EP20K400CF672C9 - APEX-20K 400K Gates FPGA, 672-FBGA | Intel / Altera
MPN： EP20K400CF672C9 ✗ 停產EP20K400CF672C9 概覽
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed to implement custom digital logic functions after manufacturing. The APEX-20K family uses a MultiCore architecture that combines fine-grain LUT logic with coarse-grain embedded system blocks (ESBs), placing the device within the broader hierarchy of programmable logic: CPLD -> FPGA -> SoC FPGA -> Programmable Logic Device (PLD) -> semiconductor. FPGAs occupy a unique position in digital design because they offer ASIC-class performance and gate density while preserving the flexibility of in-system reprogrammability.
Key features of the EP20K400CF672C9 include a maximum of 488 user I/Os, 16,640 logic cells, embedded memory through ESBs, and a 2.5V core supply voltage per the APEX-20KC specification. The device operates across a commercial temperature range (0C to 85C) and supports configuration via serial or parallel PROM interfaces. The 672-FBGA package uses a 27 mm x 27 mm body with a 1.0 mm ball pitch, suitable for high-density PCB designs where signal integrity and routing escape demand a large ball grid array footprint.
Architecturally, the APEX-20K MultiCore combines LUT-based logic elements with embedded array blocks (EABs) that can implement dual-port RAM, ROM, FIFO, and CAM functions. The EP20K400 provides the largest density option in the APEX-20KC lineup, balanced for high-performance datapath applications where on-chip memory bandwidth is critical.
Typical applications include high-speed telecommunications backplanes, ASIC prototyping, DSP co-processing, network processing engines, and high-performance bus interface logic. The 488 user I/Os enable direct connection to multiple parallel buses, while the embedded memory supports on-chip packet buffers and lookup tables.
When designing with this device, careful attention must be paid to power distribution: the 2.5V core and multiple I/O bank supplies each require decoupling networks sized to suppress switching transients. Legacy APEX-20K designs typically require Intel Quartus design software (or legacy MAX+PLUS II) for place-and-route, bitstream generation, and timing closure.
This page synthesizes distributor pricing, drop-in speed-grade and temperature-grade alternatives from the same APEX-20K family, and practical design notes not consolidated in the original Altera datasheet.
直接替換替代品，適用於 EP20K400CF672C9 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K400CF672C9 （相同外形與佔位） — 差異在於 Operating Temperature, Package, Speed Grade, Process Technology, RoHS Status.
EP20K400CF672C8N
✅ 直接替換聯絡詢價
查看資料表 →EP20K400CF672C8
✅ 直接替換聯絡詢價
查看資料表 →EP20K400CF672C8ES
✅ 直接替換聯絡詢價
查看資料表 →EP20K400CF672C8AA
✅ 直接替換聯絡詢價
查看資料表 →EP20K400CF672C7
✅ 直接替換聯絡詢價
查看資料表 →EP20K400CF672C7ES
✅ 直接替換聯絡詢價
查看資料表 →EP20K400CF672C9 最大額定值與電氣特性
| Series | APEX-20KC |
| Logic Family / Architecture | MultiCore (LUT + ESB) |
| System Gates | 400,000 |
| Logic Cells / Elements | 16,640 |
| Maximum User I/Os | 488 |
| 封裝 / 外殼 | 672-BBGA, FCBGA |
| Supplier Device Package | 672-FBGA (27x27 mm) |
| Ball Pitch | 1.0 mm |
| Core Supply Voltage | 2.5 V |
| Process Technology | 0.22 um CMOS |
| Internal Maximum Frequency | 368 MHz |
| Propagation Delay | 2.5 ns |
| 工作溫度 | 0C to +85C (Commercial) |
| Embedded Memory | Embedded System Blocks (ESB) |
| Configuration Method | Serial / Parallel PROM |
| RoHS 狀態 | RoHS non-compliant (legacy) |
| 安裝類型 | Surface Mount |
EP20K400CF672C9 672-fbga (27x27 mm) 腳位配置指南
EP20K400CF672C9（672-fbga (27x27 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP20K400CF672C9.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP20K400CF672C9 適用於 6 應用s: Telecommunications Backplane Interface, ASIC Prototyping and Emulation, High-Speed DSP Co-Processing, Network Processing Engine (NPE), Industrial Control and Test Equipment, Legacy MIL/Aerospace Form-Fit-Function Replacement.
Telecommunications Backplane Interface
The EP20K400CF672C9's 488 user I/Os are essential for backplane designs that must connect to multiple parallel buses, serializer/deserializer (SERDES) companion devices, and clock distribution networks in a single device. Its 16,640 logic cells and embedded system blocks (ESB) provide on-chip dual-port RAM for packet buffering at line-rate speeds, while the 2.5V core and LVTTL/LVCMOS-compatible I/O banks interface directly to legacy telecom backplane logic levels. Placed at the heart of an ATM switch or SONET framer card, the FPGA implements link-layer processing and per-port statistics counters that would otherwise require multiple ASICs.
推薦
ASIC Prototyping and Emulation
With 400,000 system gates and 16,640 logic cells, the EP20K400CF672C9 offers enough capacity to emulate large ASIC designs for pre-silicon validation. Engineers map RTL into MultiCore LUTs and ESBs to verify functional correctness at near-ASIC clock rates, using the device's 488 I/Os to connect to real-world peripherals and test fixtures. The 27 mm x 27 mm FBGA package supports high-speed signal integrity on multi-layer PCBs. Compared to ASIC fabrication, the FPGA-based prototype can be re-spins in hours rather than weeks, dramatically reducing time-to-market for complex SoC designs.
