EP2AGX65DF25C5N - Arria II GX FPGA, 60K LE, 572-FCBGA | Intel
MPN： EP2AGX65DF25C5N ✗ 停產EP2AGX65DF25C5N 概覽
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O can be reconfigured after manufacturing by loading a user-defined bitstream. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> Arria-family mid-range FPGA -> power-managed signal-processing FPGA. They are deployed when a design requires hardware-level parallelism, deterministic latency, and reconfigurability that a fixed-function ASIC or microcontroller cannot provide.
The Arria II GX architecture is fabricated on a 40 nm process and is engineered for low static and dynamic power versus prior Stratix generations, with on-chip PLLs, dedicated memory controllers (DDR3/QDRII+/RLDRAM II), and 8-input adaptive logic modules (ALMs). The "GX" suffix indicates the integrated multi-gigabit transceiver (MGT) channels. Speed grade 5 (C5) and industrial temperature grade place this part in the mainstream power/performance envelope; lead-time-free (Pb-free, indicated by "N") assembly is standard.
Typical applications include PCI Express endpoint/mid-plane cards, video broadcast and processing pipelines, wireless baseband DSP, software-defined radio front-ends, high-speed serial protocol bridging (XAUI, SATA, CPRI), and industrial imaging systems. The 572-FCBGA package enables dense PCB routing for high-layer-count backplanes.
When designing with this part, ensure that transceiver reference-clock jitter meets the Arria II GX Transceiver Specification and that the Quartus II power calculator is used to size the core current budget. The 1.0 V core rail (VCC) must be sequenced with the 1.5 V/2.5 V/3.0 V I/O and transceiver analog supplies per the recommended power-on sequence to avoid latch-up.
This page synthesizes distributor pricing, package-pinned drop-in alternatives in the Arria II GX family, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 EP2AGX65DF25C5N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2AGX65DF25C5N （相同外形與佔位） — 差異在於 Package, Speed Grade, Process Technology, RoHS Status, Transceivers.
EP2AGX65DF25C5G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX65DF25C4N
✅ 直接替換📋 參考替代品（不在目錄中）
EP2AGX65DF25C6N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX65DF25I5N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2AGX45DF25C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX65DF25C5N 最大額定值與電氣特性
| Family | Arria II GX |
| Series | Arria II GX |
| Device Type | FPGA (Field Programmable Gate Array) |
| Number of Logic Elements (LE) | 60214 |
| Number of LABs/CLBs | 2530 |
| Total RAM Bits | 5371904 |
| Number of I/O | 252 |
| Package Type | FBGA-572 (FineLine BGA, FCBGA, 25 mm) |
| 腳位數 | 572 |
| 供應電壓 | 0.9 V core; 1.1 V/1.5 V/2.5 V/3.0 V I/O (transceiver analog rails separate) |
| 工作溫度 | 0C to +85C (commercial, C5 speed grade) |
| Speed Grade | 5 |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant (Pb-free) |
| Lead-Free | Yes |
EP2AGX65DF25C5N fbga-572 (fineline bga, fcbga, 25 mm) 腳位配置指南
EP2AGX65DF25C5N（fbga-572 (fineline bga, fcbga, 25 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2AGX65DF25C5N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2AGX65DF25C5N 適用於 6 應用s: PCI Express Endpoint Card, Video Broadcast Processing Pipeline, Wireless Baseband / Software-Defined Radio, Industrial Imaging and Machine Vision, High-Speed Serial Protocol Bridge, Test and Measurement Instrumentation.
PCI Express Endpoint Card
The EP2AGX65DF25C5N is purpose-built for PCI Express endpoint designs because the Arria II GX silicon integrates hardened Gen1/Gen2 hard IP blocks supporting x1/x2/x4 lane configurations, with transceiver channels reaching 3.75 Gbps line rate per the Arria II GX Device Handbook. Placing the device on a PCIe add-in card eliminates the soft-logic PCI Express implementation cost and provides deterministic transaction-layer latency in the sub-microsecond range. The 60,214 logic elements and 5.37 Mbit of embedded RAM are sufficient for endpoint protocol state machines, DMA engines, and modest payload FIFOs. Designers should use the Quartus II IP Compiler to instantiate the PCIe HIP and observe the transceiver reference-clock jitter spec when validating link training. The 252 user I/O pins plus 572-ball F25 BGA support x4-lane PCIe plus auxiliary GPIO for board-management functions.
