EP20K400EFC672-3N - APEX 20KE 400K FPGA, 488 I/O | Intel / Altera
MPN： EP20K400EFC672-3N ✗ 停產EP20K400EFC672-3N 概覽
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose logic fabric, interconnect, and I/O cells can be reconfigured after manufacture by the end user. The APEX 20KE device family introduced Altera's MultiCore architecture, which integrates look-up table (LUT) logic, embedded system blocks (ESBs) for dual-port RAM/ROM, and high-speed I/O on a single die - effectively an early System-on-a-Programmable-Chip (SOPC) platform. Within the broader taxonomy, this places FPGAs under Programmable Logic Devices (PLD) > CPLD/FPGA > Integrated Circuit > Semiconductor.
Key feature highlights include the MultiCore architecture combining LUT-based logic with embedded array blocks, 4 PLLs for clock management, True-LVDS support, and a 1.05M-system-gate density ceiling. The device supports in-system programmability via serial configuration and is offered with both commercial (0 °C to +85 °C) and industrial temperature grades. Speed grade -3 is the second-fastest of the APEX 20KE family, with -2, -1, and -X slower options also available.
Typical applications for the EP20K400EFC672-3N include high-performance digital signal processing, telecom baseband processing, networking line cards, and embedded control platforms where mid-1990s to early-2000s design ecosystems still remain in service. The combination of substantial embedded memory and abundant I/O makes it well suited for parallel datapath and protocol-bridging designs.
When designing with this part, verify the exact package footprint (FC-FBGA-672) against the PCB land pattern and confirm configuration interface voltage compatibility with the selected PROM or processor. Note that the APEX 20KE family has been classified NRND/EOL by Intel in favor of newer Cyclone/Arria series, so lifecycle planning and last-time-buy inventory strategy are critical.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, including comparison with related APEX 20KE speed grades and the same-density EFC672 footprint across speed bin -2 and -1.
直接替換替代品，適用於 EP20K400EFC672-3N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K400EFC672-3N （相同外形與佔位） — 差異在於 Operating Temperature, Package, Process Technology, Series, Family.
EP20K400EFC672-3
✅ 直接替換聯絡詢價
查看資料表 →EP20K400EFC672-2X
✅ 直接替換聯絡詢價
查看資料表 →EP20K400EFC672-2N
✅ 直接替換聯絡詢價
查看資料表 →EP20K400EFC672-1XN
✅ 直接替換聯絡詢價
查看資料表 →EP20K400EFC672-1N
✅ 直接替換聯絡詢價
查看資料表 →EP20K400EFC672-2
✅ 直接替換聯絡詢價
查看資料表 →EP20K400EFC672-1
✅ 直接替換聯絡詢價
查看資料表 →EP20K400EFC672-3N 最大額定值與電氣特性
| Family | APEX 20KE |
| Series | APEX 20K |
| Device Type | FPGA - Field Programmable Gate Array |
| System Gates | 1,052,000 |
| Logic Elements | 16,640 |
| Logic Array Blocks (LABs) | 1,664 macros |
| Embedded RAM (EAB/ESB bits) | 212,992 bits |
| User I/O Pins | 488 |
| 封裝 | 672-BBGA (FC-FBGA) |
| 腳位數 | 672 |
| Propagation Delay | 2.5 ns |
| Core Supply Voltage | 1.71 V to 1.89 V (1.8 V nominal) |
| I/O Supply Voltage | 2.5 V |
| 工作溫度 | 0 °C to +85 °C (commercial) |
| Speed Grade | -3 |
| Technology | CMOS, 0.18 µm (per APEX 20KE family) |
| PLL Count | 4 |
| Architecture | MultiCore (LUT + Embedded System Blocks) |
EP20K400EFC672-3N 672-bbga (fc-fbga) 腳位配置指南
EP20K400EFC672-3N（672-bbga (fc-fbga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP20K400EFC672-3N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP20K400EFC672-3N 適用於 6 應用s: Telecommunications Baseband Processing, Networking Line Card Packet Processing, Industrial Control and Machine Automation, DSP Co-Processor / Hardware Accelerator, Test and Measurement Instrumentation, Legacy Embedded Computing Platforms.
Telecommunications Baseband Processing
The EP20K400EFC672-3N fits telecommunications baseband processing because its 16,640 logic elements and 212,992 bits of embedded dual-port RAM provide the parallel datapath resources needed for multi-channel baseband demodulation. With 488 user I/O pins, designers can connect multiple LVDS ADC/DAC pairs and backplane interfaces without external bus multiplexing. The four on-chip PLLs generate the precise clock trees required for symbol-rate conversion and chip-rate processing. Unlike modern FPGAs, the APEX 20KE's MultiCore architecture integrates embedded system blocks that can be configured as FIFO buffers for inter-stage data hand-off, reducing external SRAM overhead in legacy line-card designs.
推薦
Networking Line Card Packet Processing
For networking line cards, the EP20K400EFC672-3N delivers 400K system gates and 488 I/O sufficient for IPv4 forwarding engines, ATM SAR functions, and SONET framer glue logic. The 2.5 ns propagation delay at speed grade -3 sustains the ~213 MHz internal fabric frequency required for 64-bit datapath classification at line rate. The FC-FBGA-672 package's high ball count exposes multiple LVDS and PCI interfaces for connection to network processors and PHYs. Designers value the APEX 20KE's embedded system blocks when implementing CAM-adjacent lookup tables or statistics counters in hardware-accelerated routers.
