EP2S60F484C4 - Stratix II FPGA, 60K LE, 484-FBGA | Altera / Intel
부품 번호: EP2S60F484C4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1217.67 | $1,217.67 |
| 10 | $1156.79 | $11,567.90 |
| 100 | $1095.9 | $109,590.00 |
| 500 | $1035.02 | $517,510.00 |
| 1,000 | $974.13 | $974,130.00 |
EP2S60F484C4 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. Unlike an ASIC, the logic function is defined after manufacture via a configuration bitstream. Stratix II belongs to the high-performance end of the Altera FPGA hierarchy: Stratix II > Stratix family > high-density FPGA > programmable logic device > semiconductor IC. Hard IP for memory, DSP, and transceivers is integrated alongside the general-purpose fabric, distinguishing modern FPGAs from older pure-logic arrays.
Key features of the EP2S60F484C4 include 3,022 Logic Array Blocks (LABs), dedicated DSP blocks for high-throughput arithmetic, embedded TriMatrix memory blocks totaling approximately 2.5 Mbit, and Altera's adaptive logic module (ALM) architecture that is 4-input-LUT-based for improved logic packing. The -C4 speed grade targets core speeds around 350-400 MHz for typical designs and is well-suited to DDR/DDR2 memory interfaces and LVDS signaling.
Typical applications include high-performance digital signal processing, telecom line cards, video broadcasting infrastructure, military/aerospace signal processing, and ASIC prototyping. Designers choose this device when high logic density and generous on-chip memory are required but the premium -C5 speed grade or industrial -I temperature range is unnecessary.
A practical design consideration is power and thermal management at high toggle rates: Stratix II FPGAs benefit from intelligent power-aware compilation and proper thermal relief on the FBGA land pattern. Verify that your PCB footprint matches Altera's 484-pin FBGA land pattern exactly, as FBGA packages offer no mechanical compliance margin. This page synthesizes current distributor pricing, drop-in alternatives, and design notes that complement the official datasheet.
드롭인 대체품: EP2S60F484C4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S60F484C4 (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Operating Temperature, PLLs, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S60F484C4N
✅ 드롭인✓ 재고 있음
$920 / 개
데이터시트 보기 →EP2S60F484C5
✅ 드롭인✓ 재고 있음
$491.55 / 개
데이터시트 보기 →EP2S60F484I4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$138.4 / 개
데이터시트 보기 →EP2S60F484C3N
✅ 드롭인✓ 재고 있음
$1245.75 / 개
데이터시트 보기 →EP2S60F484C3
✅ 드롭인✓ 재고 있음
$92 / 개
데이터시트 보기 →EP2S60F484C4 최대 정격 & 전기적 특성
| Family | Stratix II |
| Logic Elements (LEs) | 60,440 |
| Adaptive Logic Modules (ALMs) | 30,220 |
| Logic Array Blocks (LABs) | 3,022 |
| Embedded Memory (bits) | 2,544,192 |
| Maximum User I/O | 334 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Speed Grade | C4 (commercial, moderate speed) |
| Maximum Internal Frequency | 711.24 MHz (per third-party datasheet listing) |
| 패키지 | 484-ball FBGA (FineLine BGA) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (commercial, C-grade) |
| Configuration Memory | SRAM-based, volatile (requires external config device) |
EP2S60F484C4 484-ball fbga (fineline bga) 핀 구성 가이드
EP2S60F484C4(484-ball fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S60F484C4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S60F484C4 적합 용도: 6 애플리케이션s: Telecom Baseband Processing, High-Performance DSP Pipelines, Video Broadcasting Infrastructure, ASIC Prototyping and Emulation, Military / Aerospace Signal Processing, Industrial Control and Automation.
Telecom Baseband Processing
The EP2S60F484C4's 60,440 logic elements and dedicated DSP blocks deliver the arithmetic throughput required for W-CDMA, LTE PHY-layer baseband processing at 100 MHz+ clock rates. Stratix II fabric supports up to 384 18x18 multipliers, enabling efficient FFT and channel-estimation pipelines. The 334 user I/O accommodate wide parallel buses to external ADC/DAC converters and CPRI/OBSAI framer ICs.
추천
High-Performance DSP Pipelines
The Stratix II DSP block architecture delivers up to 1.5 GMACs per second at C4 speed grade, supporting FIR filters, FFT/iFFT engines, and video codec accelerators. EP2S60F484C4's 2.5 Mbit embedded memory reduces off-chip memory traffic for coefficient storage and data buffering. Designers use it for software-defined radio, radar signal processing, and medical imaging front-ends.
