EP2S60F484C4 - Stratix II FPGA, 60K LE, 484-FBGA | Altera / Intel
MPN： EP2S60F484C4 ✗ 停產EP2S60F484C4 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. Unlike an ASIC, the logic function is defined after manufacture via a configuration bitstream. Stratix II belongs to the high-performance end of the Altera FPGA hierarchy: Stratix II > Stratix family > high-density FPGA > programmable logic device > semiconductor IC. Hard IP for memory, DSP, and transceivers is integrated alongside the general-purpose fabric, distinguishing modern FPGAs from older pure-logic arrays.
Key features of the EP2S60F484C4 include 3,022 Logic Array Blocks (LABs), dedicated DSP blocks for high-throughput arithmetic, embedded TriMatrix memory blocks totaling approximately 2.5 Mbit, and Altera's adaptive logic module (ALM) architecture that is 4-input-LUT-based for improved logic packing. The -C4 speed grade targets core speeds around 350-400 MHz for typical designs and is well-suited to DDR/DDR2 memory interfaces and LVDS signaling.
Typical applications include high-performance digital signal processing, telecom line cards, video broadcasting infrastructure, military/aerospace signal processing, and ASIC prototyping. Designers choose this device when high logic density and generous on-chip memory are required but the premium -C5 speed grade or industrial -I temperature range is unnecessary.
A practical design consideration is power and thermal management at high toggle rates: Stratix II FPGAs benefit from intelligent power-aware compilation and proper thermal relief on the FBGA land pattern. Verify that your PCB footprint matches Altera's 484-pin FBGA land pattern exactly, as FBGA packages offer no mechanical compliance margin. This page synthesizes current distributor pricing, drop-in alternatives, and design notes that complement the official datasheet.
直接替換替代品，適用於 EP2S60F484C4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2S60F484C4 （相同外形與佔位） — 差異在於 Speed Grade, Package, Operating Temperature, PLLs, Process Technology.
EP2S60F484C4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S60F484C5
✅ 直接替換聯絡詢價
查看資料表 →EP2S60F484I4
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2S60F484C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2S60F484C3
✅ 直接替換聯絡詢價
查看資料表 →EP2S60F484C4 最大額定值與電氣特性
| Family | Stratix II |
| Logic Elements (LEs) | 60,440 |
| Adaptive Logic Modules (ALMs) | 30,220 |
| Logic Array Blocks (LABs) | 3,022 |
| Embedded Memory (bits) | 2,544,192 |
| Maximum User I/O | 334 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Speed Grade | C4 (commercial, moderate speed) |
| Maximum Internal Frequency | 711.24 MHz (per third-party datasheet listing) |
| 封裝 | 484-ball FBGA (FineLine BGA) |
| 安裝類型 | Surface Mount |
| 工作溫度 | 0C to +85C (commercial, C-grade) |
| Configuration Memory | SRAM-based, volatile (requires external config device) |
EP2S60F484C4 484-ball fbga (fineline bga) 腳位配置指南
EP2S60F484C4（484-ball fbga (fineline bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2S60F484C4.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2S60F484C4 適用於 6 應用s: Telecom Baseband Processing, High-Performance DSP Pipelines, Video Broadcasting Infrastructure, ASIC Prototyping and Emulation, Military / Aerospace Signal Processing, Industrial Control and Automation.
Telecom Baseband Processing
The EP2S60F484C4's 60,440 logic elements and dedicated DSP blocks deliver the arithmetic throughput required for W-CDMA, LTE PHY-layer baseband processing at 100 MHz+ clock rates. Stratix II fabric supports up to 384 18x18 multipliers, enabling efficient FFT and channel-estimation pipelines. The 334 user I/O accommodate wide parallel buses to external ADC/DAC converters and CPRI/OBSAI framer ICs.
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High-Performance DSP Pipelines
The Stratix II DSP block architecture delivers up to 1.5 GMACs per second at C4 speed grade, supporting FIR filters, FFT/iFFT engines, and video codec accelerators. EP2S60F484C4's 2.5 Mbit embedded memory reduces off-chip memory traffic for coefficient storage and data buffering. Designers use it for software-defined radio, radar signal processing, and medical imaging front-ends.
推薦
Video Broadcasting Infrastructure
The 334 user I/O and 2.5 Mbit embedded memory of EP2S60F484C4 make it suitable for SD/HD/3G-SDI video routers, format converters, and broadcast switchers. Stratix II supports LVDS at speeds up to 840 Mbps, sufficient for SDI serial digital interfaces. The dedicated memory blocks enable line/frame buffering without external SDRAM for cost-optimized designs.
