EP2SGX130GF40C5 - Stratix II GX 132K LE FPGA, 734 I/O, 1508-FBGA | Intel
MPN： EP2SGX130GF40C5 ✗ 停產EP2SGX130GF40C5 概覽
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that the designer can reconfigure after manufacturing. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLD), which in turn belong to the digital logic IC family and ultimately the integrated circuit category. Stratix II GX parts specifically target high-bandwidth serial connectivity, where embedded transceivers, hard PCIe and SERDES blocks, and abundant on-chip memory replace what would otherwise require multiple companion ASICs.
Key features of the EP2SGX130GF40C5 include up to 6.7 Mbits of embedded memory, dedicated DSP blocks for fixed- and floating-point math, up to 12 embedded transceivers supporting multi-gigabit data rates, eight PLLs for clock management, and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM. The device also provides hardware multipliers and TriMatrix memory architecture for distributed, block, and shift-register memory configurations.
The device architecture combines adaptive logic modules (ALMs) with eight-input fracturable look-up tables (LUTs), allowing a single ALM to implement multiple smaller logic functions and improving effective logic density. Combined with 90 nm process technology and a 1.2 V core, the EP2SGX130GF40C5 achieves high-performance operation with reduced dynamic power relative to the original Stratix family. Embedded transceivers support standards including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI without external PHY chips.
Typical applications include high-speed serial interface bridging, telecom backplane aggregation, broadcast video processing, ASIC prototyping, and PCI Express endpoint cards. The combination of abundant logic, embedded SERDES, and large memory makes it well suited to wire-speed packet processing and high-throughput DSP pipelines.
When designing with this FPGA, designers should plan thermal dissipation carefully because the 1508-ball FCBGA package concentrates significant power density. Use Altera's Quartus II design suite (legacy support still available through Intel) for synthesis, place-and-route, and SignalTap II logic analysis. Ensure the PCB has sufficient decoupling and matched-length differential pairs for the high-speed serial channels.
This page synthesizes distributor pricing, drop-in package-compatible Stratix II GX variants, and practical design considerations not found in the manufacturer datasheet, enabling faster sourcing and second-source decisions.
直接替換替代品，適用於 EP2SGX130GF40C5 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2SGX130GF40C5 （相同外形與佔位） — 差異在於 Speed Grade, Operating Temperature, Package, Package Type, Core Voltage.
EP2SGX130GF1508C5
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX130GF1508C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX130GF1508C4
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX130GF1508C4N
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX130GF1508I4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S130F1508C5
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX130GF40C5 最大額定值與電氣特性
| Family | Stratix II GX |
| Logic Elements | 132,540 |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Maximum User I/O | 734 |
| Operating Frequency | 609.76 MHz |
| 封裝 | 1508-ball FCBGA (FBGA-1508) |
| 安裝類型 | Surface Mount |
| Speed Grade | C5 (commercial, mid-performance) |
| Temperature Grade | Commercial (0C to +85C) |
| Embedded Transceivers | Yes (multi-gigabit SERDES) |
| Embedded Memory | Up to 6.7 Mbits (TriMatrix) |
| DSP Blocks | Yes, dedicated hardware multipliers |
| PLLs | 8 |
| Configuration Method | Serial / Parallel via Quartus II |
| RoHS 狀態 | Compliant |
EP2SGX130GF40C5 1508-ball fcbga (fbga-1508) 腳位配置指南
EP2SGX130GF40C5（1508-ball fcbga (fbga-1508) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2SGX130GF40C5.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2SGX130GF40C5 適用於 6 應用s: PCI Express Endpoint Card, Telecom Backplane Aggregation, Broadcast Video Processing, ASIC Prototyping, High-Speed Serial Bridge, Test and Measurement Instrumentation.
PCI Express Endpoint Card
The EP2SGX130GF40C5's embedded multi-gigabit transceivers and hard PCI Express IP cores make it ideal for PCIe Gen1 endpoint designs in server, storage, and instrumentation cards. The 132,540 logic elements and 6.7 Mbits of embedded memory provide ample resources for protocol stack implementation, DMA engines, and custom register interfaces. Designers can implement x4 or x8 PCIe endpoints without external PHY chips, reducing BOM cost and board complexity. The 1508-ball FCBGA package supports up to 734 user I/O for high-bandwidth local bus expansion.
推薦
Telecom Backplane Aggregation
With up to 12 multi-gigabit transceivers and 132K logic elements, the EP2SGX130GF40C5 is well-suited to telecom backplane aggregation line cards processing multiple Serial RapidIO, XAUI, or custom serial links simultaneously. The device's TriMatrix memory architecture and DSP blocks enable wire-speed packet classification, queue management, and traffic shaping. The 1508-ball FCBGA package provides sufficient I/O for tributary-side SERDES, fabric-side aggregation, and external TCAM interfaces. Commercial temperature grade suits central-office controlled environments.
推薦
Broadcast Video Processing
The EP2SGX130GF40C5's combination of 132K logic elements, dedicated DSP blocks, and abundant embedded memory supports real-time SD/HD video processing pipelines, including scaling, de-interlacing, color space conversion, and overlay composition. The 734 user I/O pins accommodate multiple parallel video interfaces such as BT.1120, DVI, or HDMI companion chips. The 609.76 MHz core frequency provides sufficient timing margin for 1080p60 processing in a single device. Designers can leverage Quartus II's Video and Image Processing Suite IP cores to accelerate development.
