EP2SGX130GF40C5ES - Stratix II GX 132K LC FPGA, FC-FBGA-1508 | Altera
MPN： EP2SGX130GF40C5ES ⚠ 最後購買機會EP2SGX130GF40C5ES 概覽
An FPGA is a programmable logic device whose interconnect and logic resources are configured by the user after manufacture, falling into the broader taxonomy of programmable logic > logic IC > integrated circuit > semiconductor. FPGAs such as the EP2SGX130 are used to implement arbitrary digital state machines, DSP datapaths, bus bridges, and protocol controllers without resorting to custom ASIC silicon, trading per-unit cost for design flexibility and time-to-market. The Stratix II GX family in particular targets high-speed serial connectivity applications by combining general-purpose FPGA fabric with embedded multi-gigabit transceivers.
Key device features for the EP2SGX130 include 132,540 logic elements, 7,047 LABs, embedded transceiver support, a 609.76 MHz internal frequency ceiling, a 1.2 V core, 90 nm process technology, and commercial-extended (0C to 85C) operating temperature grading per the 'C' suffix. The package integrates 1,508 balls on 1 mm pitch in a flip-chip land-grid construction, allowing dense PCB escape routing for high I/O counts. The 'GF40' designator decodes as 'G' for the lead-free, halogen-free Pb-free ball finish, 'F' for flip-chip BGA, and '40' for the 40 mm body size.
The 'Stratix' architecture implements adaptive logic modules (ALMs) rather than classic 4-input LUTs, giving higher effective logic density per tile. The integrated transceiver block supports multiple serial protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI when paired with the appropriate Altera IP core, making the EP2SGX130 a drop-in building block for line cards, baseband processing, and protocol bridge designs. Configuration is loaded via JTAG, passive serial, or active serial configuration schemes supported by the device.
Typical applications include high-speed serial backplane interfaces on telecom line cards, PCIe endpoint and root-complex designs, radar and signal-processing front ends, broadcast video processing engines, and military/aerospace digital signal processing subsystems. The wide -C5 speed bin and commercial-extended temperature grading make it suitable for thermally-controlled industrial enclosures and lab-grade equipment.
When designing with this device, allocate at least 6 PCB layers for power, ground, and signal escape from the 1,508-ball FC-FBGA, and use Altera's Quartus II design suite (v7.2 or later for the Stratix II family) for synthesis, place-and-route, and power estimation. Decoupling follows the Stratix II GX Power Distribution Network (PDN) application note, typically requiring bulk, mid-frequency, and high-frequency ceramics distributed under the die shadow.
This page synthesizes distributor pricing, drop-in Altera/Intel speed-grade and package alternatives, and practical design notes not consolidated on the manufacturer product page.
直接替換替代品，適用於 EP2SGX130GF40C5ES — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2SGX130GF40C5ES （相同外形與佔位） — 差異在於 Package, Speed Grade, DSP Blocks, Mounting Type, RoHS Status.
EP2SGX130GF40C5
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX130GF40C5N
✅ 直接替換📋 參考替代品（不在目錄中）
EP2SGX130GF40C4ES
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX130GF40C4NES
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX130GF40C3ES
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX130GF40C3NES
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX130GF40C4NGB
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX130GF40C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX130GF40C5ES 最大額定值與電氣特性
| Family | Stratix II GX |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 7,047 |
| Internal Frequency (max) | 609.76 MHz |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage (nominal) | 1.2 V |
| Speed Grade | C5 (mid-upper) |
| 工作溫度 | 0C to +85C (Commercial Extended) |
| 封裝 | FC-FBGA-1508 (40 x 40 mm, 1 mm pitch) |
| Ball Count | 1508 |
| Package Type | Flip-Chip Fine-pitch BGA |
| 安裝類型 | Surface Mount |
| Lead-Free / Halogen-Free | Yes (G suffix) |
| RoHS 狀態 | Compliant |
| Configuration Interface | JTAG / Passive Serial / Active Serial |
EP2SGX130GF40C5ES flip-chip fine-pitch bga 腳位配置指南
EP2SGX130GF40C5ES（flip-chip fine-pitch bga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2SGX130GF40C5ES.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2SGX130GF40C5ES 適用於 6 應用s: High-Speed Serial Backplane Interface, PCI Express Endpoint and Bridge, Radar and Signal-Processing Front End, Broadcast Video Processing Engine, Telecom Line Card Aggregation, Industrial Test and Measurement Instrumentation.
