EP2A25B724-C7 - APEX II FPGA, 540 I/O, 724-FCBGA | Intel
MPN： EP2A25B724-C7 ✗ 停產EP2A25B724-C7 概覽
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer can reconfigure after manufacture. Within the broader taxonomy, the APEX II family belongs to high-density programmable logic, sitting above simple PLDs and CPLDs, and below structured ASICs in terms of integration scale. APEX II devices target applications requiring on-chip memory, DSP arithmetic, and high-speed serial connectivity without the NRE cost of an ASIC.
Key features include 1.5 V core operation, embedded True-LVDS, LVPECL, PCML, and HyperTransport interface support capable of 1 Gbps per channel, dedicated high-speed clock networks with up to eight PLLs, and on-chip ESBs that can each be configured as a 4 Kbit SRAM block or product-term logic. The device supports multi-voltage I/O standards (1.5 V, 1.8 V, 2.5 V, 3.3 V) through banks of I/O pins, allowing direct interfacing to a wide variety of processors, memories, and bus standards.
Architecturally, APEX II combines a MultiCore architecture of look-up tables, product-term logic, and embedded memory into a single fabric. The combination delivers fine-grained logic density for state machines and datapaths, while embedded multipliers and on-chip RAM eliminate the need for external DSP or SRAM devices in many signal-processing designs. The 1-Gbps True-LVDS capability reduces pin count for high-speed parallel buses by aggregating data on differential pairs.
Typical applications include high-speed telecommunications backplanes, multi-gigabit serial protocol bridges, network switch fabrics, radar and signal-processing front ends, and ASIC prototyping. The 540 user I/Os and 724-ball FCBGA package also suit high-channel-count instrumentation where many parallel LVDS lanes or memory interfaces must be supported simultaneously.
When designing with the EP2A25B724-C7, plan for a robust power distribution network with bulk decoupling close to each I/O bank, follow the manufacturer's BGA escape and routing guidelines for the 1-mm-pitch FCBGA, and validate the chosen configuration mode against Quartus II support for the APEX II device family before committing to layout. The '-C7' speed grade indicates commercial temperature range and a specific timing closure window; verify against your timing budget before sign-off.
This page synthesizes distributor pricing snapshots, drop-in alternatives from the same APEX II family, and practical design considerations that are not collected in any single place in the manufacturer datasheet, helping procurement and hardware engineers evaluate the EP2A25B724-C7 in one pass.
直接替換替代品，適用於 EP2A25B724-C7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2A25B724-C7 （相同外形與佔位） — 差異在於 Package, Process Technology, Operating Temperature, Logic Elements, Maximum Internal Frequency.
EP2A25B724C9
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP2A25B724C8
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP2A15B724C7
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A15B724C8
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A15B724C9
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A25B724-C7 最大額定值與電氣特性
| Family | APEX II |
| Device | EP2A25 |
| System Gates | 622,592 |
| Logic Elements | 24,320 |
| User I/Os | 540 |
| 封裝 | 724-BBGA, FCBGA |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers |
| Core Voltage | 1.5 V |
| High-Speed Interface | True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps |
| Embedded Memory (ESB) | Configurable as 4 Kbit SRAM or product-term logic per ESB |
| PLLs | Up to 8 |
| Multi-Voltage I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V banks |
| Speed Grade | C7 |
| 工作溫度 | Commercial (0C to +85C) |
| 安裝類型 | Surface Mount |
EP2A25B724-C7 724-bbga, fcbga 腳位配置指南
EP2A25B724-C7（724-bbga, fcbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2A25B724-C7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2A25B724-C7 適用於 6 應用s: Telecommunications Backplane Bridging, ASIC Prototyping and Emulation, Multi-Channel Data Acquisition, Radar and Signal-Processing Front End, Legacy Industrial Control and Networking, Test and Measurement Instrumentation.
