EP2C70F672C6N - Cyclone II FPGA, 68K LE, 672-BGA | Intel/Altera
MPN： EP2C70F672C6N ✗ 停產EP2C70F672C6N 概覽
An FPGA (Field-Programmable Gate Array) is a programmable semiconductor device built from an array of configurable logic blocks (LABs), programmable interconnect, embedded memory, and hard IP such as PLLs and multipliers, all governed by SRAM-based configuration memory. Within the broader semiconductor taxonomy, FPGAs sit between fixed-function ASICs and software-driven microprocessors, delivering hardware-timed parallelism with in-field reconfigurability. The Cyclone II family targets low-cost, high-volume applications using a 90 nm CMOS process, optimizing logic density per dollar.
Key features include 4,276 logic array blocks (LABs), 150 embedded 18x18 multipliers for DSP workloads, and four phase-locked loops (PLLs) for clock synthesis and skew management. The 1,152,000-bit embedded memory is organized in M4K blocks supporting true dual-port, single-port, and FIFO operation modes. The device drives LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards through 422 user I/O pins distributed across eight I/O banks, enabling mixed-voltage interfacing with DDR/DDR2 memories, microprocessors, and high-speed peripherals.
Cyclone II architecture is implemented on a 90 nm low-k dielectric CMOS process with copper interconnect, balancing static power, dynamic performance, and density. Internal configuration is stored in SRAM and loaded from external flash or a configuration controller, supporting in-field updates and rapid design iteration. The 672-ball FineLine BGA package with 1.0 mm ball pitch provides full I/O utilization while remaining manageable with conventional PCB fanout techniques.
Typical applications include industrial motor control, video processing pipelines, low-cost protocol bridging, embedded vision, telecom line cards, and education or hobby prototyping boards. The combination of embedded 18x18 multipliers and significant logic density supports DSP tasks such as FIR filtering and image preprocessing without external DSP devices.
When designing with the EP2C70F672C6N, decide the configuration scheme (AS or JTAG) and clock distribution before PCB layout; the 672-BGA package requires careful fanout with microvia or via-in-pad on lower-layer boards. Decoupling and power estimation must follow the Cyclone II Device Handbook because dynamic power of 68K LEs plus SRAM configuration memory dominates thermal budgeting.
This page synthesizes distributor pricing, Cyclone II drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone - useful for both new designs and legacy EOL substitution.
直接替換替代品，適用於 EP2C70F672C6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2C70F672C6N （相同外形與佔位） — 差異在於 Package, Speed Grade, RoHS Status, Family, Process Technology.
EP2C70F672C7N
✅ 直接替換聯絡詢價
查看資料表 →EP2C70F672C8
✅ 直接替換聯絡詢價
查看資料表 →EP2C70F672C6
✅ 直接替換聯絡詢價
查看資料表 →EP2C70F672I6N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP2C70F672C7N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2C70F672C6N 最大額定值與電氣特性
| Family | Cyclone II |
| Series | EP2C70 |
| Logic Elements | 68,416 |
| Logic Array Blocks (LABs) | 4,276 |
| Total RAM Bits | 1,152,000 |
| Embedded 18x18 Multipliers | 150 |
| PLLs | 4 |
| Maximum User I/O | 422 |
| I/O Banks | 8 |
| 封裝 | 672-ball FBGA, 27x27 mm, 1.0 mm pitch |
| Speed Grade | C6 |
| 工作溫度 | 0C to +85C (commercial) |
| Process Technology | 90 nm low-k CMOS, copper interconnect |
| Configuration Memory | SRAM (volatile) |
| Configuration Schemes | AS, AP, PS, JTAG |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Lead-free (per FBGA marking) |
EP2C70F672C6N 672-ball fbga, 27x27 mm, 1.0 mm pitch 腳位配置指南
EP2C70F672C6N（672-ball fbga, 27x27 mm, 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2C70F672C6N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2C70F672C6N 適用於 6 應用s: Industrial Motor Control, Video Processing Pipeline, Low-Cost Protocol Bridging, Embedded Vision Preprocessing, Telecom Line Card Glue Logic, Education and Hobby Prototyping.
Industrial Motor Control
The EP2C70F672C6N suits industrial motor control drives where the 150 embedded 18x18 multipliers implement Field-Oriented Control (FOC) and Space Vector PWM datapaths with hardware-timed determinism. The 68,416 LEs absorb encoder interfaces, current-loop PI controllers, and protection logic, while four PLLs synthesize the switching-frequency clock from a low-frequency reference. The 672-FBGA package supports the wide 0C to +85C commercial range typical of cabinet-mounted drives with forced-air cooling.
推薦
Video Processing Pipeline
The EP2C70F672C6N handles entry-level video processing such as scaling, deinterlacing, and color-space conversion at standard-definition and lower HD resolutions. The 1,152,000 bits of embedded M4K memory provide line buffers and frame-delay storage, while the 150 multipliers accelerate 2D filter operations. Designers target the C6 speed grade for power-efficient 1080i processing, and the eight I/O banks carry parallel video buses plus DDR2 frame buffers.