High-Speed Serial Backplane Interface
The EP2SGX130GF40C5ES is well-matched to multi-gigabit backplane line cards because its embedded Stratix II GX transceivers support protocols such as XAUI, Serial RapidIO, and PCI Express when paired with the matching Altera IP. The 132,540 logic elements and 7,047 LABs provide ample fabric to implement MAC-layer state machines, buffer management, and PCS bridging alongside the serial interfaces. The 1508-ball FC-FBGA package with 1 mm pitch supports the high pin density required for multiple transceiver channels plus parallel data and clock pins. Compared with a discrete PHY plus ASIC, this part collapses the bill of materials and lets designers tune the digital datapath late in the cycle. Expect 3.125 Gbps class operation with the C5 speed grade and verify the Stratix II GX transceiver reference design for the target protocol stack.
推薦
PCI Express Endpoint and Bridge
The EP2SGX130GF40C5ES is a strong fit for PCI Express endpoint, root-complex, and bridge implementations because Stratix II GX transceivers include a hard PCIe physical layer that supports x1, x4, and x8 lane widths at Gen1 rates when configured with the Altera PCIe IP core. The 132K logic elements are sufficient to add protocol-aware DMA engines, MSI-X interrupt controllers, and user-application logic alongside the PCIe hard IP, while the 609.76 MHz internal frequency headroom enables tight pipeline timing. The 1508-ball FC-FBGA package provides the dedicated reference-clock and per-lane transceiver pins the PCIe block requires, plus generous I/O for parallel local-bus or memory interfaces. Designers should follow the Altera Stratix II GX PCIe x4/x8 reference design for board-level lane polarity and coupling-capacitor recommendations. Power estimation with the Quartus PowerPlay tool is essential because the transceivers dominate budget at PCIe rates.
推薦
Radar and Signal-Processing Front End
The EP2SGX130GF40C5ES is well-suited to radar, electronic-warfare, and baseband signal-processing front ends where 132,540 logic elements plus embedded DSP blocks implement wideband FIR/FFT datapaths at the C5 speed grade. The internal 609.76 MHz headroom, when paired with Stratix II GX DSP block latency, can sustain multi-hundred-MSPS sample rates for channelized receivers. High-speed serial transceivers deliver raw ADC/DAC data to and from the FPGA, and the 1508-ball FC-FBGA enables dense LVDS pairs to interface with leading-edge converters. For phased-array or DBF systems, the fabric also implements beam-steering weights and timing distribution. Use Quartus II TimeQuest with the DSP megafunctions and confirm timing closure against the device's -5 speed bin before tape-out. Thermal analysis at the 40 mm body is critical in sealed enclosures.
推薦
Broadcast Video Processing Engine
The EP2SGX130GF40C5ES fits broadcast video processing because its 132,540 logic elements drive multi-channel SD/HD/3G-SDI pipelines, color-space converters, frame buffers, and on-screen-display compositors. The embedded transceivers accept SDI-over-coax or optical inputs at 270 Mbps, 1.485 Gbps, and 2.97 Gbps standards, while the 1508-ball FC-FBGA breaks out sufficient parallel LVDS pairs for HDMI/DVI or DisplayPort bridges. The C5 speed grade maintains timing margin on the wide memory buses used to drive external DDR2 frame buffers. Compared to ASSPs, the FPGA adapts as broadcast standards evolve and supports per-channel firmware upgrades in the field. Use the Altera Video and Image Processing (VIP) megafunction suite and the SDI reference design for fastest path to working hardware.
推薦
Telecom Line Card Aggregation
The EP2SGX130GF40C5ES is appropriate for telecom line-card aggregation switches where its multi-gigabit transceivers terminate SPI-4.2, SFI-4, or XAUI links while the 132K-logic-element fabric implements packet classification, policing, and queue management. The 1508-ball FC-FBGA on 1 mm pitch allows the dense mixed-signal pin-out that line cards require: many high-speed serial lanes plus a wide external RLDRAM-II or QDR-II SRAM bus for table lookup. The C5 speed grade supports tight scheduling deadlines for cell/packet processing at line rate. Designers should review the Stratix II GX High-Speed Reference Design for board-level transmit pre-emphasis and receive-equalization settings. JTAG-based in-system programming is supported for field upgrades.