推薦
Video Broadcast Processing Pipeline
For uncompressed HD-SDI / 3G-SDI video routing and processing, the EP2AGX65DF25C5N delivers sufficient DSP blocks and logic density to implement multi-channel video cross-points, color-space transformers, and frame-rate converters. The integrated transceivers directly interface SMPTE 259M/292M/424M serial video at 270 Mbps / 1.485 Gbps / 2.97 Gbps without external serializer/deserializer parts, reducing BOM cost. The 5.37 Mbit embedded RAM buffers line-rate video without external SRAM, and the 252 user I/O accommodate parallel GPIO, I2C, and SPI for downstream video ADC/DAC control. For multi-channel 4K pipelines, consider migrating up to EP2AGX125 or EP2AGX190 in the same package family to preserve PCB layout reuse.
推薦
Wireless Baseband / Software-Defined Radio
The EP2AGX65DF25C5N is well-suited to wireless baseband DSP and software-defined radio front-ends because its transceiver channels support CPRI, OBSAI, and proprietary baseband protocols at rates up to 3.75 Gbps. The 60,214 logic elements plus dedicated DSP blocks implement multi-carrier FFT/iFFT, channel estimation, and digital predistortion for small-cell and pico-cell base stations. Low static power on the 40 nm process reduces thermal budget in outdoor radio units. Designers pair the FPGA with an RF front-end IC and a DAC/ADC pair, using the embedded RAM for sample buffering. The 572-ball F25 BGA footprint supports dense PCB routing to the analog mixed-signal devices.
推薦
Industrial Imaging and Machine Vision
In factory-floor machine-vision systems, the EP2AGX65DF25C5N provides parallel I/O bandwidth (252 pins) to interface multiple CoaXPress, Camera Link, or MIPI CSI-2 image sensors, while the embedded transceivers drive CoaXPress at up to 3.125 Gbps per channel. The 5.37 Mbit of embedded RAM buffers multi-megapixel frames at line rate, and the 60,214 logic elements implement Bayer-to-RGB demosaicing, lens-distortion correction, and feature extraction in real time. The commercial temperature grade (0C to +85C) is appropriate for indoor industrial enclosures; for outdoor or uncontrolled-temperature installations, choose the EP2AGX65DF25I5N industrial variant. The Quartus II DSP Builder accelerates fixed-point image-processing kernel development.
推薦
High-Speed Serial Protocol Bridge
The EP2AGX65DF25C5N acts as a multi-protocol serial bridge (e.g., XAUI to SFI, SATA to PCIe, Aurora to custom backplane) because the integrated transceivers can be configured per channel with independent protocol stacks in soft logic. The hard PCI Express Gen2 block can run concurrently with other transceiver channels. The 252 user I/O plus the multi-gigabit transceivers support 4-8 high-speed serial lanes plus parallel sideband GPIO. Per the Arria II GX Transceiver Specification, channels operate from 600 Mbps to 3.75 Gbps with adaptive equalization. Designers should use the Quartus II transceiver toolkit to characterize link margin on each lane.
推薦
Test and Measurement Instrumentation
For protocol analyzers, logic-analyzer backends, and high-speed digitizers, the EP2AGX65DF25C5N provides 5.37 Mbit embedded RAM to capture protocol bursts and 60K logic elements to implement pattern-matching and trigger logic. The 572-ball F25 BGA supports dense PCB layouts with controlled-impedance trace routing to ADC/DAC front-ends. The transceiver channels support triggering and time-stamping inputs from external instruments up to 3.75 Gbps. Quartus II SignalTap II embedded logic analysis accelerates validation. Choose the EP2AGX65DF25I5N industrial variant for laboratory and field-portable instruments operating outside the commercial temperature envelope.
