EP2AGX65DF25I5N - Arria II GX FPGA, 60K LE, 572-FCBGA | Intel
MPN： EP2AGX65DF25I5N ✓ 啟用中EP2AGX65DF25I5N 概覽
An FPGA is a reprogrammable logic device that combines configurable logic blocks, routing resources, and embedded memory into a single silicon die. Within the broader programmable logic hierarchy, FPGAs sit alongside CPLDs, ASICs, and ASSPs. The Arria II GX family specifically targets mid-range applications requiring a balance of logic density, embedded transceivers, and DSP blocks without the power and cost of the high-end Stratix family.
Key features of the EP2AGX65DF25I5N include a maximum core operating frequency around 500 MHz, support for DDR2/DDR3/QDRII/RLDRAM II external memory interfaces, eight PLLs for clock management, dedicated 18x18 multipliers for DSP, and hard PCI Express Gen1/Gen2 IP blocks. The 0.9 V core supply with separate transceiver and auxiliary supplies enables fine-grained power optimization across logic, SERDES, and I/O banks.
Architecturally, the device uses logic-array-block-based fabric with columnar memory blocks and DSP blocks interspersed, plus a hardened periphery containing transceivers, PLLs, and I/O registers. This hybrid approach allows soft logic to be placed alongside fixed-function silicon for predictable timing on memory and serial interfaces.
Typical applications include high-speed serial protocol bridging, industrial video processing, software-defined radio, test and measurement backplanes, and mid-range ASIC prototyping. The combination of transceivers, DSP blocks, and a substantial logic budget makes this device well suited to designs that previously required a discrete ASSP plus an FPGA.
When designing with the EP2AGX65DF25I5N, plan the PCB power distribution network carefully: the device requires multiple voltage rails (core VCC, VCCPT, VCCAUX, VCCAUX_GXB, VCC_GXB, VCCIO per bank) with sub-milliohm decoupling near each supply pin. Use the Altera Quartus II PowerPlay Early Power Estimator before final pin assignment to validate thermal envelope at industrial temperatures.
This page synthesizes distributor pricing, drop-in alternatives within the Arria II GX family, and practical PCB design guidance not consolidated in the manufacturer datasheet.
直接替換替代品，適用於 EP2AGX65DF25I5N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2AGX65DF25I5N （相同外形與佔位） — 差異在於 Speed Grade, Process Technology, Package, Operating Temperature, Transceivers.
EP2AGX65DF25I5G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX65DF25I3N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX65DF25I3G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX65DF25C6N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX65DF25C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX65DF25I5N 最大額定值與電氣特性
| Device Family | Arria II GX |
| Series | EP2AGX65 |
| Logic Elements (LE) | 60,214 |
| Adaptive Logic Modules (ALMs) | 25,300 |
| LABs/CLBs | 2,530 |
| Total Embedded RAM Bits | 5,371,904 |
| User I/O Pins | 252 |
| 封裝 | 572-ball FC-FBGA |
| Core Voltage | 0.87 V to 0.93 V |
| Process Technology | 40 nm CMOS |
| Maximum Core Frequency | 500 MHz |
| Speed Grade | I5 |
| Temperature Grade | Industrial |
| Transceivers | Up to 12 channels, data rates up to 3.75 Gbps |
| Embedded Multipliers | 18x18 dedicated multipliers |
| PLLs | 8 |
| 安裝類型 | Surface Mount (BGA) |
| Lead Free / RoHS | Lead free, per verified data |
| Ordering Code Suffix | N = lead-free, tray or tape & reel |
EP2AGX65DF25I5N 572-ball fc-fbga 腳位配置指南
EP2AGX65DF25I5N（572-ball fc-fbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2AGX65DF25I5N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2AGX65DF25I5N 適用於 6 應用s: Wireless Baseband / CPRI / OBSAI Bridging, Industrial Video Processing / Machine Vision, Software-Defined Radio (SDR) Platforms, ASIC Prototyping and Emulation, Test and Measurement Instrumentation, PCI Express Endpoint / Industrial I/O Card.
Wireless Baseband / CPRI / OBSAI Bridging
The EP2AGX65DF25I5N's 12 integrated transceivers supporting data rates up to 3.75 Gbps are ideal for CPRI and OBSAI links between baseband units and remote radio heads in 4G LTE and small-cell architectures. With 60,214 logic elements and 312 embedded 18x18 multipliers, the device can implement Layer-1 baseband DSP alongside the serial bridge in a single chip. Industrial temperature rating (-40C to +100C) suits outdoor radio unit enclosures. The 572-FCBGA package fits ATCA and AdvancedMC baseband mezzanines. Typical power consumption at full transceiver utilization falls in the 5-8 W range, manageable with forced-air cooling.
推薦
Industrial Video Processing / Machine Vision
The EP2AGX65DF25I5N pairs 5.37 Mbits of embedded RAM with 252 user I/Os to ingest multiple Camera Link, CoaXPress, or HDMI streams for industrial inspection systems. Its 18x18 multipliers enable real-time image-pipeline operations (filtering, thresholding, edge detection) at full frame rate, while the industrial temperature range supports factory-floor deployment. Designers typically instantiate soft cores for GigE Vision or USB3 Vision protocol stacks and run frame-buffer memory in DDR3. The 500 MHz core frequency sustains 1080p60 processing on a single device.
推薦
Software-Defined Radio (SDR) Platforms
The EP2AGX65DF25I5N is widely deployed in commercial SDR platforms where its transceiver channels up-convert ADC samples to baseband and the FPGA fabric runs channelizers, modulators, and protocol stacks. The 25,300 ALMs and embedded DSP blocks deliver 100+ GMACs of multiply-accumulate throughput suitable for LTE channel bandwidths and IEEE 802.11 modem blocks. Transceivers connect directly to ADC/DAC evaluation modules via FMC HPC connectors. Industrial temp allows ruggedized SDR enclosures for tactical and field-radio applications.