추천
Video Broadcasting Infrastructure
The 334 user I/O and 2.5 Mbit embedded memory of EP2S60F484C4 make it suitable for SD/HD/3G-SDI video routers, format converters, and broadcast switchers. Stratix II supports LVDS at speeds up to 840 Mbps, sufficient for SDI serial digital interfaces. The dedicated memory blocks enable line/frame buffering without external SDRAM for cost-optimized designs.
추천
ASIC Prototyping and Emulation
With 60,440 LEs, the EP2S60F484C4 supports partitioning and verification of ASIC RTL before tape-out. Designers map multi-million-gate ASICs across multiple Stratix II FPGAs using TDM or MUX-based pin multiplexing. The C4 speed grade provides timing closure margin for prototype bring-up; industrial-grade EP2S60F484I4 enables prototype verification in extended-temperature environments.
추천
Military / Aerospace Signal Processing
The industrial-temperature EP2S60F484C4 variant operates across -40C to +100C, making Stratix II FPGAs suitable for ruggedized military signal-processing applications including radar, electronic warfare, and avionics. The 484-FBGA package supports high-density I/O for sensor array interfaces. Designers targeting MIL-STD-810 environments select the -I temperature bin for thermal margin.
추천
Industrial Control and Automation
The EP2S60F484C4's logic capacity and DSP blocks support multi-axis motion control, PLC logic, and real-time industrial Ethernet protocols. The 334 user I/O accommodate numerous encoder inputs, PWM outputs, and field-bus interfaces. On-chip TriMatrix memory buffers encoder feedback data without external memory; configuration via EPCQ flash supports secure remote firmware updates.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S60F484C4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S60F484C4N | EP2S60F484C5 | EP2S60F484I4 | EP2S60F484C3N | EP2S60F484C3 |
|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Speed Grade | C4 | C4 | C5 (slower) | I4 (industrial) | C3 (faster) | C3 (faster) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 |
| User I/O | 334 | 334 | 334 | 334 | 334 | 334 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest-density Stratix II variant in 484-FBGA (vs EP2S30F484C4)
- Moderate-speed C4 bin balance for power vs. performance (vs EP2S60F484C3N)
- Industrial temperature option available in same package (vs EP2S60F484I4)
설계 노트
Stratix II EP2S60F484C4 at 1.2 V core typically draws 1-3 A depending on toggle rate and utilization; design a 4-layer PCB with a dedicated core plane and bulk decoupling within 25 mm of the FBGA. Use the Quartus PowerPlay early power estimator before layout to size regulators. Stratix II is sensitive to core voltage droop; place 100 uF polymer bulk caps near power pins and use 0.1 uF / 0.01 uF ceramic decoupling in a star pattern under the BGA.
Estimated: at 100% utilization and 100 MHz clock, EP2S60F484C4 dissipates approximately 5-8 W. The 484-FBGA package has a typical theta_JA around 18-22 C/W with 4-layer PCB thermal vias; junction temperature at 85C ambient can reach 175-200C. Required: thermal via array under the package center pad, minimum 25 vias at 0.3 mm pitch connecting top to internal ground plane. Active cooling (heatsink + airflow) recommended for >70% utilization designs.
The 484-FBGA uses 1.0 mm ball pitch with 0.5 mm pad diameter; escape routing must use microvia or HDI PCB technology (4-layer 1+2+1 stackup minimum). Match the reference land pattern exactly to Altera's package specification - any deviation risks solder joint reliability issues. Differential pairs (LVDS) require 100 ohm impedance control; single-ended 50 ohm. Reference the Stratix II Handbook Chapter 9 for layout guidelines.
Configuration: Stratix II is SRAM-based and volatile - a configuration device (EPCQ16/EPCQ32/EPCQ64) is required for standalone operation. JTAG pin handling: TMS and TDI need 10 kohm pull-ups to VCCIO of bank; TCK requires a 1 kohm pull-down to prevent spurious configuration. Bank I/O voltage: VCCIO must match connected logic levels; mixing 3.3 V and 1.8 V on different banks requires separate regulator rails.
Place clock inputs (CLK[0..7]) on dedicated clock input pins with shortest possible trace length; use microstrip-stripline controlled impedance. For DDR/DDR2 interfaces, match data, address, and clock trace lengths within +/-25 ps using serpentine routing. Reference the Altera External Memory Interface Handbook for specific topology requirements. Avoid routing signals through BGA via fields without ground return vias.
규정 준수 정보
Stratix II family predates formal RoHS-REACH compliance declarations for many SKUs. EP2S60F484C4N variant is the lead-free / RoHS-compliant option; original EP2S60F484C4 may carry legacy SnPb terminations. AEC-Q100 not applicable for FPGAs. Conflict-minerals status should be verified via Intel's CMRT declaration for the specific date code.