推薦
High-Speed DSP Co-Processing
The EP20K400CF672C9 implements parallel datapath arithmetic for DSP co-processing functions such as FIR filtering, FFT butterflies, and correlation engines. Its ESB memory blocks provide dual-port RAM for coefficient storage and delay lines, eliminating the need for external SRAM and reducing board complexity. With a 368 MHz internal maximum frequency, the device sustains multi-tap filter throughput suitable for radar, software-defined radio, and baseband signal processing. System architects pair the EP20K400 with a host DSP or microcontroller to offload compute-intensive kernels, freeing the host for control-plane tasks.
推薦
Network Processing Engine (NPE)
The 488 I/Os of the EP20K400CF672C9 interface to multiple network PHY devices, TCAM lookups, and packet memory buses in a typical NPE design. The on-chip ESBs implement classification tables, hash buckets, and flow-state caches that previously required external SRAM - reducing BOM cost and PCB area. The 2.5V core and standard I/O bank voltages match the legacy power architecture used in mid-2000s networking line cards. Placed alongside a network processor unit (NPU), the FPGA offloads header parsing and checksum computation at wire speed.
推薦
Industrial Control and Test Equipment
The EP20K400CF672C9 functions as a configurable I/O controller in industrial test platforms that aggregate many parallel digital channels, sensors, and actuators. Its 488 I/Os drive dozens of relays, optocouplers, and measurement ADCs while the LUT fabric runs state machines, pattern generators, and BIST engines. The commercial 0C to 85C operating range suits factory-floor enclosures with moderate thermal margins. Designers use the on-chip ESBs for capture-buffer memory, allowing deep trace recording without external RAM.
推薦
Legacy MIL/Aerospace Form-Fit-Function Replacement
Long-life-cycle aerospace and defense programs require multi-decade component support. The EP20K400CF672C9 is widely used as a form-fit-function replacement for legacy designs originally built around ASICs or earlier-generation FPGAs. Its 672-FBGA footprint matches existing PCB land patterns, and bitstream compatibility within the APEX-20KC family preserves the design investment. Sustainment programs source the part through Rochester Electronics and authorized aftermarket brokers to keep fielded systems operational. Designers targeting new programs should consider Cyclone IV/V or Stratix equivalents.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K400CF672C9 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K400CF672C8N | EP20K400CF672C8 | EP20K400CF672C7 | EP20K400CF672C8ES | EP20K400CF672C7ES |
|---|---|---|---|---|---|---|
| Package | 672-FBGA (27x27 mm) | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Speed Grade | C9 (slower) | C8 (faster) | C8 (faster) | C7 (fastest) | C8 (faster) | C7 (fastest) |
| System Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Logic Cells | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| User I/Os (max) | 488 | 488 | 488 | 488 | 488 | 488 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Lowest-cost speed grade option in the APEX-20K 400K family (對比EP20K400CF672C8N)
- Largest I/O count in the APEX-20KC 400K family (對比EP20K400CB652I9)
- Commercial temperature grade suits indoor and controlled environments (對比EP20K400CB652I9)
設計說明
The EP20K400CF672C9 requires a 2.5V VCCINT rail plus per-bank VCCIO supplies - typically 3.3V for LVTTL or 2.5V for LVCMOS. Decoupling strategy: place 0.1 uF X7R ceramic capacitors within 5 mm of every VCCINT ball, with a bulk 100 uF tantalum or polymer capacitor on each supply rail. Power-on sequencing should bring VCCINT up before VCCIO to avoid latch-up; use a power-supply supervisor with adjustable delay. Estimated: a fully utilized EP20K400 with 50% toggle rate draws approximately 1.5-2.5 A from VCCINT, so design the 2.5V regulator with at least 3 A headroom and 0.5V dropout margin.
The 672-FBGA package uses a 1.0 mm ball pitch on a 27 mm x 27 mm body - escape routing demands a high-layer-count PCB (8+ layers) with microvia or staggered via technology to fan out from the inner ball rows. Maintain a continuous ground plane on layer 2 directly beneath the device to control return-path inductance for the high-speed I/O banks. Keep all 1.0 mm pitch BGA pads on a 1:1 ratio with the package - use NSMD (non-solder-mask-defined) pads to maximize solder joint reliability. Thermal management: the FBGA thermal pad (if present) should be soldered to a copper pour with thermal vias to an internal heat-spreading plane.
Configure I/O banks to match the voltage swing of adjacent components; mixing 3.3V LVTTL and 2.5V LVCMOS on adjacent banks is allowed but each bank must have its own VCCIO pin. Enable on-chip series termination (if supported in Quartus pin assignment) for high-speed outputs driving >50 mm traces. For clock inputs, route on an inner stripline layer with controlled impedance (50 ohm single-ended, 100 ohm differential) and keep stubs shorter than 5 mm. JTAG signals (TCK, TMS, TDI, TDO) should be pulled to their respective banks via 10 kohm resistors and treated as asynchronous boundary-scan signals.
Avoid specifying the EP20K400CF672C9 for new production designs - the part is obsolete at Intel / Altera and long-term supply is limited to authorized aftermarket channels (Rochester Electronics, Micro-Semiconductor, Lisleapex). For ASIC prototyping or new product development, target Stratix II/III, Cyclone IV/V, or MAX V/10 series instead. When migrating bitstreams between speed grades (C9 -> C8 -> C7), verify that timing constraints are re-validated for the new internal frequency margin - faster grades have lower propagation delay but identical logic capacity and I/O count.
合規資訊
RoHS non-compliant per alterachips.com stock condition data. Lead-bearing termination typical for legacy APEX-20K parts. AEC-Q100 not applicable (FPGA, not an automotive-grade part). REACH and conflict-minerals status not stated by distributor data.