推薦
Industrial Test and Measurement Instrumentation
The EP2SGX130GF40C5ES is a strong choice for high-end test-and-measurement instruments such as protocol analyzers, logic-analyzers, and arbitrary-waveform generators because the 132K-logic-element fabric processes and formats captured data at line rate while the embedded transceivers acquire high-speed serial traffic. The 609.76 MHz internal frequency and C5 speed grade sustain real-time triggering and timestamping blocks, and the 1508-ball FC-FBGA exposes sufficient pins for high-channel-count front ends. The commercial-extended 0C to +85C temperature grading is suitable for laboratory and factory-floor environments. Pair with external ADC/DAC companion parts to complete the analog front end, and use the Quartus II SignalTap II logic analyzer for runtime debug. Power-supply decoupling must follow the Stratix II GX PDN application note for clean transceiver operation.
推薦
推薦產品摘要
工程參考資料，適用於 EP2SGX130GF40C5ES — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2SGX130GF40C5 | EP2SGX130GF40C5N | EP2SGX130GF40C4ES | EP2SGX130GF40C4NES | EP2SGX130GF40C3ES | EP2SGX130GF40C3NES |
|---|---|---|---|---|---|---|---|
| Package | FC-FBGA-1508 (40x40 mm) | FC-FBGA-1508 (40x40 mm) - same | FC-FBGA-1508 (40x40 mm) - same | FC-FBGA-1508 (40x40 mm) - same | FC-FBGA-1508 (40x40 mm) - same | FC-FBGA-1508 (40x40 mm) - same | FC-FBGA-1508 (40x40 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | C5 | C5 | C5 | C4 (slower by 1 bin) | C4 (slower by 1 bin) | C3 (slower by 2 bins) | C3 (slower by 2 bins) |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Core Voltage (nominal) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Embedded Transceivers | Yes (Stratix II GX) | Yes | Yes | Yes | Yes | Yes | Yes |
| Lead-Free Finish | Yes (G suffix) | Yes | Yes (N suffix) | Yes | Yes (N suffix) | Yes | Yes (N suffix) |
主要差異化特點
- C5 speed grade offers higher Fmax than C3/C4 bins (對比EP2SGX130GF40C3ES)
- Same-die 1508-ball GF40 land pattern as other Stratix II GX speed grades (對比EP2SGX130GF40C4ES)
- Lead-free, halogen-free 1508-ball finish supports modern RoHS builds (對比EP2SGX130GF40C5N)
設計說明
The 1508-ball FC-FBGA on 1 mm pitch requires a high-layer-count PCB stack-up - plan at least 6 layers (4 signal, 2 ground/power) for fanout, with a 0.4 mm or finer BGA escape via pattern. Follow Altera's Stratix II GX pin connection guidelines to confirm each ball's allowed function, bank voltage tolerance, and reserved-pin treatment before final routing.
The EP2SGX130GF40C5ES requires a multi-rail power distribution network: 1.2 V core, 2.5 V or 3.3 V I/O banks, auxiliary PLL supplies, and dedicated transceiver supply rails. Apply the Stratix II GX Power Distribution Network (PDN) application note, which specifies bulk, mid-frequency, and high-frequency decoupling placement directly under the die shadow. Use PowerPlay early in the Quartus II flow to estimate worst-case current and select the right regulator headroom.
Estimated: at full fabric utilization with active transceivers, the 40x40 mm FC-FBGA can dissipate 10-15 W; verify with PowerPlay numbers and apply a thermal interface material plus heatsink or airflow to keep the junction temperature within the 0C to 85C commercial-extended operating range. Theta_JA values for the 1508-ball FC-FBGA are package-dependent and should be confirmed in the Stratix II GX packaging thermal model.
Estimated: do not assume EP2SGX130GF40C5, EP2SGX130GF40C5N, and EP2SGX130GF40C5ES are interchangeable without checking the Altera ordering-information table - trailing suffixes encode lead-finish, speed-bin, and ES options that may affect programming file compatibility. Also, configuration mode (JTAG vs Passive Serial vs Active Serial) must be set with MSEL pins at board reset; an incorrect MSEL strap prevents configuration.
合規資訊
RoHS-compliant per the G-suffix lead-free ball finish. Halogen-free per the same finish. Not AEC-Q100 qualified - this is a commercial-extended 0C to 85C part.
