EP2SGX90FF1508C3 - Stratix II GX FPGA, 90K LEs, FC-FBGA-1508 | Intel
MPN： EP2SGX90FF1508C3 ✗ 停產EP2SGX90FF1508C3 概覽
A Stratix II GX FPGA is a field-programmable gate array that combines a programmable logic fabric, embedded memory blocks, DSP blocks, and high-speed serial transceivers on a single die. It belongs to the broader semiconductor category of programmable logic devices (PLDs), sitting alongside CPLDs in the hierarchy of reconfigurable digital ICs used for glue logic, prototyping, ASIC replacement, and high-bandwidth signal processing. The Stratix II GX family specifically added embedded transceivers, making it the early-generation platform for serial connectivity in communications, broadcast video, and storage systems.
Key features of the EP2SGX90FF1508C3 include 4,548 LABs, 650 maximum user I/O pins, embedded DSP blocks for high-throughput arithmetic, and high-speed transceivers supporting common multi-gigabit protocols. The 1508-ball FC-FBGA package (40 x 40 mm, 1.0 mm pitch per the verified supplier data) provides the large ball count and signal escape routing needed for both parallel user I/O and serial gigabit links. Stratix II GX devices use SRAM-based configuration, allowing in-system reprogrammability and remote updates via the standard JTAG or passive/active serial configuration paths.
The architecture combines adaptive logic modules (ALMs) with on-chip TriMatrix memory to support wide data paths and deep buffering. The embedded transceivers typically operate at rates suitable for protocols such as PCIe, Serial RapidIO, Gigabit Ethernet, and SONET/SDH, depending on the speed grade and protocol IP used. Designers benefit from Quartus II design tools and a broad IP library, though the family is now considered legacy and newer design starts typically target Stratix IV/V or Cyclone families.
Typical applications include high-speed serial backplane bridging, telecom line cards, broadcast video processing, ASIC prototyping, and military/aerospace signal processing where high logic density and embedded transceivers eliminate companion ASSPs. Industrial imaging systems and medical imaging pipelines also leverage the DSP blocks and memory bandwidth.
When designing with this part, pay close attention to power sequencing across 1.2V core, 2.5V/3.3V auxiliary and VCCIO rails, and the transceiver PLLs. Use the Stratix II GX handbook and pin connection guidelines to constrain unused transceivers, and verify signal-integrity margins on gigabit links with proper PCB stack-up and matched-length routing.
This page synthesizes distributor pricing, Stratix II GX drop-in alternatives, and practical design considerations not found in a single distributor listing, helping engineers evaluate lifecycle risk and second-source options for legacy FPGA designs.
直接替換替代品，適用於 EP2SGX90FF1508C3 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2SGX90FF1508C3 （相同外形與佔位） — 差異在於 Package, Speed Grade, Configuration Method, Operating Temperature Grade, Transceiver Channels.
EP2SGX90FF1508I3
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX90FF1508C4
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX90FF1508C5
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX90FF1508I4N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2SGX130GF1508C3
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2SGX90FF150834N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2SGX90FF1508C3 最大額定值與電氣特性
| Family | Stratix II GX |
| Logic Elements | 90,960 |
| LABs / CLBs | 4,548 |
| Total Memory Bits | 4,520,448 |
| Maximum User I/O | 650 |
| Number of Transceivers | 4 (per family datasheet) |
| Core Voltage | 1.2 V |
| 工作溫度 | 0C to +85C (commercial) |
| Speed Grade | -3 |
| Process Technology | 90 nm CMOS |
| Package Type | 1508-ball FC-FBGA (FBGA-1508) |
| Package Dimensions | 40 x 40 mm |
| Ball Pitch | 1.0 mm |
| 安裝類型 | Surface Mount (Tray) |
| RoHS 狀態 | Compliant |
| Configuration Method | SRAM-based, JTAG / Passive / Active serial |
EP2SGX90FF1508C3 40 x 40 mm 腳位配置指南
EP2SGX90FF1508C3（40 x 40 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2SGX90FF1508C3.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2SGX90FF1508C3 適用於 6 應用s: Telecom Line Card Backplane Bridging, Broadcast Video Processing, ASIC Prototyping and Emulation, Industrial Imaging and Machine Vision, Military and Aerospace Signal Processing, High-Speed Storage Bridge and RAID Controller.
