EP2AGX260FF35I5G - Arria II GX FPGA, 244K LE, 1152-FCBGA | Intel
MPN： EP2AGX260FF35I5G ✓ 啟用中EP2AGX260FF35I5G 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs belong to the broader family of programmable logic devices (PLDs) and are positioned in the system hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike ASICs, FPGAs are reprogrammable in-system, enabling rapid prototyping, hardware acceleration, and design iteration without NRE cost.
The EP2AGX260FF35I5G core operates at 0.9V with up to 500 MHz internal performance. Key features include embedded 18x18 multipliers for DSP, dedicated high-speed transceivers (CPRI, PCIe, Gigabit Ethernet, Serial RapidIO), on-chip memory, and PLL-based clock management. The Arria II GX architecture balances logic density, transceiver bandwidth, and power efficiency, targeting mid-volume applications.
Designed on TSMC's 40nm process, the device combines a high-logic-count fabric with multi-gigabit transceivers in a single die, reducing board area versus multi-chip implementations. The FF35 package designation indicates a 35 mm body size FCBGA with fine-pitch BGA balls optimized for high-speed signal integrity at transceiver rates.
Typical applications include wireless baseband processing, telecom backhaul, military radar, broadcast video processing, and high-performance computing accelerators. The device is well suited for designers transitioning from ASIC to FPGA for low-volume production or for systems requiring field upgradability.
When designing with this FPGA, pay attention to transceiver channel placement constraints, reference clock architecture, and thermal dissipation - the high transceiver count requires multi-layer PCB stackups and careful power delivery. Quartus II design software with Arria II GX device support is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Arria II GX family, and practical design notes drawn from the manufacturer datasheet, providing engineering insight not duplicated on individual distributor product pages.
直接替換替代品，適用於 EP2AGX260FF35I5G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2AGX260FF35I5G （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, Logic Elements, Process Technology.
EP2AGX260FF35I3G
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查看資料表 →EP2AGX260FF35I3N
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查看資料表 →EP2AGX260FF35C6G
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查看資料表 →EP2AGX260FF35C5G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX260FF35C4G
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查看資料表 →EP2AGX260FF35I5N
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查看資料表 →EP2AGX260FF35I5G 最大額定值與電氣特性
| Family | Arria II GX |
| Device Logic Elements | 244,188 |
| Adaptive Logic Modules (ALMs) | 96,330 |
| Embedded Memory Bits | 12,038,144 bits |
| User I/O Pins | 612 |
| Embedded 18x18 Multipliers | 768 |
| Transceiver Channels | 12 |
| PLLs | 8 |
| Global Clock Networks | 16 |
| Maximum Internal Frequency | 500 MHz |
| Core Voltage | 0.9 V |
| 封裝 | 1152-ball FC-FBGA (FF35), 35 mm body |
| Process Technology | 40 nm TSMC |
| 工作溫度 | -40C to +100C (Industrial, I5 grade) |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant |
EP2AGX260FF35I5G 1152-ball fc-fbga (ff35), 35 mm body 腳位配置指南
EP2AGX260FF35I5G（1152-ball fc-fbga (ff35), 35 mm body 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2AGX260FF35I5G.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2AGX260FF35I5G 適用於 7 應用s: Wireless Baseband Processing, Telecom Backhaul Aggregation, Broadcast Video Processing, Military Radar Signal Processing, High-Performance Computing Accelerator, Medical Imaging Front-End, Industrial Automation Controller.
Wireless Baseband Processing
The EP2AGX260FF35I5G's 244,188 logic elements and 768 18x18 multipliers deliver the DSP throughput needed for LTE and WCDMA baseband processing at the physical layer. Its 12 multi-gigabit transceivers interface directly with CPRI/OBSAI links to remote radio heads, eliminating external SERDES ICs. The FF35 package provides 612 user I/Os for parallel ADC/DAC connection, antenna calibration buses, and JTAG. Compared to ASICs, the FPGA delivers field-upgradable firmware as 3GPP standards evolve, while matching the deterministic latency required for TDD switching.
推薦
Telecom Backhaul Aggregation
Designed into packet-based backhaul routers, the EP2AGX260FF35I5G aggregates multiple GbE, 10GbE, and Serial RapidIO links using its 12 multi-gigabit transceivers. The 12,038,144-bit embedded memory supports deep packet buffering without external SRAM, while 8 PLLs generate the multiple clock domains required for bonded link aggregation. The 1152-ball FC-FBGA package offers the signal-integrity headroom needed for 6.375 Gbps serial channels over FR-4 backplanes. Industrial -40C to +100C temperature grade supports outdoor cabinet deployment.
推薦
Broadcast Video Processing
In broadcast video routers and format converters, the EP2AGX260FF35I5G's combination of 244K logic elements and 12 Mbits of embedded memory ingests multi-stream SDI input and performs real-time scaling, de-interlacing, and color-space conversion. Its 612 user I/Os handle parallel video buses for 4:4:4 and 4:2:2 studio formats, while the 768 multipliers accelerate motion-adaptive deinterlacing algorithms. The industrial temperature grade meets broadcast equipment environmental specifications. Compared to ASSP video processors, the FPGA offers faster time-to-market for emerging UHD formats.
推薦
Military Radar Signal Processing
The EP2AGX260FF35I5G's 768 18x18 multipliers enable pulse-Doppler and SAR radar beamforming and matched-filter processing, while its 12 transceivers connect to ADCs and high-speed data recorders. The industrial temperature grade -40C to +100C supports MIL-STD-810 environmental requirements. The FF35 1152-ball FCBGA package is well-suited to conduction-cooled ruggedized enclosures. Compared to GPU-based radar processors, the FPGA delivers deterministic real-time latency critical for tracking loops and synthetic aperture processing pipelines.
