EP2SGX90FF1508C3 vs EP2SGX90FF1508C3ES 比較
詳細並排比較 EP2SGX90FF1508C3 由 Intel 與 EP2SGX90FF1508C3ES 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。
Intel
EP2SGX90FF1508C3 - Stratix II GX FPGA, 90K LEs, FC-FBGA-1508 | Intel
EP2SGX90FF1508C3 ObsoleteIntel
EP2SGX90FF1508C3ES - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel
EP2SGX90FF1508C3ES Obsolete規格比較
| 參數 | EP2SGX90FF1508C3 | EP2SGX90FF1508C3ES |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | 90,960 |
| LABs / CLBs | 4,548 | — |
| Total Memory Bits | 4,520,448 | — |
| Maximum User I/O | 650 | — |
| Number of Transceivers | 4 (per family datasheet) | — |
| Core Voltage | 1.2 V | — |
| 工作溫度 | 0C to +85C (commercial) | — |
| Speed Grade | -3 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Package Type | 1508-ball FC-FBGA (FBGA-1508) | — |
| Package Dimensions | 40 x 40 mm | — |
| Ball Pitch | 1.0 mm | — |
| 安裝類型 | Surface Mount (Tray) | Surface Mount |
| RoHS 狀態 | Compliant | [DATA_NEEDED: rohs] |
| Configuration Method | SRAM-based, JTAG / Passive / Active serial | — |
| Logic Array Blocks (LABs) | — | 4,828 |
| Embedded Memory (TriMatrix) | — | 4,520,448 bits |
| Total RAM Bits | — | 4,520,448 |
| Core Supply Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 816.9 MHz |
| DSP Blocks | — | Yes (dedicated multiplier blocks) |
| Embedded Transceivers | — | Up to 3.125 Gbps multi-gigabit transceivers |
| Global Clock Networks | — | Up to 16 |
| Regional Clock Networks | — | Up to 32 per device region |
| 封裝 | — | 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch |
| Configuration Interface | — | JTAG / EPCS serial flash / Passive parallel |
| Operating Temperature Grade | — | Commercial / Industrial (per part suffix) |