EP2A40B724I8 - APEX II FPGA 40K LE 655360bit 724-BGA | Altera
MPN： EP2A40B724I8 ✗ 停產EP2A40B724I8 概覽
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to configure digital logic, memory blocks, and I/O behavior after manufacturing. Within the broader semiconductor hierarchy, FPGAs belong to the digital logic IC family, sitting between ASICs (application-specific, fixed-function) and general-purpose processors. FPGAs trade raw clock speed and per-unit cost for design flexibility, rapid prototyping, and parallel hardware execution - making them ideal for high-throughput data-path and interface-bridging applications.
The EP2A40B724I8 integrates 38400 logic elements (LEs) distributed across four MegaLAB structures, each containing embedded system blocks (ESBs) that can be configured as RAM, ROM, or content-addressable memory. The device supports LVTTL, LVCMOS, SSTL, and HSTL I/O standards with multi-voltage operation (1.5 V, 1.8 V, 2.5 V, 3.3 V) on its 540 user I/O pins. Each LE contains a 4-input LUT, a programmable register, and dedicated carry and cascade chains for high-speed arithmetic and wide fan-in functions.
Architecturally, APEX II uses a MultiCore architecture with embedded memory and dedicated high-speed interconnect (DirectDrive, MultiTrack). The 1.425 V to 1.575 V core supply and 540 I/O make this device suitable for high-bandwidth telecommunications, video processing, and parallel DSP functions where multiple clock domains and large amounts of on-chip buffering are required.
Typical applications include high-speed data acquisition front-ends, ATM backbone switches, base-station channel cards, HDTV video processing, and protocol-bridging ASIC prototyping. Designers migrating from fixed ASICs use the EP2A40B724I8 to validate RTL early in the design cycle and reduce NRE risk.
When designing with this device, pay particular attention to power-rail sequencing (core VCCINT before VCCIO), decoupling (low-ESL ceramics on every VCC/VSS pair), and the high-pin-count FCBGA land pattern which requires microvia PCB stack-ups and assembly under ENIG or immersion-silver surface finish for reliable solder joint formation.
This page synthesizes distributor stock data, drop-in same-package alternatives from the APEX II family, and practical design notes that complement the official APEX II datasheet family documentation.
直接替換替代品，適用於 EP2A40B724I8 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2A40B724I8 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Process Technology, Configuration Mode, Series.
EP2A40B724I8N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40B724I7N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40B724I7
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40B724I-8
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40B724I-7
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40B724I8 最大額定值與電氣特性
| Series | APEX II |
| Family | APEX II FPGA |
| Logic Elements (LE) | 38400 |
| Total RAM Bits | 655360 |
| Number of I/O | 540 |
| Number of Logic Gates | 2.0 M gates (typical, family) |
| Core Voltage VCCINT | 1.425 V to 1.575 V |
| 工作溫度 | -40C to +100C (Industrial) |
| 封裝 / 外殼 | 724-BBGA, FCBGA |
| Supplier Device Package | 724-BGA (35x35 mm) |
| 安裝類型 | Surface Mount |
| Process Technology | 0.18 um CMOS |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, HSTL |
| Speed Grade | I8 (industrial, speed grade 8) |
EP2A40B724I8 724-bga (35x35 mm) 腳位配置指南
EP2A40B724I8（724-bga (35x35 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2A40B724I8.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2A40B724I8 適用於 6 應用s: Telecommunications Backbone Switches, High-Definition Video Processing, ASIC Prototyping and Emulation, Industrial Automation Controllers, High-Speed Data Acquisition Front-Ends, Wireless Base-Station Channel Cards.
Telecommunications Backbone Switches
The EP2A40B724I8 fits telecommunications backbone switches because its 38,400 logic elements and 655,360 bits of embedded RAM allow designers to implement deep packet buffers, queue managers, and cell-switching fabrics in a single device. The 540 user I/O pins enable parallel buses to network processors, PHY chips, and SRAM/RLDRAM external memory. The MultiCore architecture and DirectDrive routing deliver predictable timing for cell-by-cell forwarding at OC-48/OC-192 line rates. APEX II ESBs configured as CAM support fast longest-prefix-match lookups in routing tables. Industrial -40°C to +100°C temperature range tolerates telecom-closet thermal envelopes without active cooling.
推薦
High-Definition Video Processing
The EP2A40B724I8 serves high-definition video processing pipelines because its 38,400 LEs and 655,360 bits of embedded RAM handle multi-stream HD-SDI routing, color-space conversion, scaling, and overlay composition in real time. The 540 I/O pins interface directly to video ADCs/DACs, DDR memory, and HDMI/DisplayPort bridge chips. APEX II ESBs configured as dual-port RAM implement line buffers and frame-store FIFOs without external memory. Quartus II IP cores for video synchronization, deinterlacing, and chroma resampling target this exact device. Industrial temperature grade supports set-top box and broadcast equipment thermal profiles.
推薦
ASIC Prototyping and Emulation
The EP2A40B724I8 is widely used as an ASIC prototyping platform because its 38,400 logic elements can map substantial blocks of an ASIC RTL into real silicon for system-level validation before tape-out. The 655,360 bits of embedded RAM emulate ASIC SRAM blocks, while 540 user I/O pins bring out ASIC boundary-scan and external bus signals for bring-up. Quartus II synthesis supports incremental compilation, allowing multiple engineers to prototype ASIC sub-modules in parallel on the same FPGA. The MultiCore architecture preserves ASIC timing intent through predictable DirectDrive routing paths. Industrial temperature grade enables field trials of prototype ASIC functions.
