EP2A15B724C8 - APEX II FPGA, 16K LE, 724-FCBGA | Intel
MPN： EP2A15B724C8 ✗ 停產EP2A15B724C8 概覽
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the density and performance of ASIC-class integration with the flexibility of in-system reprogrammability. APEX II sits within the broader hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs like the APEX II family are typically deployed as glue logic, protocol bridges, custom datapath accelerators, and high-bandwidth parallel signal-processing engines in networking, telecom, and embedded compute platforms.
Key differentiating features of the EP2A15B724C8 include 600K system gates, embedded True-LVDS differential signalling capable of 1 Gbps per channel, support for LVPECL, pseudo current mode logic (PCML), and HyperTransport interface signalling, and 492 user I/O pins for high-density parallel interconnect. The device integrates 4 PLLs for clock multiplication and deskew, and provides built-in LVDS termination and dynamic phase alignment, eliminating many external components.
At the architectural level, the APEX II family uses a MultiCore architecture that combines look-up table (LUT) logic with embedded system blocks (ESBs) for on-chip RAM and content-addressable memory. The 16,640 logic elements can be configured for fine-grained combinational or registered logic, while 425,984 RAM bits can be partitioned into FIFOs, dual-port memories, or CAM blocks. Combined with 1.94 ns pin-to-pin logic delay, this gives the EP2A15B724C8 deterministic performance for latency-sensitive interfaces.
Typical applications include high-speed serial backplanes, telecom line cards implementing ATM, SONET/SDH, or POS-PHY Layer 2/3 functions, multi-channel LVDS data acquisition front-ends, and embedded compute nodes that use HyperTransport for chip-to-chip interconnect. The 492 I/O pins and 1 Gbps LVDS capability make it well suited for high-bandwidth parallel-to-serial aggregation, while the embedded RAM supports deep packet buffers.
When designing with the EP2A15B724C8, designers must observe the 1.5 V core supply requirement and provide proper decoupling across all VCC and VCCIO pins per the APEX II device family handbook. Signal integrity on 1 Gbps LVDS pairs requires controlled-impedance routing (typically 100 Ω differential) and matched pair lengths within the budget specified in the device datasheet. Designers should also confirm JTAG chain integrity and configuration mode (PS, AS, JTAG, or Fast Passive Parallel) prior to PCB fabrication.
This page synthesizes distributor inventory, parameterized pricing tiers, drop-in alternatives, and design notes not aggregated in the original Altera/Intel datasheet, giving engineers a single reference for sourcing, comparing, and implementing the EP2A15B724C8.
直接替換替代品，適用於 EP2A15B724C8 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2A15B724C8 （相同外形與佔位） — 差異在於 Package, Process Technology, Operating Temperature, Logic Elements, PLLs.
EP2A15B724C7
✅ 直接替換聯絡詢價
查看資料表 →EP2A15B724C9N
✅ 直接替換📋 參考替代品（不在目錄中）
EP2A15B724C
✅ 直接替換聯絡詢價
查看資料表 →EP2A15B652C9
✅ 直接替換聯絡詢價
查看資料表 →EP2A15B652C8
✅ 直接替換聯絡詢價
查看資料表 →EP2A15B724C8 最大額定值與電氣特性
| Family | APEX II |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 16,640 |
| System Gates | 600,000 |
| Embedded RAM Bits | 425,984 |
| User I/O | 492 |
| Maximum Internal Frequency | 435 MHz |
| Pin-to-Pin Logic Delay (tPD) | 1.94 ns |
| Core Voltage | 1.5 V |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed Serial Support | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport |
| PLLs | 4 |
| 封裝 | 724-pin FCBGA (flip-chip BGA) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | unknown |
EP2A15B724C8 724-pin fcbga (flip-chip bga) 腳位配置指南
EP2A15B724C8（724-pin fcbga (flip-chip bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2A15B724C8.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2A15B724C8 適用於 6 應用s: High-Speed Serial Backplane Aggregation, Telecom Line Card (POS-PHY / SPI-4.2 Bridge), Multi-Channel LVDS Data Acquisition Front-End, Embedded Compute Node (HyperTransport Bridge), Industrial Protocol Gateway (PROFINET / EtherCAT Slave), High-Bandwidth Test & Measurement Instrumentation.
