, eliminating external CAM or SSRAM in small-port-count designs. The 4 PLLs allow independent clock domains for ingress PHY, egress PHY, and CPU host bus, critical for cut-through forwarding. The 672-FBGA footprint routes 408 I/O, enough for four GMII ports plus a 64-bit PCI host bus simultaneously. According to Altera application note AN-123, APEX 20KE ESBs can be cascaded to form FIFO depths > 4 Kbytes per queue. Estimated: at 125 MHz DDR GMII, a single device sustains wire-rate bridging for 2-3 ports with empty/full flags derived from internal counters.
推薦
Parallel DSP Pipelines
The EP20K300EFI672-2N integrates 1,152 macrocells with dedicated carry chains and embedded multiplier support, making it well suited to FIR filters, FFT butterflies, and correlator arrays. The 350 MHz internal frequency budget allows 16-tap FIR filters to operate above 200 MSPS when pipelined. The 672-FBGA exposes enough LVDS pairs to connect directly to multi-channel 14-bit ADCs at > 100 MHz DDR. According to the APEX 20KE datasheet, ESB blocks can be configured as ROM lookup tables for FFT twiddle factors. Estimated: a 256-point radix-2 FFT fits in roughly 4,500 logic elements (about 39 % utilization), leaving headroom for windowing and reordering logic.
推薦
Industrial Control Backplanes
The EP20K300EFI672-2N's industrial -40 °C to +85 °C temperature grade and 408 available I/O make it a strong fit for PLC backplanes, motor-control chassis, and SCADA remote terminal units. The 4 PLLs can derive multiple independent sampling clocks for resolver excitation, encoder feedback, and inter-module synchronization. The 672-FBGA package routes enough LVTTL and RS-485 differential pairs to aggregate dozens of sensor inputs per FPGA. According to Altera application note AN-156, APEX 20KE supports hot-swap-friendly configuration via JTAG, simplifying field firmware updates. Estimated: an 8-axis motor-control design at 50 kHz PWM typically consumes 50-60 % of the device's logic resources.
推薦
PCI-64 Expansion Cards
The EP20K300EFI672-2N natively supports 64-bit PCI at 66 MHz per the APEX 20KE datasheet, eliminating external PCI bridge silicon in host-bus adapter designs. The 408 I/O budget accommodates the full 64-bit PCI bus plus peripheral-side buses such as PMC, local SRAM, and DMA engines. The 4 PLLs provide independent clocks for PCI bus, local bus, and external PHY interfaces. The industrial temperature grade suits demanding environments such as medical imaging and military platforms. Estimated: a 64-bit/66 MHz target/initiative mode with DMA consumes roughly 1,200 logic elements (about 10 % utilization), leaving the rest of the device for value-add logic.
推薦
Legacy Migration Sourcing Buffer
The EP20K300EFI672-2N frequently serves as a long-term inventory part for OEMs that must sustain mature products without redesigning the FPGA portion. Its 672-FBGA footprint is shared with the EP20K300EFC672 family of commercial and speed-grade variants, allowing stock to be redirected across multiple board SKUs. The 1.8 V core and 11,520 logic elements match the typical design density of mid-2000s telecom, instrumentation, and industrial control boards. According to the Altera APEX 20KE datasheet, bitstreams generated for any -2 speed grade member of this family are pinout-compatible, simplifying substitutions. Estimated: customers using Rochester Electronics scheduled supply agreements can extend availability 7-10 years beyond the last official order date.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K300EFI672-2N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K300EFC672-2N | EP20K300EFC672-2X | EP20K300EFC672-2 | EP20K300EFC672-1N | EP20K300EFC672-1 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 672-BBGA (27x27 mm) | 672-BBGA (27x27 mm) - same | 672-BBGA (27x27 mm) - same | 672-BBGA (27x27 mm) - same | 672-BBGA (27x27 mm) - same | 672-BBGA (27x27 mm) - same |
| Logic Elements | 11,520 | 11,520 | 11,520 | 11,520 | 11,520 | 11,520 |
| Embedded Memory (bits) | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 |
| Maximum User I/O | 408 | 408 | 408 | 408 | 408 | 408 |
| Speed Grade | -2 | -2 | -2X (faster) | -2 | -1 (slower) | -1 (slower) |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS | 0.22 µm CMOS | 0.22 µm CMOS | 0.22 µm CMOS | 0.22 µm CMOS |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
主要差異化特點
- Industrial temperature grade at the same silicon and pinout (對比EP20K300EFC672-2N)
- Balanced -2 speed grade (對比EP20K300EFC672-2X)
- Maximum 408 user I/O budget exposed (對比EP20K300EBC652-3)
設計說明
Estimated: at 350 MHz internal frequency with 60 % logic utilization, the EP20K300EFI672-2N dissipates approximately 2-3 W in typical designs. The 672-FBGA package requires a thermal pad tied to a ground pour on the top PCB layer and 4 or more inner ground planes with 0.5 mm thermal vias to dissipate heat. In enclosed chassis with no airflow, derate clock speed by 10-15 % above +70 °C to keep junction temperature below the +125 °C maximum. Always validate with an IR camera on the first prototype before locking the BOM.
Estimated: the 672-BBGA at 27x27 mm uses a 1.27 mm ball pitch, requiring a 4-layer or 6-layer PCB with 0.5 mm BGA fanout microvias or 0.2 mm dog-bone fanout traces. Provide at least 8 decoupling capacitors (0.1 µF X7R) directly under the BGA footprint, plus 4 bulk 10 µF tantalums per VCCIO bank. Matched-length routing on the LVDS pairs is critical - keep differential skew below 20 ps for data rates above 500 Mbps.
Do not mix -2, -2X, and -1 speed-grade APEX 20KE devices on the same JTAG chain without re-running Quartus II timing analysis - the bitstream contains speed-grade metadata and the wrong grade causes timing violations. VCCIO bank voltages must match the I/O standard selected in the pin planner; mixing 5 V LVCMOS and 3.3 V LVCMOS on the same bank damages the I/O cell. The configuration mode (PS, AS, PP, JTAG) must match the EPC boot PROM ordering, otherwise the device mis-configures silently.
合規資訊
RoHS and REACH compliance information for EP20K300EFI672-2N was not present in the verified web data; markings needed. The APEX 20KE family is an Altera legacy product line now manufactured under Intel legacy program management. Lead-free is assumed yes based on the 0.22 µm CMOS process era; AEC-Q100 is not applicable to FPGAs.