推薦
Low-Cost Protocol Bridging
The EP2C70F672C6N bridges industrial and networking protocols such as UART-to-SPI, I2C-to-parallel, or custom bus conversion where the 422 user I/Os connect to multiple heterogeneous peripherals simultaneously. The 68,416 LEs implement state machines and FIFOs for protocol conversion without external logic, while the LVDS-capable I/Os drive backplanes up to several hundred megabits per second. The 672-FBGA footprint suits multi-protocol industrial gateways that must accept many connectors.
推薦
Embedded Vision Preprocessing
The EP2C70F672C6N performs edge-detection, thresholding, and histogram preprocessing at the sensor side of an embedded camera or scanner, offloading these tasks from the host CPU. The 150 18x18 multipliers accelerate convolution kernels, while M4K blocks store kernel coefficients and line memories. The 672-FBGA package supports up to 422 I/Os for parallel sensor interfaces, plus DDR2 frame buffers for downstream consumer SoCs.
推薦
Telecom Line Card Glue Logic
The EP2C70F672C6N provides glue-logic integration on telecom line cards where TDM, HDLC, or custom serial protocols require hardware-timed serialization and framing. The 422 user I/Os aggregate multiple low-speed serial links, and four PLLs derive framing references from system clocks. The 672-FBGA package fits behind backplane connectors with 1.0 mm pitch, which can fan out into 8 I/O banks carrying LVDS or HSTL to adjacent ASICs.
推薦
Education and Hobby Prototyping
The EP2C70F672C6N serves as the main FPGA on university laboratory boards and hobby development kits because the 68K LE capacity lets students run complete RISC-V soft cores plus peripherals on a single chip. The 672-FBGA footprint is large enough to break out dozens of LEDs, switches, and connectors, while the commercial temperature range fits classroom environments. Quartus II Web Edition supports the part free of charge for academic and hobby use.
推薦
推薦產品摘要
工程參考資料，適用於 EP2C70F672C6N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2C70F672C7N | EP2C70F672C8 | EP2C70F672C6 | EP2C70F672I6N | EP2C70F672C7N (lead-free) |
|---|---|---|---|---|---|---|
| Package | 672-FBGA (27x27 mm, 1.0 mm pitch) | 672-FBGA (27x27 mm, 1.0 mm pitch) - same | 672-FBGA (27x27 mm, 1.0 mm pitch) - same | 672-FBGA (27x27 mm, 1.0 mm pitch) - same | 672-FBGA (27x27 mm, 1.0 mm pitch) - same | 672-FBGA (27x27 mm, 1.0 mm pitch) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 68,416 | 68,416 | 68,416 | 68,416 | 68,416 | 68,416 |
| Embedded RAM Bits | 1,152,000 | 1,152,000 | 1,152,000 | 1,152,000 | 1,152,000 | 1,152,000 |
| Maximum User I/O | 422 | 422 | 422 | 422 | 422 | 422 |
| Speed Grade | C6 | C7 (faster) | C8 (slower) | C6 (same) | C6 industrial temp | C7 Pb-free |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C |
| Lead-Free / RoHS | Lead-free (FBGA marking) | Lead-free | Lead-free | Lead (pre-RoHS tray variant) | Lead-free | Lead-free (Pb-free) |
主要差異化特點
- 68K LEs in a commercial-grade Cyclone II family part with 6 second internal clock domains (對比EP2C70F672C7N)
- Identical die and pinout to industrial-temp variant (對比EP2C70F672I6N)
- Largest non-transceiver Cyclone II device with 4 PLLs and 150 multipliers (對比EP2C70F672C8)
設計說明
The 672-FBGA package uses a 1.0 mm ball pitch on a 27x27 mm body, which is at the practical limit of conventional 4-layer PCB fanout with 4 mil trace/space. For dense routing, plan at least 6 layers or adopt microvia (laser-drilled) stackup on the top two layers to escape the inner-row balls. Reference the Cyclone II Device Handbook pin connection guidelines for VCCINT, VCCA, VCCIO, and GND ball assignments before committing the stackup.
Estimated: at typical utilization of 70 percent logic toggling at 100 MHz on 68K LEs plus 4 PLLs and DDR2 interface active, ICCINT draws 1.0 to 1.5 A from a 1.2 V rail. The eight VCCIO banks each carry separate supplies so mixed-voltage interfaces (LVDS/LVCMOS/SSTL) require 4-5 LDO outputs. Decouple each VCCINT ball with a 0.1 uF X7R plus a 10 uF bulk capacitor placed within 100 mil of the ball, per the Cyclone II handbook decoupling diagram.
Do not reuse a Cyclone IV E PCB layout for the Cyclone II EP2C70F672C6N: the 672-FBGA ball maps differ between the two families even though pin count matches. Always verify the specific ordering code's pinout file in Quartus II Pin Planner before sign-off. SRAM-based configuration means the device loses its bitstream on power-down; if the application requires non-volatile configuration, pair the FPGA with an EPCS16/EPCS64 configuration flash.
合規資訊
Lead-free per FBGA part marking per DigiKey listing. AEC-Q100 not applicable for non-automotive commercial/industrial FPGA. REACH and conflict-mineral data not present in verified sources.