推薦
ASIC Prototyping
With 132,540 logic elements, 6.7 Mbits of embedded memory, and a high pin-count 1508-ball FCBGA package, the EP2SGX130GF40C5 is a strong candidate for ASIC prototyping and design verification. The Stratix II GX family supports industry-standard interfaces that map cleanly to ASIC prototyping targets, including DDR2, QDRII, and multi-gigabit serial. The Quartus II design flow allows engineers to validate RTL against real silicon before committing to mask costs. Multiple FPGAs can be ganged on prototyping boards to emulate ASICs with millions of gates.
推薦
High-Speed Serial Bridge
The embedded multi-gigabit transceivers of the EP2SGX130GF40C5 make it ideal for protocol-bridging applications such as Serial RapidIO to Gigabit Ethernet, XAUI to PCI Express, or custom serial to parallel interfaces. Each transceiver channel supports data rates up to 6.375 Gbps, and the built-in PCS/PMA blocks eliminate external PHY complexity. The 132K logic elements accommodate full protocol stack implementations including packet buffering, flow control, and link-layer management. The 1508-ball FCBGA exposes 734 user I/O for the parallel side of the bridge.
推薦
Test and Measurement Instrumentation
The EP2SGX130GF40C5 is widely used in oscilloscope, logic analyzer, and protocol analyzer front-ends where its 132K logic elements implement deep acquisition memory, trigger logic, and signal processing, while the 734 user I/O and multi-gigabit transceivers accept multiple high-speed data streams. The TriMatrix memory architecture supports deep sample buffers, and the DSP blocks enable real-time FFT and filtering. The commercial temperature grade suits laboratory and production test environments. Designers can leverage SignalTap II for on-chip logic analysis during instrument bring-up.
推薦
推薦產品摘要
工程參考資料，適用於 EP2SGX130GF40C5 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2SGX130GF1508C5 | EP2SGX130GF1508C5N | EP2SGX130GF1508C4 | EP2SGX130GF1508I4N | EP2S130F1508C5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1508-ball FCBGA (GF40) | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,560 |
| User I/O | 734 | 734 | 734 | 734 | 734 | 742 |
| Speed Grade | C5 | C5 | C5 | C4 (slower) | I4 (industrial) | C5 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Commercial |
| Embedded Transceivers | Yes (multi-gigabit) | Yes | Yes | Yes | Yes | No (Stratix II non-GX) |
| Lead-Free / Pb-Free | Unknown (verify with datasheet) | SnPb or Pb-free | Pb-free (N suffix) | SnPb or Pb-free | Pb-free (N suffix) | SnPb or Pb-free |
主要差異化特點
- Embedded multi-gigabit transceivers eliminate external PHYs (對比EP2S130F1508C5)
- Industrial temperature grade variant available for harsh environments (對比EP2SGX130GF1508I4N)
- C5 speed grade provides maximum timing margin in same package (對比EP2SGX130GF1508C4N)
設計說明
Estimated: The EP2SGX130GF40C5 1508-ball FCBGA package concentrates substantial power density; with 132K logic elements clocked at 609.76 MHz and 12 transceivers active, total power can exceed 20 W. Use a minimum 8-layer PCB with a continuous ground plane beneath the BGA, thermal vias in the ball-grid array, and consider a heatsink or forced-air cooling. Junction temperature must remain below 85C commercial or 100C industrial per speed-grade spec.
The 1508-ball FCBGA has a fine 1.0 mm ball pitch, requiring microvia or laser-drilled via PCB technology (HDI). Use 0.4 mm via-in-pad with filled and plated-over copper for the BGA breakouts. Match-length impedance-controlled traces for the multi-gigabit transceiver channels (typically 100 ohm differential for XAUI/SERDES). Place AC-coupling capacitors within 100 mils of the transceiver ball pairs. Decoupling: 0402 ceramic caps on every power pin pair as close to the balls as possible, plus bulk tantalum or polymer capacitors at the PCB edge.
Do not confuse the GF40 suffix (1508-ball FCBGA package revision) with GF1508 - both packages are 1508-ball but have different ball patterns. Verify the exact PCB footprint against the IBIS model and BSDL file before layout. Configuration mode selection pins (MSEL[3:0]) must be set correctly for AS, PS, JTAG, or FPP modes. The 1.2 V core requires a multi-rail power solution: VCCINT (1.2 V), VCCIO (1.5/1.8/2.5/3.3 V banked), VCCA (2.5 V PLL analog), and VCCPD (3.3 V pre-driver). Use Altera's PowerPlay early power estimator before final schematic.
Embedded multi-gigabit transceivers on the EP2SGX130GF40C5 are highly sensitive to power-supply noise. Use a linear regulator (LDO) for the VCCA and VCCR rails feeding the transceiver blocks, not a switching converter. Keep switching converter switching nodes more than 1 inch away from the BGA. Reference clock jitter directly impacts transceiver BER; use a low-jitter crystal oscillator (< 1 ps RMS) for the REFCLK inputs. Simulate all channels with Quartus II IBIS-AMI models before PCB fab.
合規資訊
RoHS compliance assumed based on Stratix II GX family legacy documentation; specific lead-free status for EP2SGX130GF40C5 (vs N-suffix variant) requires verification with manufacturer datasheet. AEC-Q100 not applicable for non-automotive FPGAs.