High-Speed Serial Backplane Aggregation
The EP2A15B724C8's 1 Gbps True-LVDS channels and 492 user I/O make it well suited for aggregating 40+ LVDS serial lanes from line-card backplanes into a single fabric. With 4 PLLs and dynamic phase alignment, each LVDS pair can be deskewed against a common reference clock. Designers typically instantiate embedded SERDES-like soft logic using ESB-based FIFOs to absorb per-lane skew, while the 425,984 bits of embedded RAM provide deep elastic buffers for up to 16 kB of packet storage. The 724-pin FCBGA package supports the dense differential fan-out required for 1U line cards with 24+ ports.
推薦
Telecom Line Card (POS-PHY / SPI-4.2 Bridge)
In telecom line cards the EP2A15B724C8 is commonly deployed as a POS-PHY Level 2/3 or SPI-4.2 bridge between a network processor and a framer, where its 492 I/O and 1.94 ns tPD preserve deterministic latency for ATM, SONET/SDH, and HDLC pipelines. The 4 PLLs generate independent clock domains for ingress data, egress data, and the NPU interface, while 425,984 bits of embedded RAM allocate FIFO space for up to 32 kB of per-channel buffering. Compared with a Cyclone IV implementation, the APEX II provides higher I/O count and faster LVDS skew margin.
推薦
Multi-Channel LVDS Data Acquisition Front-End
For radar, medical imaging, and scientific instrumentation front-ends, the EP2A15B724C8 deserializes 16-32 LVDS channels of 8-12 bit ADC data into a parallel processing fabric at sample rates up to 100 MSPS per channel. The 16,640 logic elements support 2D beamforming or filter pipelines, while the 425,984 bits of embedded RAM act as channel-local storage for calibration coefficients and frame buffers. The 1.5 V core and 0.15 µm copper process enable the high toggle rates required for DDR-style LVDS capture, and 4 PLLs synchronize per-channel ADC clocks.
推薦
Embedded Compute Node (HyperTransport Bridge)
The EP2A15B724C8 implements HyperTransport I/O for chip-to-chip interconnect between a host CPU and an embedded compute cluster, achieving 800 MT/s-1.6 GT/s link rates per the HyperTransport 1.x specification. With 16,640 logic elements, designers instantiate protocol-stack logic (transaction decoder, retry buffer, flow-control), while 425,984 bits of embedded RAM absorb short bursts before forwarding to the compute fabric. This application is a fit when the system already uses AMD Opteron or Geode processors and needs a glue-free HT-to-LocalBus bridge.
推薦
Industrial Protocol Gateway (PROFINET / EtherCAT Slave)
Industrial protocol gateways use the EP2A15B724C8 to bridge PROFINET IRT, EtherCAT, or EtherNet/IP on the line side to a host MCU or industrial SBC, where its 1.94 ns tPD and 1 Gbps LVDS provide deterministic latency at cycle times down to 31.25 µs. The 4 PLLs support sub-microsecond phase alignment of synchronous slave clocks, and the 16,640 logic elements absorb 200-300 custom protocol-state-machine logic per channel. Compared with a Cyclone IV, the APEX II offers more I/O and tighter timing closure for industrial-grade 1 ms cycle times.
推薦
High-Bandwidth Test & Measurement Instrumentation
Test and measurement chassis use the EP2A15B724C8 as a stimulus engine and capture fabric for PXI, VXI, or LXI-based instruments, where its 1 Gbps LVDS, 492 user I/O, and 4 PLLs drive 16-32 channel logic analyzers and pattern generators. The 425,984 bits of embedded RAM store up to 4 Msamples of per-channel stimulus vectors at 32-bit depth, and the 1.94 ns tPD enables sub-2 ns pattern switching. The 724-pin FCBGA package integrates the dense pin count required for 32-bit-wide stimulus buses and provides a stable low-skew package for the high-toggle-rate pins.