推薦
ASIC Prototyping and Emulation
With 60,440 LEs, the EP2S60F484C4 supports partitioning and verification of ASIC RTL before tape-out. Designers map multi-million-gate ASICs across multiple Stratix II FPGAs using TDM or MUX-based pin multiplexing. The C4 speed grade provides timing closure margin for prototype bring-up; industrial-grade EP2S60F484I4 enables prototype verification in extended-temperature environments.
推薦
Military / Aerospace Signal Processing
The industrial-temperature EP2S60F484C4 variant operates across -40C to +100C, making Stratix II FPGAs suitable for ruggedized military signal-processing applications including radar, electronic warfare, and avionics. The 484-FBGA package supports high-density I/O for sensor array interfaces. Designers targeting MIL-STD-810 environments select the -I temperature bin for thermal margin.
推薦
Industrial Control and Automation
The EP2S60F484C4's logic capacity and DSP blocks support multi-axis motion control, PLC logic, and real-time industrial Ethernet protocols. The 334 user I/O accommodate numerous encoder inputs, PWM outputs, and field-bus interfaces. On-chip TriMatrix memory buffers encoder feedback data without external memory; configuration via EPCQ flash supports secure remote firmware updates.
推薦
推薦產品摘要
工程參考資料，適用於 EP2S60F484C4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2S60F484C4N | EP2S60F484C5 | EP2S60F484I4 | EP2S60F484C3N | EP2S60F484C3 |
|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Speed Grade | C4 | C4 | C5 (slower) | I4 (industrial) | C3 (faster) | C3 (faster) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 |
| User I/O | 334 | 334 | 334 | 334 | 334 | 334 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Highest-density Stratix II variant in 484-FBGA (對比EP2S30F484C4)
- Moderate-speed C4 bin balance for power vs. performance (對比EP2S60F484C3N)
- Industrial temperature option available in same package (對比EP2S60F484I4)
設計說明
Stratix II EP2S60F484C4 at 1.2 V core typically draws 1-3 A depending on toggle rate and utilization; design a 4-layer PCB with a dedicated core plane and bulk decoupling within 25 mm of the FBGA. Use the Quartus PowerPlay early power estimator before layout to size regulators. Stratix II is sensitive to core voltage droop; place 100 uF polymer bulk caps near power pins and use 0.1 uF / 0.01 uF ceramic decoupling in a star pattern under the BGA.
Estimated: at 100% utilization and 100 MHz clock, EP2S60F484C4 dissipates approximately 5-8 W. The 484-FBGA package has a typical theta_JA around 18-22 C/W with 4-layer PCB thermal vias; junction temperature at 85C ambient can reach 175-200C. Required: thermal via array under the package center pad, minimum 25 vias at 0.3 mm pitch connecting top to internal ground plane. Active cooling (heatsink + airflow) recommended for >70% utilization designs.
The 484-FBGA uses 1.0 mm ball pitch with 0.5 mm pad diameter; escape routing must use microvia or HDI PCB technology (4-layer 1+2+1 stackup minimum). Match the reference land pattern exactly to Altera's package specification - any deviation risks solder joint reliability issues. Differential pairs (LVDS) require 100 ohm impedance control; single-ended 50 ohm. Reference the Stratix II Handbook Chapter 9 for layout guidelines.
Configuration: Stratix II is SRAM-based and volatile - a configuration device (EPCQ16/EPCQ32/EPCQ64) is required for standalone operation. JTAG pin handling: TMS and TDI need 10 kohm pull-ups to VCCIO of bank; TCK requires a 1 kohm pull-down to prevent spurious configuration. Bank I/O voltage: VCCIO must match connected logic levels; mixing 3.3 V and 1.8 V on different banks requires separate regulator rails.
Place clock inputs (CLK[0..7]) on dedicated clock input pins with shortest possible trace length; use microstrip-stripline controlled impedance. For DDR/DDR2 interfaces, match data, address, and clock trace lengths within +/-25 ps using serpentine routing. Reference the Altera External Memory Interface Handbook for specific topology requirements. Avoid routing signals through BGA via fields without ground return vias.
合規資訊
Stratix II family predates formal RoHS-REACH compliance declarations for many SKUs. EP2S60F484C4N variant is the lead-free / RoHS-compliant option; original EP2S60F484C4 may carry legacy SnPb terminations. AEC-Q100 not applicable for FPGAs. Conflict-minerals status should be verified via Intel's CMRT declaration for the specific date code.