推薦
High-Performance Computing Accelerator
In heterogeneous compute clusters, the EP2AGX260FF35I5G functions as a PCIe-attached compute accelerator for FFT, encryption, and financial Monte-Carlo workloads. Its 12 multi-gigabit transceivers implement x8 PCIe Gen2 at 5 Gbps per lane, providing 40 Gbps host interconnect bandwidth. The 12 Mbits embedded memory forms deep lookup tables for cryptographic S-boxes, while 244K logic elements implement wide datapath engines. Compared to discrete GPU acceleration, the FPGA offers 10x better energy efficiency per watt for fixed-precision streaming workloads.
推薦
Medical Imaging Front-End
In ultrasound and CT imaging front-ends, the EP2AGX260FF35I5G receives raw digitized RF from multi-channel ADCs, performs beamforming and envelope detection in real time, and outputs processed video to the host processor. The 12 transceivers aggregate data from 64 to 128 ultrasound channels, while 768 multipliers handle per-channel FIR filtering. The 612 user I/Os accept parallel LVDS data streams and provide timing control to ADC front-ends. Industrial temperature grade matches the controlled environment of imaging carts and stationary systems.
推薦
Industrial Automation Controller
In high-end PLC, motion controller, and machine-vision inspection systems, the EP2AGX260FF35I5G combines deterministic real-time logic with high-speed industrial Ethernet connectivity. Its 12 multi-gigabit transceivers implement EtherCAT, PROFINET IRT, or SERCOS III master interfaces, while the 244K logic elements implement multi-axis PID loops and vision-pipeline preprocessing. The 12 Mbit embedded memory buffers image data before forwarding to the host. The industrial -40C to +100C temperature range supports factory-floor deployment in unconditioned enclosures.
推薦
推薦產品摘要
工程參考資料，適用於 EP2AGX260FF35I5G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2AGX260FF35I3G | EP2AGX260FF35I3N | EP2AGX260FF35C6G | EP2AGX260FF35C5G | EP2AGX260FF35C4G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (FF35) | 1152-ball FC-FBGA (FF35) - same | 1152-ball FC-FBGA (FF35) - same | 1152-ball FC-FBGA (FF35) - same | 1152-ball FC-FBGA (FF35) - same | 1152-ball FC-FBGA (FF35) - same |
| Logic Elements | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 |
| Speed Grade | I5 | I3 (slower) | I3 (slower) | C6 (faster) | C5 (similar to I5) | C4 (slower) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| RoHS Compliance | Yes (G suffix) | Yes (G suffix) | No (N suffix, Pb) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) |
| Transceiver Count | 12 | 12 | 12 | 12 | 12 | 12 |
| Embedded Memory (bits) | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 |
| User I/O Pins | 612 | 612 | 612 | 612 | 612 | 612 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
主要差異化特點
- RoHS-compliant lead-free finish for global market access (對比EP2AGX260FF35I5N)
- Faster I5 speed grade than the I3 drop-in replacement (對比EP2AGX260FF35I3G)
- Industrial -40C to +100C temperature range (對比EP2AGX260FF35C6G)
設計說明
The 1152-ball FF35 FC-FBGA package requires a high-layer-count PCB (typically 10+ layers) with 1 oz copper power planes and a dedicated ground plane immediately below the BGA. Escape routing through the inner rows requires microvia (laser-drilled) or stacked-via technology; standard through-hole vias are too large to escape the 1.0 mm pitch ball array. Use the manufacturer's reference PCB stackup in the Arria II GX Hardware Design Guidelines.
Estimated: at 100% logic utilization with all 12 transceivers active, the EP2AGX260FF35I5G dissipates approximately 12 to 15 W. A thermal pad connected to the package's exposed die area (or top-side heat spreader) is required; theta_JA without heat spreader is approximately 11 C/W (per Arria II GX thermal model). At 15 W dissipation, junction rises roughly 165 C above ambient without a heat sink - this exceeds the +100C industrial limit and mandates a heat sink or forced-air cooling.
Configuration mode pins (MSEL) must be set correctly per the Arria II GX configuration handbook before power-up, otherwise the device will not enter user mode. JTAG chains must include proper TCK pull-down and TMS/TDI pull-up resistors as specified in the device datasheet. Multi-gigabit transceivers require a separate PLL reference clock for each bank, and reference-clock jitter must remain below the protocol's specification (e.g., 3.5 ps RMS for PCIe Gen2).
Multi-gigabit transceiver channels must be routed as 100-ohm differential pairs with intra-pair skew below 5 mil and continuous reference plane below the trace. The Arria II GX device handbook specifies maximum trace lengths for each protocol. AC-coupling capacitors (typically 100 nF) must be placed near the transmitter side for each channel. Matched-length routing between TX and RX pairs is required for protocols with strict lane-to-lane skew budgets.
The EP2AGX260FF35I5G requires multiple supply rails: 0.9V core (VCC), 1.1V PLL analog (VCCA_PLL), 1.5V or 1.8V transceiver supply (VCCA_GXB), and 2.5V or 3.0V I/O (VCCIO) per bank. A power-sequencing circuit must enforce the datasheet-specified power-up sequence to avoid latch-up. Decoupling: a minimum of 24x 0.1 uF and 8x 10 uF ceramic capacitors must be placed within the BGA breakout region per Intel's power distribution network (PDN) guidelines.
合規資訊
RoHS compliance indicated by 'G' suffix in MPN. REACH, halogen-free, and conflict-mineral status not stated in distributor listing; verify via manufacturer declaration letter. AEC-Q100 not applicable for FPGA ICs.