Telecommunications Backplane Bridging
The EP2A25B724-C7's 1-Gbps True-LVDS, LVPECL, PCML, and HyperTransport interface capability, combined with 540 user I/Os in a 724-FCBGA, makes it a strong fit for telecommunications backplane bridging. The device aggregates multi-lane LVDS data streams between line cards and switch fabrics at up to 1 Gbps per differential pair, replacing multiple discrete transceivers with a single programmable device. Placed at the backplane interface with on-chip ESBs configured as FIFOs for clock-domain crossing, it absorbs protocol-mismatch latency between ingress PHY and switch ASIC. The 24,320 logic elements support full-rate protocol handling (e.g. SPI-4.2, SGMII bridging), while embedded RAM absorbs packet bursts up to several Kbytes per flow without external SSRAM. Unlike a hard ASIC, the FPGA allows late-stage protocol revisions on the production line.
推薦
ASIC Prototyping and Emulation
With 622,592 system gates and 24,320 logic elements, the EP2A25B724-C7 fits mid-density ASIC prototyping and emulation. The 724-FCBGA exposes enough user I/Os to bring out a 256-bit datapath plus dedicated clock and JTAG pins for bring-up, while 1.5 V core operation matches modern ASIC core voltages. Mapped into a multi-FPGA farm, multiple EP2A25 devices prototype SoC subsystems before mask tape-out, with the embedded system blocks serving as RAM/ROM models. The configuration port supports rapid design iterations via JTAG and passive-serial EPC configuration devices, cutting prototype turnaround from days to hours. Compared with a single large FPGA, the APEX II's mature Quartus II toolchain preserves bitstream compatibility across engineering change orders.
推薦
Multi-Channel Data Acquisition
The EP2A25B724-C7's 540 user I/Os support direct connection to dozens of high-speed ADC and DAC channels in multi-channel data-acquisition systems. The 1-Gbps LVDS pairs handle serialized ADC outputs at full sample rate without external deserializer ICs, while the embedded system blocks configured as SRAM provide deep capture buffers (tens of Ksamples per channel). The eight PLLs generate independent low-jitter clocks for each ADC, and the multi-voltage I/O banks interface directly to 1.8 V ADC logic and 3.3 V DAC outputs without level shifters. Embedded multipliers accelerate per-channel DSP such as FIR filtering and decimation. Compared with a fixed-function ASIC, the FPGA allows channel count and filter coefficients to be tuned per deployment.
推薦
Radar and Signal-Processing Front End
The EP2A25B724-C7's combination of 1-Gbps LVDS, embedded multipliers, and large on-chip RAM makes it suitable for radar and digital signal-processing front ends. It accepts serialized IF samples from multiple receiver channels at full rate, performs pulse compression, MTI filtering, and FFT-based spectral analysis in real time using the embedded ESBs as coefficient memory. The 540 user I/Os connect to ADC/DAC mezzanines, sync clocks, and host interfaces (PCI, VME, or custom backplane). The eight PLLs provide low-jitter clocks required for matched-filter timing accuracy. Compared with DSP processors, the FPGA delivers deterministic latency essential for coherent pulse integration.
推薦
Legacy Industrial Control and Networking
The EP2A25B724-C7 was widely deployed in legacy industrial control, factory automation, and proprietary networking equipment. Its 540 user I/Os accommodate dozens of field-bus channels (Profibus, DeviceNet, custom RS-485 multi-drop) through parallel I/O, while 1-Gbps LVDS backplane links tie multiple controller cards together at high speed. The C7 commercial speed grade and 0C-to-+85C operating temperature cover indoor industrial enclosures. Long-term maintenance is increasingly challenging because the part is obsolete on manufacturer channels; designers maintaining installed bases should stockpile now. As a drop-in alternative, EP2A25B724C8 or EP2A25B724C9 in the same 724-FCBGA footprint allow straightforward field replacement at the cost of a slower speed grade.
推薦
Test and Measurement Instrumentation
Test and measurement instruments benefit from the EP2A25B724-C7's 1-Gbps LVDS pattern generation, deep on-chip memory for capture buffers, and 540 user I/Os for parallel test points. The device generates multi-channel BERT patterns, captures high-speed waveforms into embedded ESB RAM, and post-processes results in real time. The eight PLLs derive multiple reference frequencies for jitter measurement or frequency synthesis, while multi-voltage I/O banks connect directly to 1.5 V/2.5 V/3.3 V DUT interfaces. Designers in this segment value the Quartus II design entry flow and the JTAG-based interactive debug which the APEX II family fully supports. Compared with a logic analyzer, the FPGA-based instrument is far more compact and lower cost.