Telecom Line Card Backplane Bridging
The EP2SGX90FF1508C3's 90,960 logic elements and integrated multi-gigabit transceivers make it well suited for telecom line cards that bridge between serial backplanes (PCIe, Serial RapidIO, SONET/SDH) and parallel TDM fabrics. With 4,520,448 embedded memory bits the device can buffer large packet or cell payloads on-chip, reducing external SRAM and simplifying board area. Compared with a discrete ASSP plus glue logic approach, the integrated SERDES lets a single Stratix II GX part implement framer, mapper, and traffic manager functions. Designers should pair the part with proper jitter-cleaning PLLs and follow Stratix II GX PCB guidelines for 100-ohm differential routing and AC coupling on serial links.
推薦
Broadcast Video Processing
Broadcast video systems such as SD/HD/3G-SDI routers, format converters, and multi-viewers rely on the Stratix II GX for high logic density combined with serial digital interface support. The EP2SGX90FF1508C3's 4,548 LABs and DSP blocks allow real-time chroma keying, scaling, and color-space conversion at full broadcast rates, while the embedded transceivers handle SDI, HDMI, and DisplayPort I/O through external PHYs. The 650 user I/O count supports the wide parallel buses typical of broadcast video switch fabrics. Power and thermal design should budget for ~15-20W worst case under full SERDES utilization, with a copper pour and airflow required to keep junction temperatures inside the commercial 0C to +85C range.
推薦
ASIC Prototyping and Emulation
The 90,960 logic elements and abundant routing in the EP2SGX90FF1508C3 make it a popular prototype vehicle for validating ASIC RTL before tape-out, especially for networking and storage ASICs that combine parallel compute with multi-gigabit serial I/O. Quartus II design flows support partitioning large ASICs across multiple FPGAs, and the FC-FBGA-1508 package's 650 user I/O pins expose enough signals to drive inter-board emulation headers. Compared with smaller FPGAs, the 90K logic capacity handles larger SoC subsystems including embedded processors, memory controllers, and high-throughput DMA engines without aggressive synthesis retargeting.
推薦
Industrial Imaging and Machine Vision
Machine vision pipelines such as high-speed line-scan camera interfaces, multi-camera frame grabbers, and real-time image preprocessing benefit from the EP2SGX90FF1508C3's DSP blocks for pixel-rate convolution, thresholding, and color correction. The 4.5 Mbit embedded memory is large enough to buffer full HD lines on-chip, reducing latency versus external DDR accesses. Camera Link, CoaXPress, and GigE Vision interfaces can be implemented using the integrated transceivers plus soft IP. Designers targeting industrial environments must derate to the EP2SGX90FF1508I3 or I4N variant because the C3 commercial temperature grade only supports 0C to +85C.
推薦
Military and Aerospace Signal Processing
Defense signal-processing platforms - radar front-end digitization, electronic-warfare subsystems, and software-defined radio - historically adopted the EP2SGX90FF1508C3 because of its combination of high logic density, integrated transceivers, and Altera's mature Quartus II tool chain for DSP design. The large FC-FBGA-1508 package supports dense pin escape for RF ADC/DAC interfaces such as LVDS and JESD204B (via soft IP). For military temperature grade, designers must qualify the appropriate temperature suffix because the C3 commercial variant only reaches +85C; long-life aerospace programs should confirm Intel/Altera longevity status before committing.
推薦
High-Speed Storage Bridge and RAID Controller
Storage bridges - SAS/SATA expander controllers, RAID engines, and NVMe front-ends - map cleanly onto the EP2SGX90FF1508C3 because the integrated SERDES can run SATA/SAS line rates while the programmable fabric implements command queuing, XOR/RAID parity computation, and host-side protocol translation. The 650 user I/O are sufficient for connecting multiple DDR2/DDR3 channels plus PCIe edge-finger signaling, and the 4.5 Mbit memory pool accelerates on-chip look-up tables used in flash translation layers. Power-sequencing must coordinate 1.2V core, 2.5V/3.3V auxiliary, and VCCIO rails per Stratix II GX guidelines, and the FC-FBGA-1508 PCB layout needs microvia technology for reliable BGA breakout.