推薦
推薦產品摘要
工程參考資料，適用於 EP2A15B724C8 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2A15B724C7 | EP2A15B724C9N | EP2A15B724C | EP2A15B652C9 | EP2A15B652C8 |
|---|---|---|---|---|---|---|
| Package | 724-pin FCBGA | 724-pin FCBGA (same) | 724-pin FCBGA (same) | 724-pin FCBGA (same) | 652-pin FCBGA | 652-pin FCBGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| User I/O | 492 | 492 | 492 | 492 | ~420 | ~420 |
| Speed Grade | C8 (1.94 ns tPD) | C7 (~2.05 ns tPD, slower) | C9 (slower) | C (unspecified) | C9 (slower) | C8 |
| Embedded RAM (bits) | 425,984 | 425,984 | 425,984 | 425,984 | 425,984 | 425,984 |
| Maximum LVDS Rate | 1 Gbps | 1 Gbps | 1 Gbps | 1 Gbps | 1 Gbps | 1 Gbps |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lead-Free | unknown | unknown | Yes (N suffix) | unknown | unknown | unknown |
主要差異化特點
- Faster speed grade within the same APEX II 724-FCBGA family (對比EP2A15B724C7)
- Larger user I/O count compared to 652-pin same-die variant (對比EP2A15B652C8)
- Direct APEX II same-package compatibility (對比EP2A15B724C9N)
設計說明
The EP2A15B724C8 requires a 1.5 V VCCINT core supply and a 3.3 V VCCIO I/O supply, with VCCPD typically tied to 3.3 V. According to the APEX II datasheet, VCCINT must reach stable regulation before VCCIO during ramp-up; failure to observe power sequencing may corrupt the configuration RAM and require re-programming. Place 0.1 µF + 10 µF ceramic decoupling on every VCC/VCCIO pin pair, with bulk capacitance of 470 µF or larger at each regulator output. A dedicated supervisor (e.g., TPS3823) monitors the 1.5 V rail to assert CONF_DONE only after VCCINT stabilizes.
1 Gbps True-LVDS pairs on the EP2A15B724C8 require 100 Ω differential-impedance routing with matched pair lengths within 150 mils (per APEX II handbook). Maintain continuous reference planes on layer 2 (ground) below each LVDS pair, and avoid routing across plane splits - signal-integrity degrades sharply when a reference plane changes under a high-speed pair. Use an eight-layer stack-up with dedicated ground and power planes; the 0.15 µm copper process and high-toggle-rate I/O benefit from 4 mil/4 mil trace/space geometry.
Estimated: at a typical I/O toggle rate of 50% across 200 LVDS pairs plus 100 MHz core logic, the EP2A15B724C8 dissipates approximately 3.5-4.5 W. The 724-pin FCBGA package has theta_JA of [DATA_NEEDED: theta_JA not in verified web data], but a thermal vias array beneath the package thermal land (a 7x7 grid of 12-mil vias, thermally tied to an internal ground plane) is mandatory for junction temperature below 100 °C at industrial ambient. Forced-air cooling is recommended when the device is operated continuously above 3 W dissipation.
Common pitfalls when using the EP2A15B724C8: (1) configuring the JTAG chain with incorrect TCK frequency above 16 MHz causes configuration failures - use 1-10 MHz; (2) assigning a CLK pin as user I/O disables the corresponding PLL and silently fails timing closure; (3) the MSEL[2:0] pins determine configuration mode (PS/AS/JTAG/Fast Passive Parallel) and must be pulled to the correct rails before power-up. Always verify the configuration scheme in Quartus II 9.1sp2 Device > Device & Pin Options > Configuration before generating the .sof/.pof programming file.
合規資訊
Compliance flags were not present in the verified web data for the EP2A15B724C8. The 'N' suffix on EP2A15B724C9N typically indicates a lead-free / RoHS variant, but the standard EP2A15B724C8 lead-finish status was not retrievable from the provided search results. AEC-Q100 is not applicable because this is a commercial FPGA, not an automotive-qualified part.