推薦
Industrial Automation Controllers
The EP2A40B724I8 fits industrial automation controllers because its 38,400 logic elements implement multiple IEC 61131-3 PLC function blocks, EtherCAT/CANopen protocol stacks, and safety logic in parallel hardware. The 540 user I/O pins interface directly to 24 V industrial sensors, optocouplers, and motor-driver PWM stages through external level shifters. The 655,360 bits of embedded RAM hold lookup tables for motion profiles and PID tuning parameters. Industrial -40°C to +100°C temperature range tolerates factory-floor enclosures without active cooling. Quartus II Qsys tool chains integrate with SoftPLC IP cores for ladder-logic and structured-text compilers.
推薦
High-Speed Data Acquisition Front-Ends
The EP2A40B724I8 supports high-speed data acquisition front-ends because its 38,400 logic elements and 655,360 bits of embedded RAM implement parallel digital down-conversion, FIR filtering, and FFT pipelines for multi-channel ADC capture at sample rates up to 200 MSPS. The 540 user I/O pins accept LVDS or parallel CMOS data from multiple ADCs simultaneously, and the MultiCore architecture delivers deterministic routing for high-fan-in datapaths. APEX II ESBs configured as dual-port RAM provide intermediate FFT stage buffers without external memory. Industrial -40°C to +100°C operation supports outdoor radar, sonar, and instrumentation environments.
推薦
Wireless Base-Station Channel Cards
The EP2A40B724I8 fits wireless base-station channel cards because its 38,400 logic elements implement channel coding, Viterbi/Turbo decoders, and uplink scrambling for GSM/UMTS/LTE baseband processing. The 655,360 bits of embedded RAM hold soft-decision buffers and interleaver tables, while the 540 user I/O pins interface to DSP ASICs, DAC/ADC RF chains, and CPRI/OBSAI framer links. APEX II ESBs configured as synchronous RAM enable high-throughput Turbo decoder metric computations. Industrial temperature range ensures reliable operation in outdoor base-station cabinets.
推薦
推薦產品摘要
工程參考資料，適用於 EP2A40B724I8 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2A40B724I8N | EP2A40B724I7N | EP2A40B724I7 | EP2A40B724I-8 | EP2A40B724I-7 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 724-BGA (35x35 mm) | 724-BGA (35x35 mm) - same | 724-BGA (35x35 mm) - same | 724-BGA (35x35 mm) - same | 724-BGA (35x35 mm) - same | 724-BGA (35x35 mm) - same |
| Logic Elements | 38400 | 38400 | 38400 | 38400 | 38400 | 38400 |
| Total RAM Bits | 655360 | 655360 | 655360 | 655360 | 655360 | 655360 |
| User I/O | 540 | 540 | 540 | 540 | 540 | 540 |
| Speed Grade | I8 | I8 | I7 (faster) | I7 (faster) | I8 | I7 (faster) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Industrial | Industrial |
主要差異化特點
- Obsolete status means only same-brand drop-in replacements are available (對比Cross-brand candidates like Xilinx Virtex-II)
- Faster speed grade available as drop-in upgrade path (對比EP2A40B724I8 (this part, I8 speed grade))
- Lead-free option for RoHS compliance (對比EP2A40B724I8 (this part, finish unknown))
設計說明
The APEX II EP2A40B724I8 requires strict power-rail sequencing: VCCINT (1.5 V core) must reach 90% of nominal before VCCIO (I/O bank voltage). Reverse sequencing can cause latch-up and permanent damage. Use a sequencer IC or power-supply supervisor with adjustable delay. Decoupling requires 0.1 µF X7R low-ESL ceramics on every VCCINT/VSS pair plus bulk tantalum or polymer capacitors at each voltage rail entry point. Estimated core current at 100% utilization is approximately 1.5-2.0 A; size the regulator for 3 A peak transient.
The 724-BGA package at 35x35 mm requires a microvia PCB stack-up (e.g. 8-layer 1+N+1 or HDI AnyLayer) with via-in-pad for the BGA escape. Surface finish should be ENIG or immersion silver (ENEPIG preferred for fine pitch). Signal integrity demands matched-length traces for LVDS pairs and 50 Ω controlled impedance for high-speed I/O. Place decoupling capacitors on the BGA side opposite the die, with vias within 0.5 mm of each pad. Thermal vias under the BGA thermal balls improve heat dissipation but must be capped to prevent solder wicking.
At full logic utilization (~85% LE toggle rate) and 540 I/O switching, the EP2A40B724I8 dissipates an estimated 3-5 W. With no explicit heatsink, the junction-to-ambient thermal resistance θJA for the 724-BGA is approximately 12-15 °C/W in still air. Estimated: at 4 W dissipation and 25°C ambient, junction temperature rises to 75-85°C, within the 100°C industrial limit. Active airflow or a heatsink is required for designs operating near 100°C ambient. Monitor junction temperature via the on-chip die-sensor using Quartus II programming tools.
Common pitfalls include: (1) failing to configure all I/O banks before driving signals into unused pins (causes high-current latch-up); (2) configuring ESBs as RAM without initializing them (causes random read data on power-up); (3) ignoring the JTAG chain order when using boundary-scan, which can mask configuration errors; (4) using the wrong configuration bitstream file (e.g. EP2A40B724C8 instead of EP2A40B724I8) leads to timing violations; (5) exceeding the 1.575 V VCCINT maximum during in-rush can cause immediate failure. Always verify the bitstream with Quartus II programmer before production.
合規資訊
RoHS, REACH, lead-free, halogen-free, and conflict-mineral compliance status are not explicitly documented in the verified web data for the base EP2A40B724I8 part. The EP2A40B724I8N variant suffix indicates lead-free ball finish per Altera naming convention, but this does not constitute full RoHS certification - verify with distributor documentation before procurement for RoHS-regulated markets.