推薦
Industrial Control and Machine Automation
The EP20K400EFC672-3N supports industrial control applications where deterministic real-time response is required from 0 °C to +85 °C commercial grade. Its 488 I/O pins can interface with dozens of digital sensors, encoder inputs, and PWM outputs without external bus expanders. The four PLLs and MultiCore architecture enable hardware-implemented PID loops, motion controllers, and fieldbus protocol bridges. The embedded system blocks (ESBs) can hold production-line recipes or motion profile tables, eliminating external EEPROMs in cost-sensitive machine designs.
推薦
DSP Co-Processor / Hardware Accelerator
When used as a hardware accelerator paired with a host processor, the EP20K400EFC672-3N's 16,640 logic elements and 212,992 embedded RAM bits offload compute-intensive DSP kernels such as FFTs, FIR filters, and convolutional coders. The 2.5 ns propagation delay enables pipelined multiply-accumulate structures at hundreds of MSPS, offloading the host CPU. The PCI-compatible I/O banks allow direct attachment to PowerPC or StrongARM processors via the PCI bus commonly used in embedded compute platforms of the APEX 20KE era.
推薦
Test and Measurement Instrumentation
The EP20K400EFC672-3N is well matched to test and measurement equipment where flexible logic capture, custom protocol decoding, and high I/O count are required. Its 488 user I/O can drive display controllers, ADC front-ends, and front-panel keypads simultaneously while the embedded RAM holds captured waveform samples. Speed grade -3 supports the high-speed state machines and pattern generators used in protocol analyzers. The 672-pin FC-FBGA package exposes sufficient I/O banks for mixed-voltage (2.5 V I/O with 1.8 V core) instrument architectures.
推薦
Legacy Embedded Computing Platforms
For sustaining legacy embedded computing platforms - VME boards, CompactPCI carrier cards, and military/aerospace subsystems designed in the late 1990s and early 2000s - the EP20K400EFC672-3N provides a form-fit-function continuation supply. Its MultiCore architecture, configuration bitstream format, and Quartus II toolchain compatibility enable software-only redesign when re-spins are needed. Designers maintaining long-lifecycle programs rely on the APEX 20KE family because obsolescence planning requires only last-time-buy inventory rather than full hardware redesign and certification re-qualification.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K400EFC672-3N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K400EFC672-3 | EP20K400EFC672-2X | EP20K400EFC672-2N | EP20K400EFC672-1XN | EP20K400EFC672-1N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 672-BBGA (FC-FBGA) | 672-BBGA (FC-FBGA) - same | 672-BBGA (FC-FBGA) - same | 672-BBGA (FC-FBGA) - same | 672-BBGA (FC-FBGA) - same | 672-BBGA (FC-FBGA) - same |
| Speed Grade | -3 (213 MHz) | -3 (same) | -2X (~10% slower) | -2N (~10% slower) | -1X (~20% slower) | -1N (slowest) |
| System Gates | 1,052,000 | 1,052,000 | 1,052,000 | 1,052,000 | 1,052,000 | 1,052,000 |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| User I/O | 488 | 488 | 488 | 488 | 488 | 488 |
| Embedded RAM Bits | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 |
| Lead-Free (N suffix) | Yes | No | No | Yes | No | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
主要差異化特點
- Higher speed grade than -2N/-2X drop-in alternatives (對比EP20K400EFC672-2N)
- Lead-free terminal finish for RoHS-compliant assemblies (對比EP20K400EFC672-3 (no N suffix))
- Identical silicon to EP20K400EFC672-3 for seamless last-time-buy substitution (對比EP20K400EFC672-3)
設計說明
Estimated: the APEX 20KE family FC-FBGA-672 package dissipates approximately 2-4 W typical at full I/O toggling with all PLLs active. Without a heatsink, board-level thermal management must rely on copper pours beneath the BGA thermal pad and adequate airflow (200 LFM minimum). For industrial enclosures without active cooling, derate I/O toggle rate or move to the BC-652 package variant which offers a slightly larger thermal mass. Verify junction temperature against the 125 °C maximum per the APEX 20KE reliability report.
The 672-ball FC-FBGA requires a high-density interconnect PCB with microvia stack-ups; a minimum 4-layer stack with 1 oz copper on outer layers is mandatory for power distribution. Route all differential pairs (LVDS) with 100 Ω differential impedance and length-match within 150 mils. Provide 4-8 decoupling capacitors (0.1 µF + 10 µF bulk) per VCCIO/VCCINT region, placed within 100 mils of their respective balls. The FC-FBGA's 1.0 mm ball pitch demands PCB fabrication with 4-mil line/space rules or finer.
Do not confuse the EP20K400EFC672-3N (672-ball FC-FBGA) with the EP20K400EBC652 (652-ball standard BGA) - they are NOT drop-in compatible due to different ball count, pitch, and pinout. Verify the exact part number against your PCB land pattern before ordering. Configuration mode (passive serial vs JTAG) must match the selected EPC configuration device; using the wrong mode results in configuration failures. Quartus II (not Quartus Prime) is required for APEX 20KE bitstream generation.
Place the EPC configuration device within 2 inches of the FPGA's configuration pins to minimize signal integrity issues. Route MSEL[2:0] pins to fixed logic levels (VCCINT or GND) via 1 kΩ pull resistors to set configuration mode. Dedicated JTAG pins (TCK, TMS, TDI, TDO, TRST) should be brought to a header for in-system programming access. Use a 4-layer PCB with continuous ground plane beneath the BGA to control simultaneous switching noise (SSN) on the 488 I/O.
合規資訊
N suffix typically indicates lead-free terminal finish per Altera legacy naming convention. RoHS and REACH compliance attestation not explicitly present in the Verified Web Data snippet - request the latest manufacturer certificate of compliance from the distributor of record. APEX 20KE family predates AEC-Q100 and is not automotive qualified.