推薦
推薦產品摘要
工程參考資料，適用於 EP2AGX65DF25C5N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2AGX65DF25C5G | EP2AGX65DF25C4N | EP2AGX65DF25C6N | EP2AGX65DF25I5N | EP2AGX45DF25C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-572 (F25, 25 mm) | FBGA-572 (F25, 25 mm) - same | FBGA-572 (F25, 25 mm) - same | FBGA-572 (F25, 25 mm) - same | FBGA-572 (F25, 25 mm) - same | FBGA-572 (F25, 25 mm) - same |
| Speed Grade | 5 (C5) | 5 (C5) | 4 (C4) | 6 (C6) | 5 (I5) | 5 (C5) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Pb-free / RoHS | Pb-free (N suffix) | Pb-free RoHS (G suffix) | Pb-free (N suffix) | Pb-free (N suffix) | Pb-free (N suffix) | Pb-free (N suffix) |
主要差異化特點
- Hardened PCI Express Gen1/Gen2 IP block eliminates soft-logic implementation cost (對比EP2AGX45DF25C5N)
- Faster speed grade 6 variant available for timing-margin-constrained designs (對比EP2AGX65DF25C4N)
- Industrial temperature variant available in same F25 BGA package (對比EP2AGX65DF25C5G (commercial only))
設計說明
The EP2AGX65DF25C5N requires a multi-rail power supply: 0.9 V core (VCC), 1.1 V/1.5 V/2.5 V/3.0 V I/O banks (VCCIO per bank), and separate analog supply rails for the integrated transceivers (VCCA, VCCP, VCCR). The Quartus II PowerPlay power analyzer should be run after place-and-route to size the regulator current budget accurately, because dynamic power scales with toggle rate and design utilization. Decoupling capacitors should follow the reference-board BOM (typically 0402/0201 ceramics placed as close as practical to each supply pin). Power-on sequencing must follow the Arria II GX Device Handbook recommended sequence to avoid permanent latch-up.
Estimated: assuming typical utilization (60% logic, 50% RAM, all transceivers active), worst-case power dissipation for EP2AGX65DF25C5N is approximately 5-8 W. The 25 mm F25 BGA package requires either a substantial PCB thermal copper pour (typically 4-6 layers with thermal vias under the BGA) or a heatsink to keep the junction temperature within the commercial 0C to +85C envelope. Designers should consult the Arria II GX Thermal Management Guide and use the boundary-scan die temperature diode (TDIOT/TDIOB pins) for in-system thermal monitoring.
The 572-ball F25 FineLine BGA at 1.0 mm pitch requires high-layer-count PCB stack-up (typically 8-12 layers) with microvia or laser-drilled via-in-pad for the BGA breakout. Controlled-impedance routing (100 ohm differential for transceivers, 50 ohm single-ended for GPIO clocks) is mandatory. Keep transceiver analog supply and reference-clock traces short and isolated from noisy digital signals. Reference the Arria II GX board design guidelines for stack-up recommendations, decoupling placement, and length-matching requirements for DDR3 memory interfaces.
Common pitfalls include: (1) failing to verify that the chosen Quartus II device library revision matches the silicon revision (PCN rev); (2) ignoring the transceiver reference-clock jitter spec, which can degrade link margin at 3.75 Gbps; (3) leaving the CRC error detect block unconfigured when using hard PCI Express IP; (4) violating the I/O bank VCCIO mix rules (e.g., mixing 1.5 V and 2.5 V on the same bank); (5) overlooking the JTAG pin pull-up requirements during in-system programming. Always validate the design with the Arria II GX board-test system before committing to layout.
合規資訊
RoHS and REACH compliant per Intel/Altera product page; lead-free finish indicated by 'N' suffix in MPN. Halogen-free status not explicitly confirmed in provided data - left as 'unknown'. AEC-Q100 not applicable for FPGAs (commercial/industrial grade logic device).