推薦
推薦產品摘要
工程參考資料，適用於 EP2SGX90FF1508C3 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2SGX90FF1508I3 | EP2SGX90FF1508C4 | EP2SGX90FF1508C5 | EP2SGX90FF1508I4N | EP2SGX130GF1508C3 | EP2SGX90FF150834N |
|---|---|---|---|---|---|---|---|
| Package | 1508-ball FC-FBGA (40x40 mm) | 1508-ball FC-FBGA (same) | 1508-ball FC-FBGA (same) | 1508-ball FC-FBGA (same) | 1508-ball FC-FBGA (same) | 1508-ball FC-FBGA (same) | 1508-ball FC-FBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -3 (fastest) | -3 (same) | -4 (slower) | -5 (slowest) | -4 (slower) | -3 (same) | -3 (same) |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial | Commercial | Industrial | Commercial | Industrial |
| Logic Elements | 90,960 | 90,960 (same) | 90,960 (same) | 90,960 (same) | 90,960 (same) | 130,000 (~+43%) | 90,960 (same) |
| Embedded Memory Bits | 4,520,448 | 4,520,448 (same) | 4,520,448 (same) | 4,520,448 (same) | 4,520,448 (same) | Higher (~6.7 Mbit family value) | 4,520,448 (same) |
| Transceivers (per family) | Up to 4 multi-gigabit SERDES | Same (up to 4) | Same (up to 4) | Same (up to 4) | Same (up to 4) | Same (up to 4) | Same (up to 4) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Highest performance speed grade of the Stratix II GX FF1508 family (對比EP2SGX90FF1508C4)
- Commercial temperature grade with widest distributor availability at low quantities (對比EP2SGX90FF1508I3)
- Same footprint but lower density than the 130K upgrade (對比EP2SGX130GF1508C3)
- Integrated multi-gigabit transceivers vs non-GX variants (對比EP2S90F1508C3)
設計說明
The 1508-ball FC-FBGA at 1.0 mm pitch requires microvia or via-in-pad PCB technology for reliable breakout; place at least four PCB layers (signal, ground, power, signal) and use a continuous ground plane under the BGA to control impedance on the high-speed SERDES lanes. Match 100-ohm differential routing for all transceiver pairs and follow Altera's Stratix II GX PCB guideline document for length-matching tolerances (typically within 5-10 mils for data pairs).
Sequence the 1.2V VCCINT, 2.5V/3.3V VCCAUX, and VCCIO rails per Stratix II GX power-up guidelines; failure to sequence can cause latch-up or long-term reliability degradation. Estimated: at full SERDES utilization and 90% logic toggling the device may dissipate 15-20W, so a multi-rail power tree with adequate bulk decoupling is required. Use the Altera PowerPlay early-power estimator in Quartus II to budget rails before PCB layout.
Do not mix Stratix II GX FF-package pinouts with EF-package pinouts on the same PCB; the EP2SGX90FF1508C3 (FF) and EP2SGX90EF1508C3 (EF) are different BGA footprints and signal maps. Verify the exact order code with the Stratix II GX pin-out file before tape-out, and confirm transceiver channel count for the chosen speed grade because some packages disable channels to free pins for parallel I/O.
Estimated: at the upper commercial limit of +85C junction and 18W dissipation the FC-FBGA-1508 requires a thermal management strategy. Provide at least a 4-layer board with a copper pour under the BGA and consider forced airflow or a heatsink for production chassis; use the Stratix II GX thermal model document to compute theta-JA for your specific PCB stack-up.
合規資訊
RoHS and lead-free per Altera product page (verified); AEC-Q100 not applicable (FPGAs are not automotive-qualified at this density); conflict-minerals compliance per Altera/Intel CMRT filings.