推薦
推薦產品摘要
工程參考資料，適用於 EP2A25B724-C7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2A25B724C9 | EP2A25B724C8 | EP2A15B724C7 | EP2A15B724C8 | EP2A15B724C9 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 724-BBGA, FCBGA | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same |
| Device Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| Logic Density (Silicon Die) | EP2A25 (~24,320 LEs) | EP2A25 (~24,320 LEs) - same | EP2A25 (~24,320 LEs) - same | EP2A15 (~13,000 LEs, -47% density) | EP2A15 (~13,000 LEs, -47% density) | EP2A15 (~13,000 LEs, -47% density) |
| Speed Grade | C7 | C9 (-2 speed bins slower) | C8 (-1 speed bin slower) | C7 - same speed grade | C8 (-1 speed bin slower) | C9 (-2 speed bins slower) |
| User I/Os | 540 | 540 - same | 540 - same | 540 - same package I/O count | 540 - same package I/O count | 540 - same package I/O count |
| Core Voltage | 1.5 V | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same |
| High-Speed Interface | 1 Gbps True-LVDS / LVPECL / PCML / HyperTransport | 1 Gbps True-LVDS / LVPECL / PCML / HyperTransport - same | 1 Gbps True-LVDS / LVPECL / PCML / HyperTransport - same | 1 Gbps True-LVDS / LVPECL / PCML / HyperTransport - same | 1 Gbps True-LVDS / LVPECL / PCML / HyperTransport - same | 1 Gbps True-LVDS / LVPECL / PCML / HyperTransport - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Highest speed grade in the EP2A25 724-FCBGA family (對比EP2A25B724C8)
- Maximum logic density in the 724-FCBGA APEX II family (對比EP2A15B724C7)
- 1-Gbps True-LVDS interface capability with embedded termination (對比Stratix II GX in equivalent FBGA)
設計說明
Estimated: at 1.5 V core with the EP2A25 device fully populated with switching logic, ICC_CORE is on the order of 1-3 A; budget 4-6 W core power alone. Add PLL analog VCC_PLL filtered through a ferrite bead + 10 uF bulk + 0.1 uF local decoupling on each PLL supply pin. Bulk-decouple each VCCIO bank with at least 22 uF ceramic + 100 uF low-ESR electrolytic placed within 25 mm of the BGA, and a 0.1 uF / 0.01 uF pair at each power-ball cluster to suppress switching transients when 540 I/Os toggle simultaneously.
The 724-FCBGA package has a 1.0 mm ball pitch and a 4-6-4 row perimeter BGA escape pattern. Use at least an 8-layer stack-up with two dedicated ground planes (one under the BGA field for return-path continuity), 4 mil traces in the BGA field, and microvia-in-pad or stacked-via fan-out to break out the inner balls. Plan BGA escape routing before pin assignment and follow the manufacturer's BGA escape guidelines for the APEX II 724-FCBGA. Stitch the ground planes with a 200-mil pitch via fence around the BGA perimeter to control 1-Gbps LVDS return paths.
Length-match True-LVDS pairs to within 5 mil of each other within a channel and to within 50 mil across channels, and keep differential impedance at 100 ohms +/- 10% on the PCB stack-up. Series-couple 100 nF AC-coupling capacitors close to the receiver, and provide on-chip 100-ohm differential termination enabled in the Quartus II pin planner. For multi-gigabit LVPECL or PCML interfaces, bias networks must follow the APEX II reference design exactly; do not omit the pull-down resistors or use generic LVPECL termination.
Do not assume the EP2A25B724-C7 is in production - it is obsolete on manufacturer channels and only available through brokers; obtain a long-term supply commitment before committing to a new design. Quartus II version 9.1 is the last supported design environment; newer Quartus Prime releases do not include the APEX II device files, so lock the tool version. Configuration data must come from a compatible EPC serial configuration device (EPC16, EPC8, or EPC4) - the legacy parallel flash configuration mode requires external logic that the EP2A25 does not include.
合規資訊
The APEX II family predates widespread RoHS enforcement; lead-free ('N' suffix) variants may exist. RoHS, REACH, and halogen-free status are not documented in the verified distributor data and are marked [DATA_NEEDED] / unknown. AEC-Q100 is not applicable because the device is commercial grade (C7 suffix) without automotive qualification.