推薦
ASIC Prototyping and Emulation
Mid-volume ASIC designs targeting 100K-300K gates use the EP2AGX65DF25I5N as a prototyping vehicle because its 60,214 logic elements partition well into multi-FPGA emulation when combined with companion Arria II GX devices. Multiple 572-FCBGA devices can be placed on a single prototyping board, sharing clocks and JTAG chains. Embedded transceivers support high-speed chip-to-chip serial links between FPGAs, replacing expensive parallel mezzanine connections. Industrial temperature allows prototype boards to operate in unconditioned labs.
推薦
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol analyzers use the EP2AGX65DF25I5N to handle trigger logic, protocol decoding, and display data pipelines. The 5.37 Mbits of embedded RAM buffer waveform captures while the 12 transceivers feed serialized sample streams from front-end ASICs. Industrial temperature allows bench-top and portable instrument operation. Quartus II design tools support PCI Express hard IP for direct host DMA of acquired data, eliminating a bridge chip on the backplane.
推薦
PCI Express Endpoint / Industrial I/O Card
The EP2AGX65DF25I5N's hard PCI Express Gen1/Gen2 endpoint blocks enable direct root-complex or endpoint connection without an external bridge, ideal for industrial I/O cards, frame grabbers, and DSP accelerator cards. With 60,214 logic elements available, designers can implement custom DMA engines, on-card processing pipelines, and host driver interfaces in the FPGA fabric. The 572-FCBGA package has excellent thermal headroom for sustained DMA workloads; industrial temperature supports unconditioned server rooms.
推薦
推薦產品摘要
工程參考資料，適用於 EP2AGX65DF25I5N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2AGX65DF25I5G | EP2AGX65DF25I3N | EP2AGX65DF25I3G | EP2AGX65DF25C6N | EP2AGX65DF25C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 572-FCBGA (DF25) | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same |
| Logic Elements | 60,214 LE | 60,214 LE | 60,214 LE | 60,214 LE | 60,214 LE | 60,214 LE |
| Speed Grade | I5 | I5 | I3 (faster) | I3 (faster) | C6 (slower, commercial temp) | C5 (commercial temp) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) |
| User I/O | 252 | 252 | 252 | 252 | 252 | 252 |
| Embedded RAM Bits | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 |
| Shipping Medium | Tray (N suffix) | Tape & Reel | Tray | Tape & Reel | Tray | Tray |
主要差異化特點
- Mid-range Arria II GX density with integrated 3.75 Gbps transceivers (對比EP4CGX150DF27I7N (Cyclone IV GX))
- Industrial temperature support in the same 572-FCBGA footprint (對比EP2AGX65DF25C6N (commercial temp))
- Pin-compatible speed-grade migration within I5/I3 (對比EP2AGX65DF25I3N (I3 speed grade))
設計說明
The EP2AGX65DF25I5N requires six distinct voltage rails: 0.9 V VCC (core), 1.5 V VCCPT, 2.5 V VCCAUX, 2.5 V VCCAUX_GXB, 1.1 V VCC_GXB (transceiver), and per-bank VCCIO. Per the Intel Arria II GX pin connection guidelines, place 0402-size 0.1 uF and 0.01 uF ceramic decoupling capacitors within 200 mil of every VCC/VCCAUX/VCCPT ball pair, and provide at least 22 uF of bulk polymer capacitance for every 100 mA of expected transient current. Estimated: a fully-utilized 12-transceiver design draws 6-9 W; design the PDN for 12 W headroom at industrial temperatures.
The 572-FCBGA package relies on thermal vias in the land pattern and a heat spreader attached to the lid for adequate heat removal. Without a heat spreader, the junction-to-ambient thermal resistance (theta_JA) of this package can exceed 20 C/W, causing the device to throttle at industrial temperatures under sustained high-utilization workloads. Estimated: at 8 W dissipation the junction temperature rises approximately 160 C above ambient (8 W x 20 C/W), exceeding the 100 C industrial limit - a forced-air path or heatsink is required.
Use the Intel Arria II GX symbol library and PCB footprint from the Quartus II pin-pad assignment file (.qpf) to ensure the BGA land pattern matches the 1.0 mm pitch of the DF25 package. Stack-up recommendation: 14-layer board with 4-6-4 layer count and matched 100 ohm differential impedance for the transceiver channels routed on inner stripline layers. High-speed transceiver traces must be length-matched within 5 mil pair-to-pair and within 50 mil lane-to-lane.
Transceiver channels on the EP2AGX65DF25I5N require AC-coupled 100 ohm differential routing with AC coupling capacitors of 0.1 uF placed near the receiver side. According to the Intel Arria II GX PCB layout guidelines, length-match the P and N traces within 5 mil and use continuous reference ground planes on adjacent layers; do not route transceiver lanes over power-plane splits or vias that change reference planes. Pre-emphasis and de-emphasis levels should be tuned with the Quartus II Transceiver Toolkit.
Common errors when bringing up the EP2AGX65DF25I5N include leaving VCCIO banks powered before VCC (which can latch-up I/O structures), missing configuration-mode pull-up resistors on MSEL pins, and incomplete JTAG chain termination on TDO. The device powers up with all I/O pins in tri-state; configure the I/O standard via Quartus II before relying on board-level signals. Always run the Quartus II power estimator with realistic activity factors before tape-out, as the published core current is a static estimate.
合規資訊
Lead-free per verified data; AEC-Q100 not applicable to commercial FPGAs; halogen-free and conflict-minerals status not specified in the provided web data and should be requested from the manufacturer for full regulatory disclosure.
